DOE PAGES title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Preferential void formation at crystallographically ordered grain boundaries in nanotwinned copper thin films

Abstract

We report nanocrystalline materials are expected to have improved radiation resistance as the high density of grain boundary area is thought to act as an effective sink for radiation-induced defects. However, continued absorption of defects can alter the structure of grain boundaries and/or enhance their mobility, eventually leading to microstructural degradation in the form of grain coarsening, thus negating their initial radiation tolerance. Hence, an ideal microstructure might be one with a mix of boundaries that are effective sinks and limit grain coarsening. We show through in situ electron irradiation experiments, however, that this is an insufficient condition. Our observations indicate that even a high density of low energy coherent twin boundaries, supposedly stabilizing the microstructure against grain coarsening, can be a detriment in that it biases the mobility of vacancies accumulating during irradiation thereby resulting in preferential void nucleation near twin boundaries. These observations highlight the fact that radiation induced grain boundary migration depends greatly on the topology of the grain boundary network and that the migration of high-angle grain boundaries can be hindered when coordinated at triple junctions composed of at least two low-energy boundaries, e.g., coincidence site lattice boundaries.

Authors:
 [1];  [2];  [3];  [1]
  1. Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
  2. Shimane University, Matsue (Japan); Core Research for Evolutional Science and Technology (CREST), Tokyo (Japan)
  3. Osaka University (Japan)
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA); USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division
OSTI Identifier:
1886154
Alternate Identifier(s):
OSTI ID: 1251845
Report Number(s):
LLNL-JRNL-665138
Journal ID: ISSN 1359-6454; 786421
Grant/Contract Number:  
AC52-07NA27344
Resource Type:
Accepted Manuscript
Journal Name:
Acta Materialia
Additional Journal Information:
Journal Volume: 96; Journal Issue: N/A; Journal ID: ISSN 1359-6454
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; grain boundary networks; radiation defects; grain boundary migration; triple junctions

Citation Formats

LaGrange, Thomas, Arakawa, Kazuto, Yasuda, Hidehiro, and Kumar, Mukul. Preferential void formation at crystallographically ordered grain boundaries in nanotwinned copper thin films. United States: N. p., 2015. Web. doi:10.1016/j.actamat.2015.06.015.
LaGrange, Thomas, Arakawa, Kazuto, Yasuda, Hidehiro, & Kumar, Mukul. Preferential void formation at crystallographically ordered grain boundaries in nanotwinned copper thin films. United States. https://doi.org/10.1016/j.actamat.2015.06.015
LaGrange, Thomas, Arakawa, Kazuto, Yasuda, Hidehiro, and Kumar, Mukul. Wed . "Preferential void formation at crystallographically ordered grain boundaries in nanotwinned copper thin films". United States. https://doi.org/10.1016/j.actamat.2015.06.015. https://www.osti.gov/servlets/purl/1886154.
@article{osti_1886154,
title = {Preferential void formation at crystallographically ordered grain boundaries in nanotwinned copper thin films},
author = {LaGrange, Thomas and Arakawa, Kazuto and Yasuda, Hidehiro and Kumar, Mukul},
abstractNote = {We report nanocrystalline materials are expected to have improved radiation resistance as the high density of grain boundary area is thought to act as an effective sink for radiation-induced defects. However, continued absorption of defects can alter the structure of grain boundaries and/or enhance their mobility, eventually leading to microstructural degradation in the form of grain coarsening, thus negating their initial radiation tolerance. Hence, an ideal microstructure might be one with a mix of boundaries that are effective sinks and limit grain coarsening. We show through in situ electron irradiation experiments, however, that this is an insufficient condition. Our observations indicate that even a high density of low energy coherent twin boundaries, supposedly stabilizing the microstructure against grain coarsening, can be a detriment in that it biases the mobility of vacancies accumulating during irradiation thereby resulting in preferential void nucleation near twin boundaries. These observations highlight the fact that radiation induced grain boundary migration depends greatly on the topology of the grain boundary network and that the migration of high-angle grain boundaries can be hindered when coordinated at triple junctions composed of at least two low-energy boundaries, e.g., coincidence site lattice boundaries.},
doi = {10.1016/j.actamat.2015.06.015},
journal = {Acta Materialia},
number = N/A,
volume = 96,
place = {United States},
year = {Wed Jun 24 00:00:00 EDT 2015},
month = {Wed Jun 24 00:00:00 EDT 2015}
}

Journal Article:

Citation Metrics:
Cited by: 11 works
Citation information provided by
Web of Science

Save / Share:

Works referenced in this record:

Effect of grain boundary character on sink efficiency
journal, October 2012


Large-scale production of nano-twinned, ultrafine-grained copper
journal, August 2006

  • Hodge, A. M.; Wang, Y. M.; Barbee, T. W.
  • Materials Science and Engineering: A, Vol. 429, Issue 1-2
  • DOI: 10.1016/j.msea.2006.05.109

Greater tolerance for nuclear materials
journal, September 2008

  • Grimes, Robin W.; Konings, Rudy J. M.; Edwards, Lyndon
  • Nature Materials, Vol. 7, Issue 9
  • DOI: 10.1038/nmat2266

Calculated grain size-dependent vacancy supersaturation and its effect on void formation
journal, April 1974


Efficient Annealing of Radiation Damage Near Grain Boundaries via Interstitial Emission
journal, March 2010


Superplastic Extensibility of Nanocrystalline Copper at Room Temperature
journal, February 2000


Grain boundary motion assisted via radiation cascades in bcc Fe
journal, October 2008


The use of the high voltage electron microscope to simulate fast neutron-induced void swelling in metals
journal, July 1971


Biased diffusion of radiation-produced point defects to interactive sinks
journal, July 1982


Topological view of the thermal stability of nanotwinned copper
journal, January 2013

  • LaGrange, Thomas; Reed, Bryan W.; Wall, Mark
  • Applied Physics Letters, Vol. 102, Issue 1
  • DOI: 10.1063/1.4772589

Voids in irradiated metals (Part I)
journal, May 1972


Grain boundary energy function for fcc metals
journal, February 2014


On the influence of grain boundaries on void growth
journal, December 1973


Classification of crystalline interfaces by means of the O-lattice method
journal, December 1974


Void formation close to stacking fault tetrahedra in heavily electron irradiated pure Ag and Cu
journal, May 1999


Removal of stacking-fault tetrahedra by twin boundaries in nanotwinned metals
journal, January 2013

  • Yu, K. Y.; Bufford, D.; Sun, C.
  • Nature Communications, Vol. 4, Issue 1
  • DOI: 10.1038/ncomms2382

Grain boundary migration during electron irradiation in austenitic stainless steels
journal, August 1985


Heterogeneous void swelling near grain boundaries in irradiated materials
journal, March 2003


Nanoscale growth twins in sputtered metal films
journal, September 2008


Preface to the viewpoint set on grain boundary engineering
journal, March 2006


In situ studies of irradiation-induced twin boundary migration in nanotwinned Ag
journal, September 2013


Effect of grain size on void formation during high-energy electron irradiation of austenitic stainless steel
journal, January 1974

  • Singh, B. N.
  • The Philosophical Magazine: A Journal of Theoretical Experimental and Applied Physics, Vol. 29, Issue 1
  • DOI: 10.1080/14786437408213551

Void swelling in copper and copper alloys irradiated with fission neutrons
journal, September 1992


Void-swelling in cold-worked copper during HVEM irradiation
journal, August 1983


Atomistic observation of radiation-induced grain-boundary movement in Fe-Cr-Ni alloy under electron irradiation
journal, October 2001

  • Sakaguchi, N.; Shibayama, T.; Kinoshita, H.
  • Philosophical Magazine Letters, Vol. 81, Issue 10
  • DOI: 10.1080/09500830110071735

The influence of ∑3 twin boundaries on the formation of radiation-induced defect clusters in nanotwinned Cu
journal, June 2011

  • Demkowicz, Michael J.; Anderoglu, Osman; Zhang, Xinghang
  • Journal of Materials Research, Vol. 26, Issue 14
  • DOI: 10.1557/jmr.2011.56

Thermal stability of sputtered Cu films with nanoscale growth twins
journal, May 2008

  • Anderoglu, O.; Misra, A.; Wang, H.
  • Journal of Applied Physics, Vol. 103, Issue 9
  • DOI: 10.1063/1.2913322

Fracture roughness scaling and its correlation with grain boundary network structure
journal, August 2008


The interactions of self-interstitials with twin boundaries
journal, April 2013


Void Volume Swelling dependent on Grain Size in an Austenitic Stainless Steel
journal, August 1973


Works referencing / citing this record:

Material Parameter Extraction for Complex AlScN Thin Film Using Dual Mode Resonators in Combination with Advanced Microstructural Analysis and Finite Element Modeling
journal, March 2019

  • Parsapour, Fazel; Pashchenko, Vladimir; Kurz, Nicolas
  • Advanced Electronic Materials, Vol. 5, Issue 5
  • DOI: 10.1002/aelm.201800776

Abnormal Grain Growth in AlScN Thin Films Induced by Complexion Formation at Crystallite Interfaces
journal, October 2018

  • Sandu, Cosmin Silviu; Parsapour, Fazel; Mertin, Stefan
  • physica status solidi (a), Vol. 216, Issue 2
  • DOI: 10.1002/pssa.201800569