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Title: LTCC Thick Film Process Characterization

Abstract

Low temperature cofired ceramic (LTCC) technology has proven itself in military/space electronics, wireless communication, microsystems, medical and automotive electronics, and sensors. The use of LTCC for high frequency applications is appealing due to its low losses, design flexibility and packaging and integration capability. Moreover, we summarize the LTCC thick film process including some unconventional process steps such as feature machining in the unfired state and thin film definition of outer layer conductors. The LTCC thick film process was characterized to optimize process yields by focusing on these factors: 1) Print location, 2) Print thickness, 3) Drying of tapes and panels, 4) Shrinkage upon firing, and 5) Via topography. Statistical methods were used to analyze critical process and product characteristics in the determination towards that optimization goal.

Authors:
 [1];  [2];  [2]
  1. National Nuclear Security Administration (NNSA), Kansas City, MO (United States). Kansas City National Security Campus
  2. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1257811
Report Number(s):
SAND2016-4120J
Journal ID: ISSN 2380-4491; 639102
Grant/Contract Number:  
AC04-94AL85000
Resource Type:
Accepted Manuscript
Journal Name:
Additional Conferences (Device Packaging, HiTec, HiTEN & CiCMT)
Additional Journal Information:
Journal Name: Additional Conferences (Device Packaging, HiTec, HiTEN & CiCMT); Journal Volume: 2016; Journal Issue: CICMT; Journal ID: ISSN 2380-4491
Publisher:
IMAPS
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Girardi, M. A., Peterson, K. A., and Vianco, P. T. LTCC Thick Film Process Characterization. United States: N. p., 2016. Web. doi:10.4071/2016cicmt-wp13.
Girardi, M. A., Peterson, K. A., & Vianco, P. T. LTCC Thick Film Process Characterization. United States. doi:10.4071/2016cicmt-wp13.
Girardi, M. A., Peterson, K. A., and Vianco, P. T. Sun . "LTCC Thick Film Process Characterization". United States. doi:10.4071/2016cicmt-wp13. https://www.osti.gov/servlets/purl/1257811.
@article{osti_1257811,
title = {LTCC Thick Film Process Characterization},
author = {Girardi, M. A. and Peterson, K. A. and Vianco, P. T.},
abstractNote = {Low temperature cofired ceramic (LTCC) technology has proven itself in military/space electronics, wireless communication, microsystems, medical and automotive electronics, and sensors. The use of LTCC for high frequency applications is appealing due to its low losses, design flexibility and packaging and integration capability. Moreover, we summarize the LTCC thick film process including some unconventional process steps such as feature machining in the unfired state and thin film definition of outer layer conductors. The LTCC thick film process was characterized to optimize process yields by focusing on these factors: 1) Print location, 2) Print thickness, 3) Drying of tapes and panels, 4) Shrinkage upon firing, and 5) Via topography. Statistical methods were used to analyze critical process and product characteristics in the determination towards that optimization goal.},
doi = {10.4071/2016cicmt-wp13},
journal = {Additional Conferences (Device Packaging, HiTec, HiTEN & CiCMT)},
number = CICMT,
volume = 2016,
place = {United States},
year = {2016},
month = {5}
}

Journal Article:
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