In situ synchrotron study of electromigration induced grain rotations in Sn solder joints
Abstract
Here we report an in situ study of the early stage of microstructure evolution induced by electromigration in a Pb-free β-Sn based solder joint by synchrotron polychromatic X-ray microdiffraction. With this technique, crystal orientation evolution is monitored at intragranular levels with high spatial and angular resolution. During the entire experiment, no crystal growth is detected, and rigid grain rotation is observed only in the two grains within the current crowding region, where high density and divergence of electric current occur. Theoretical calculation indicates that the trend of electrical resistance drop still holds under the present conditions in the grain with high electrical resistivity, while the other grain with low resistivity reorients to align its a-axis more parallel with the ones of its neighboring grains. A detailed study of dislocation densities and subgrain boundaries suggests that grain rotation in β-Sn, unlike grain rotation in high melting temperature metals which undergo displacive deformation, is accomplished via diffusional process mainly, due to the high homologous temperature.
- Authors:
-
- Xi'an Jiaotong Univ. Xi'an, Shaanxi (China)
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). Advanced Light Source (ALS)
- Publication Date:
- Research Org.:
- Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
- Sponsoring Org.:
- USDOE Office of Science (SC), Basic Energy Sciences (BES)
- OSTI Identifier:
- 1256068
- Alternate Identifier(s):
- OSTI ID: 1379287
- Grant/Contract Number:
- AC02-05CH11231
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Scientific Reports
- Additional Journal Information:
- Journal Volume: 6; Journal ID: ISSN 2045-2322
- Publisher:
- Nature Publishing Group
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Shen, Hao, Zhu, Wenxin, Li, Yao, Tamura, Nobumichi, and Chen, Kai. In situ synchrotron study of electromigration induced grain rotations in Sn solder joints. United States: N. p., 2016.
Web. doi:10.1038/srep24418.
Shen, Hao, Zhu, Wenxin, Li, Yao, Tamura, Nobumichi, & Chen, Kai. In situ synchrotron study of electromigration induced grain rotations in Sn solder joints. United States. https://doi.org/10.1038/srep24418
Shen, Hao, Zhu, Wenxin, Li, Yao, Tamura, Nobumichi, and Chen, Kai. Mon .
"In situ synchrotron study of electromigration induced grain rotations in Sn solder joints". United States. https://doi.org/10.1038/srep24418. https://www.osti.gov/servlets/purl/1256068.
@article{osti_1256068,
title = {In situ synchrotron study of electromigration induced grain rotations in Sn solder joints},
author = {Shen, Hao and Zhu, Wenxin and Li, Yao and Tamura, Nobumichi and Chen, Kai},
abstractNote = {Here we report an in situ study of the early stage of microstructure evolution induced by electromigration in a Pb-free β-Sn based solder joint by synchrotron polychromatic X-ray microdiffraction. With this technique, crystal orientation evolution is monitored at intragranular levels with high spatial and angular resolution. During the entire experiment, no crystal growth is detected, and rigid grain rotation is observed only in the two grains within the current crowding region, where high density and divergence of electric current occur. Theoretical calculation indicates that the trend of electrical resistance drop still holds under the present conditions in the grain with high electrical resistivity, while the other grain with low resistivity reorients to align its a-axis more parallel with the ones of its neighboring grains. A detailed study of dislocation densities and subgrain boundaries suggests that grain rotation in β-Sn, unlike grain rotation in high melting temperature metals which undergo displacive deformation, is accomplished via diffusional process mainly, due to the high homologous temperature.},
doi = {10.1038/srep24418},
journal = {Scientific Reports},
number = ,
volume = 6,
place = {United States},
year = {Mon Apr 18 00:00:00 EDT 2016},
month = {Mon Apr 18 00:00:00 EDT 2016}
}
Web of Science
Works referenced in this record:
A look-up table based approach to characterize crystal twinning for synchrotron X-ray Laue microdiffraction scans
journal, April 2015
- Li, Yao; Wan, Liang; Chen, Kai
- Journal of Applied Crystallography, Vol. 48, Issue 3
Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction
journal, July 2008
- Chen, Kai; Tamura, N.; Valek, B. C.
- Journal of Applied Physics, Vol. 104, Issue 1
Theory of diffusion-accommodated grain rotation in columnar polycrystalline microstructures
journal, October 2001
- Moldovan, D.; Wolf, D.; Phillpot, S. R.
- Acta Materialia, Vol. 49, Issue 17
Visualizing size-dependent deformation mechanism transition in Sn
journal, July 2013
- Tian, Lin; Li, Ju; Sun, Jun
- Scientific Reports, Vol. 3, Issue 1
Residual stress preserved in quartz from the San Andreas Fault Observatory at Depth
journal, February 2015
- Chen, K.; Kunz, M.; Tamura, N.
- Geology, Vol. 43, Issue 3
A synchrotron study of microstructure gradient in laser additively formed epitaxial Ni-based superalloy
journal, October 2015
- Xue, Jiawei; Zhang, Anfeng; Li, Yao
- Scientific Reports, Vol. 5, Issue 1
Grain boundary effects on the mechanical properties of bismuth nanostructures
journal, June 2011
- Burek, Michael J.; Jin, Sumin; Leung, Michael C.
- Acta Materialia, Vol. 59, Issue 11
Spontaneous growth mechanism of tin whiskers
journal, June 1998
- Lee, B. -Z.; Lee, D. N.
- Acta Materialia, Vol. 46, Issue 10
Diffusion of , , , and in tin
journal, February 1974
- Huang, F. H.; Huntington, H. B.
- Physical Review B, Vol. 9, Issue 4
Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
journal, May 2008
- Lu, Minhua; Shih, Da-Yuan; Lauro, Paul
- Applied Physics Letters, Vol. 92, Issue 21
Grain rotation in thin films of gold
journal, May 1998
- Harris, K. E.; Singh, V. V.; King, A. H.
- Acta Materialia, Vol. 46, Issue 8
Recent advances on electromigration in very-large-scale-integration of interconnects
journal, November 2003
- Tu, K. N.
- Journal of Applied Physics, Vol. 94, Issue 9
Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction
journal, December 2003
- Choi, W. J.; Lee, T. Y.; Tu, K. N.
- Acta Materialia, Vol. 51, Issue 20
Effect of current crowding on whisker growth at the anode in flip chip solder joints
journal, December 2007
- Ouyang, Fan-Yi; Chen, Kai; Tu, K. N.
- Applied Physics Letters, Vol. 91, Issue 23
Characterization of ion beam irradiated 304 stainless steel utilizing nanoindentation and Laue microdiffraction
journal, March 2015
- Lupinacci, A.; Chen, K.; Li, Y.
- Journal of Nuclear Materials, Vol. 458
A dedicated superbend x-ray microdiffraction beamline for materials, geo-, and environmental sciences at the advanced light source
journal, March 2009
- Kunz, Martin; Tamura, Nobumichi; Chen, Kai
- Review of Scientific Instruments, Vol. 80, Issue 3
Electromigration in thin aluminum films on titanium nitride
journal, April 1976
- Blech, I. A.
- Journal of Applied Physics, Vol. 47, Issue 4, p. 1203-1208
Electromigration-induced grain rotation in anisotropic conducting beta tin
journal, June 2005
- Wu, Albert T.; Gusak, A. M.; Tu, K. N.
- Applied Physics Letters, Vol. 86, Issue 24
Electromigration-induced grain rotation in anisotropic conducting beta tin
journal, June 2005
- Wu, Albert T.; Gusak, A. M.; Tu, K. N.
- Applied Physics Letters, Vol. 86, Issue 24
A dedicated superbend x-ray microdiffraction beamline for materials, geo-, and environmental sciences at the advanced light source
journal, March 2009
- Kunz, Martin; Tamura, Nobumichi; Chen, Kai
- Review of Scientific Instruments, Vol. 80, Issue 3
Current-crowding-induced electromigration failure in flip chip solder joints
journal, January 2002
- Yeh, Everett C. C.; Choi, W. J.; Tu, K. N.
- Applied Physics Letters, Vol. 80, Issue 4
Kinetics and size effect of grain rotations in nanocrystals with rounded triple junctions
journal, November 2009
- Yang, Fan; Yang, Wei
- Scripta Materialia, Vol. 61, Issue 9
A synchrotron study of microstructure gradient in laser additively formed epitaxial Ni-based superalloy
journal, October 2015
- Xue, Jiawei; Zhang, Anfeng; Li, Yao
- Scientific Reports, Vol. 5, Issue 1
Mechanical annealing and source-limited deformation in submicrometre-diameter Ni crystals
journal, December 2007
- Shan, Z. W.; Mishra, Raja K.; Syed Asif, S. A.
- Nature Materials, Vol. 7, Issue 2
Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
journal, September 2004
- Wu, Albert T.; Tu, K. N.; Lloyd, J. R.
- Applied Physics Letters, Vol. 85, Issue 13
Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment
journal, September 2010
- Budiman, A. S.; Hau-Riege, C. S.; Baek, W. C.
- Journal of Electronic Materials, Vol. 39, Issue 11
Dislocations and Grain Size in Electrodeposited Nanocrystalline Ni Determined by the Modified Williamson–Hall and Warren–Averbach Procedures
journal, August 1998
- Ungár, T.; Révész, Á ;.; Borbély, A.
- Journal of Applied Crystallography, Vol. 31, Issue 4
Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment
journal, September 2010
- Budiman, A. S.; Hau-Riege, C. S.; Baek, W. C.
- Journal of Electronic Materials, Vol. 39, Issue 11
Ultrasonic Attenuation at Low Temperatures for Metals in the Normal and Superconducting States
journal, September 1956
- Mason, W. P.; Bömmel, H. E.
- The Journal of the Acoustical Society of America, Vol. 28, Issue 5
Thermomigration in SnPb composite flip chip solder joints
journal, April 2006
- Huang, Annie T.; Gusak, A. M.; Tu, K. N.
- Applied Physics Letters, Vol. 88, Issue 14
Fabrication, microstructure, and mechanical properties of tin nanostructures
journal, July 2011
- Burek, Michael J.; Budiman, Arief Suriadi; Jahed, Zeinab
- Materials Science and Engineering: A, Vol. 528, Issue 18
XMAS: A Versatile Tool for Analyzing Synchrotron X-ray Microdiffraction Data
book, April 2014
- Tamura, Nobumichi
- Strain and Dislocation Gradients from Diffraction
Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing
journal, February 2012
- Shin, Hae-A-Seul; Kim, Byoung-Joon; Kim, Ju-Heon
- Journal of Electronic Materials, Vol. 41, Issue 4
Electromigration-induced plastic deformation in passivated metal lines
journal, November 2002
- Valek, B. C.; Bravman, J. C.; Tamura, N.
- Applied Physics Letters, Vol. 81, Issue 22
In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction
journal, July 2009
- Chen, Kai; Tamura, N.; Kunz, M.
- Journal of Applied Physics, Vol. 106, Issue 2
Characterization of ion beam irradiated 304 stainless steel utilizing nanoindentation and Laue microdiffraction
journal, March 2015
- Lupinacci, A.; Chen, K.; Li, Y.
- Journal of Nuclear Materials, Vol. 458
A synchrotron study of defect and strain inhomogeneity in laser-assisted three-dimensionally-printed Ni-based superalloy
journal, November 2015
- Li, Yao; Qian, Dan; Xue, Jiawei
- Applied Physics Letters, Vol. 107, Issue 18
Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction
journal, June 2006
- Budiman, A. S.; Nix, W. D.; Tamura, N.
- Applied Physics Letters, Vol. 88, Issue 23
Direct observation of twinning in tin lamellae
journal, August 1970
- Tu, K. N.; Turnbull, D.
- Acta Metallurgica, Vol. 18, Issue 8
Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect
journal, May 2003
- Barabash, R. I.; Ice, G. E.; Tamura, N.
- Journal of Applied Physics, Vol. 93, Issue 9
Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
journal, January 2006
- Zhang, Lingyun; Ou, Shengquan; Huang, Joanne
- Applied Physics Letters, Vol. 88, Issue 1
Early stage of plastic deformation in thin films undergoing electromigration
journal, September 2003
- Valek, B. C.; Tamura, N.; Spolenak, R.
- Journal of Applied Physics, Vol. 94, Issue 6
Visualizing size-dependent deformation mechanism transition in Sn
journal, July 2013
- Tian, Lin; Li, Ju; Sun, Jun
- Scientific Reports, Vol. 3, Issue 1
Fabrication, structure and mechanical properties of indium nanopillars
journal, February 2010
- Lee, Gyuhyon; Kim, Ju-Young; Budiman, Arief Suriadi
- Acta Materialia, Vol. 58, Issue 4
High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction
journal, March 2010
- Chen, Kai; Tamura, N.; Tang, Wei
- Journal of Applied Physics, Vol. 107, Issue 6
Works referencing / citing this record:
Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints
journal, December 2017
- Zuo, Yong; Bieler, Thomas R.; Zhou, Quan
- Journal of Electronic Materials, Vol. 47, Issue 3
Statistical study of ductility-dip cracking induced plastic deformation in polycrystalline laser 3D printed Ni-based superalloy
journal, June 2017
- Qian, Dan; Xue, Jiawei; Zhang, Anfeng
- Scientific Reports, Vol. 7, Issue 1