skip to main content

DOE PAGESDOE PAGES

Title: A metastable phase of tin in 3D integrated circuit solder microbumps

Authors:
; ; ; ;
Publication Date:
Type:
Publisher's Accepted Manuscript
Journal Name:
Scripta Materialia
Additional Journal Information:
Journal Name: Scripta Materialia Journal Volume: 102 Journal Issue: C; Journal ID: ISSN 1359-6462
Publisher:
Elsevier
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
OSTI Identifier:
1251503

Liu, Yingxia, Tamura, Nobumichi, Kim, Dong Wook, Gu, Sam, and Tu, K. N.. A metastable phase of tin in 3D integrated circuit solder microbumps. United States: N. p., Web. doi:10.1016/j.scriptamat.2015.02.009.
Liu, Yingxia, Tamura, Nobumichi, Kim, Dong Wook, Gu, Sam, & Tu, K. N.. A metastable phase of tin in 3D integrated circuit solder microbumps. United States. doi:10.1016/j.scriptamat.2015.02.009.
Liu, Yingxia, Tamura, Nobumichi, Kim, Dong Wook, Gu, Sam, and Tu, K. N.. 2015. "A metastable phase of tin in 3D integrated circuit solder microbumps". United States. doi:10.1016/j.scriptamat.2015.02.009.
@article{osti_1251503,
title = {A metastable phase of tin in 3D integrated circuit solder microbumps},
author = {Liu, Yingxia and Tamura, Nobumichi and Kim, Dong Wook and Gu, Sam and Tu, K. N.},
abstractNote = {},
doi = {10.1016/j.scriptamat.2015.02.009},
journal = {Scripta Materialia},
number = C,
volume = 102,
place = {United States},
year = {2015},
month = {6}
}