In situ synchrotron study of electromigration induced grain rotations in Sn solder joints

Shen, Hao; Zhu, Wenxin; Li, Yao; Tamura, Nobumichi; Chen, Kai

doi:10.1038/srep24418

Title: In situ synchrotron study of electromigration induced grain rotations in Sn solder joints

Abstract

Here we report an in situ study of the early stage of microstructure evolution induced by electromigration in a Pb-free β-Sn based solder joint by synchrotron polychromatic X-ray microdiffraction. With this technique, crystal orientation evolution is monitored at intragranular levels with high spatial and angular resolution. During the entire experiment, no crystal growth is detected, and rigid grain rotation is observed only in the two grains within the current crowding region, where high density and divergence of electric current occur. Theoretical calculation indicates that the trend of electrical resistance drop still holds under the present conditions in the grain with high electrical resistivity, while the other grain with low resistivity reorients to align its a-axis more parallel with the ones of its neighboring grains. A detailed study of dislocation densities and subgrain boundaries suggests that grain rotation in β-Sn, unlike grain rotation in high melting temperature metals which undergo displacive deformation, is accomplished via diffusional process mainly, due to the high homologous temperature.

Authors:

Shen, Hao ^[1]; Zhu, Wenxin ^[1]; Li, Yao ^[1]; Tamura, Nobumichi ^[2]; Chen, Kai ^[1]

Xi'an Jiaotong Univ. Xi'an, Shaanxi (China)
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). Advanced Light Source (ALS)

Publication Date:: Mon Apr 18 00:00:00 EDT 2016

Research Org.:: Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)

Sponsoring Org.:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

OSTI Identifier:: 1256068

Alternate Identifier(s):: OSTI ID: 1379287

Grant/Contract Number:: AC02-05CH11231

Resource Type:: Accepted Manuscript

Journal Name:: Scientific Reports

Additional Journal Information:: Journal Volume: 6; Journal ID: ISSN 2045-2322

Publisher:: Nature Publishing Group

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE

Citation Formats


                    Shen, Hao, Zhu, Wenxin, Li, Yao, Tamura, Nobumichi, and Chen, Kai. In situ synchrotron study of electromigration induced grain rotations in Sn solder joints.  United States: N. p., 2016. 
Web.  doi:10.1038/srep24418.

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                    Shen, Hao, Zhu, Wenxin, Li, Yao, Tamura, Nobumichi, & Chen, Kai. In situ synchrotron study of electromigration induced grain rotations in Sn solder joints.  United States.  https://doi.org/10.1038/srep24418

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                    Shen, Hao, Zhu, Wenxin, Li, Yao, Tamura, Nobumichi, and Chen, Kai. Mon .  
"In situ synchrotron study of electromigration induced grain rotations in Sn solder joints".  United States.  https://doi.org/10.1038/srep24418.  https://www.osti.gov/servlets/purl/1256068.

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@article{osti_1256068,

  title        = {In situ synchrotron study of electromigration induced grain rotations in Sn solder joints},

  author       = {Shen, Hao and Zhu, Wenxin and Li, Yao and Tamura, Nobumichi and Chen, Kai},

  abstractNote = {Here we report an in situ study of the early stage of microstructure evolution induced by electromigration in a Pb-free β-Sn based solder joint by synchrotron polychromatic X-ray microdiffraction. With this technique, crystal orientation evolution is monitored at intragranular levels with high spatial and angular resolution. During the entire experiment, no crystal growth is detected, and rigid grain rotation is observed only in the two grains within the current crowding region, where high density and divergence of electric current occur. Theoretical calculation indicates that the trend of electrical resistance drop still holds under the present conditions in the grain with high electrical resistivity, while the other grain with low resistivity reorients to align its a-axis more parallel with the ones of its neighboring grains. A detailed study of dislocation densities and subgrain boundaries suggests that grain rotation in β-Sn, unlike grain rotation in high melting temperature metals which undergo displacive deformation, is accomplished via diffusional process mainly, due to the high homologous temperature.},

  doi          = {10.1038/srep24418},

  journal      = {Scientific Reports},

  number       = ,

  volume       = 6,

  place        = {United States},

  year         = {Mon Apr 18 00:00:00 EDT 2016},

  month        = {Mon Apr 18 00:00:00 EDT 2016}

}

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Works referencing / citing this record:

Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints
journal, December 2017

Zuo, Yong; Bieler, Thomas R.; Zhou, Quan
Journal of Electronic Materials, Vol. 47, Issue 3
DOI: 10.1007/s11664-017-5980-0

Statistical study of ductility-dip cracking induced plastic deformation in polycrystalline laser 3D printed Ni-based superalloy
journal, June 2017

Qian, Dan; Xue, Jiawei; Zhang, Anfeng
Scientific Reports, Vol. 7, Issue 1
DOI: 10.1038/s41598-017-03051-x

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Title: In situ synchrotron study of electromigration induced grain rotations in Sn solder joints

Abstract

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Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction journal, July 2008

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Effect of current crowding on whisker growth at the anode in flip chip solder joints journal, December 2007

Characterization of ion beam irradiated 304 stainless steel utilizing nanoindentation and Laue microdiffraction journal, March 2015

A dedicated superbend x-ray microdiffraction beamline for materials, geo-, and environmental sciences at the advanced light source journal, March 2009

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Electromigration-induced grain rotation in anisotropic conducting beta tin journal, June 2005

A dedicated superbend x-ray microdiffraction beamline for materials, geo-, and environmental sciences at the advanced light source journal, March 2009

Current-crowding-induced electromigration failure in flip chip solder joints journal, January 2002

Kinetics and size effect of grain rotations in nanocrystals with rounded triple junctions journal, November 2009

A synchrotron study of microstructure gradient in laser additively formed epitaxial Ni-based superalloy journal, October 2015

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Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction journal, September 2004

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Ultrasonic Attenuation at Low Temperatures for Metals in the Normal and Superconducting States journal, September 1956

Thermomigration in SnPb composite flip chip solder joints journal, April 2006

Fabrication, microstructure, and mechanical properties of tin nanostructures journal, July 2011

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing journal, February 2012

Electromigration-induced plastic deformation in passivated metal lines journal, November 2002

In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction journal, July 2009

Characterization of ion beam irradiated 304 stainless steel utilizing nanoindentation and Laue microdiffraction journal, March 2015

A synchrotron study of defect and strain inhomogeneity in laser-assisted three-dimensionally-printed Ni-based superalloy journal, November 2015

Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction journal, June 2006

Direct observation of twinning in tin lamellae journal, August 1970

Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect journal, May 2003

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints journal, January 2006

Early stage of plastic deformation in thin films undergoing electromigration journal, September 2003

Visualizing size-dependent deformation mechanism transition in Sn journal, July 2013

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High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction journal, March 2010

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Statistical study of ductility-dip cracking induced plastic deformation in polycrystalline laser 3D printed Ni-based superalloy journal, June 2017

A look-up table based approach to characterize crystal twinning for synchrotron X-ray Laue microdiffraction scans
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Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction
journal, July 2008

Visualizing size-dependent deformation mechanism transition in Sn
journal, July 2013

Theory of diffusion-accommodated grain rotation in columnar polycrystalline microstructures
journal, October 2001

Residual stress preserved in quartz from the San Andreas Fault Observatory at Depth
journal, February 2015

A synchrotron study of microstructure gradient in laser additively formed epitaxial Ni-based superalloy
journal, October 2015

Grain boundary effects on the mechanical properties of bismuth nanostructures
journal, June 2011

Spontaneous growth mechanism of tin whiskers
journal, June 1998

Diffusion of ${Sb}^{124}$ , ${Cd}^{109}$ , ${Sn}^{113}$ , and ${Zn}^{65}$ in tin
journal, February 1974

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
journal, May 2008

Grain rotation in thin films of gold
journal, May 1998

Recent advances on electromigration in very-large-scale-integration of interconnects
journal, November 2003

Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction
journal, December 2003

Effect of current crowding on whisker growth at the anode in flip chip solder joints
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Characterization of ion beam irradiated 304 stainless steel utilizing nanoindentation and Laue microdiffraction
journal, March 2015

A dedicated superbend x-ray microdiffraction beamline for materials, geo-, and environmental sciences at the advanced light source
journal, March 2009

Electromigration in thin aluminum films on titanium nitride
journal, April 1976

Electromigration-induced grain rotation in anisotropic conducting beta tin
journal, June 2005

Electromigration-induced grain rotation in anisotropic conducting beta tin
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A dedicated superbend x-ray microdiffraction beamline for materials, geo-, and environmental sciences at the advanced light source
journal, March 2009

Current-crowding-induced electromigration failure in flip chip solder joints
journal, January 2002

Kinetics and size effect of grain rotations in nanocrystals with rounded triple junctions
journal, November 2009

A synchrotron study of microstructure gradient in laser additively formed epitaxial Ni-based superalloy
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Mechanical annealing and source-limited deformation in submicrometre-diameter Ni crystals
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In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction
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Characterization of ion beam irradiated 304 stainless steel utilizing nanoindentation and Laue microdiffraction
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A synchrotron study of defect and strain inhomogeneity in laser-assisted three-dimensionally-printed Ni-based superalloy
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Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction
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Direct observation of twinning in tin lamellae
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Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect
journal, May 2003

Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
journal, January 2006

Early stage of plastic deformation in thin films undergoing electromigration
journal, September 2003

Visualizing size-dependent deformation mechanism transition in Sn
journal, July 2013

Fabrication, structure and mechanical properties of indium nanopillars
journal, February 2010

High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction
journal, March 2010

Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints
journal, December 2017

Statistical study of ductility-dip cracking induced plastic deformation in polycrystalline laser 3D printed Ni-based superalloy
journal, June 2017