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Title: Zero-dimensional to three-dimensional nanojoining: current status and potential applications

Abstract

We report that the continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. Our review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallic materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.

Authors:
 [1];  [2];  [3];  [4];  [5];  [6];  [7]
  1. Beijing Univ. of Technology, Beijing (China). Inst. of Laser Engineering
  2. Beijing Univ. of Technology, Beijing (China). College of Materials Science and Engineering
  3. Univ. of Tennessee, Knoxville, TN (United States). Dept. of Mechanical, Aerospace and Biomedical Engineering
  4. Beijing Univ. of Technology, Beijing (China). School of Mechanical Engineering and Automation
  5. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Computational Science and Engineering Division
  6. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Materials Science and Technology Division
  7. Beijing Univ. of Technology, Beijing (China). Inst. of Laser Engineering; Univ. of Tennessee, Knoxville, TN (United States). Dept. of Mechanical, Aerospace and Biomedical Engineering
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE Laboratory Directed Research and Development (LDRD) Program
OSTI Identifier:
1302935
Grant/Contract Number:  
AC05-00OR22725
Resource Type:
Accepted Manuscript
Journal Name:
RSC Advances
Additional Journal Information:
Journal Volume: 6; Journal Issue: 79; Journal ID: ISSN 2046-2069
Publisher:
Royal Society of Chemistry
Country of Publication:
United States
Language:
English
Subject:
77 NANOSCIENCE AND NANOTECHNOLOGY; 36 MATERIALS SCIENCE; Nanojoining

Citation Formats

Ma, Ying, Li, Hong, Bridges, Denzel, Peng, Peng, Lawrie, Benjamin, Feng, Zhili, and Hu, Anming. Zero-dimensional to three-dimensional nanojoining: current status and potential applications. United States: N. p., 2016. Web. doi:10.1039/C6RA15897H.
Ma, Ying, Li, Hong, Bridges, Denzel, Peng, Peng, Lawrie, Benjamin, Feng, Zhili, & Hu, Anming. Zero-dimensional to three-dimensional nanojoining: current status and potential applications. United States. doi:10.1039/C6RA15897H.
Ma, Ying, Li, Hong, Bridges, Denzel, Peng, Peng, Lawrie, Benjamin, Feng, Zhili, and Hu, Anming. Mon . "Zero-dimensional to three-dimensional nanojoining: current status and potential applications". United States. doi:10.1039/C6RA15897H. https://www.osti.gov/servlets/purl/1302935.
@article{osti_1302935,
title = {Zero-dimensional to three-dimensional nanojoining: current status and potential applications},
author = {Ma, Ying and Li, Hong and Bridges, Denzel and Peng, Peng and Lawrie, Benjamin and Feng, Zhili and Hu, Anming},
abstractNote = {We report that the continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. Our review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallic materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.},
doi = {10.1039/C6RA15897H},
journal = {RSC Advances},
number = 79,
volume = 6,
place = {United States},
year = {2016},
month = {8}
}

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