Silicon nanomembranes as a means to evaluate stress evolution in deposited thin films
- Authors:
- Publication Date:
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1250230
- Alternate Identifier(s):
- OSTI ID: 1556409
- Grant/Contract Number:
- FG02-03ER46028
- Resource Type:
- Published Article
- Journal Name:
- Extreme Mechanics Letters
- Additional Journal Information:
- Journal Volume: 1; Journal Issue: C; Journal ID: ISSN 2352-4316
- Publisher:
- Elsevier
- Country of Publication:
- Netherlands
- Language:
- English
Citation Formats
Clausen, Anna M., Paskiewicz, Deborah M., Sadeghirad, Alireza, Jakes, Joseph, Savage, Donald E., Stone, Donald S., Liu, Feng, and Lagally, Max G. Silicon nanomembranes as a means to evaluate stress evolution in deposited thin films. Netherlands: N. p., 2014.
Web. doi:10.1016/j.eml.2014.12.003.
Clausen, Anna M., Paskiewicz, Deborah M., Sadeghirad, Alireza, Jakes, Joseph, Savage, Donald E., Stone, Donald S., Liu, Feng, & Lagally, Max G. Silicon nanomembranes as a means to evaluate stress evolution in deposited thin films. Netherlands. https://doi.org/10.1016/j.eml.2014.12.003
Clausen, Anna M., Paskiewicz, Deborah M., Sadeghirad, Alireza, Jakes, Joseph, Savage, Donald E., Stone, Donald S., Liu, Feng, and Lagally, Max G. Mon .
"Silicon nanomembranes as a means to evaluate stress evolution in deposited thin films". Netherlands. https://doi.org/10.1016/j.eml.2014.12.003.
@article{osti_1250230,
title = {Silicon nanomembranes as a means to evaluate stress evolution in deposited thin films},
author = {Clausen, Anna M. and Paskiewicz, Deborah M. and Sadeghirad, Alireza and Jakes, Joseph and Savage, Donald E. and Stone, Donald S. and Liu, Feng and Lagally, Max G.},
abstractNote = {},
doi = {10.1016/j.eml.2014.12.003},
journal = {Extreme Mechanics Letters},
number = C,
volume = 1,
place = {Netherlands},
year = {Mon Dec 01 00:00:00 EST 2014},
month = {Mon Dec 01 00:00:00 EST 2014}
}
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1016/j.eml.2014.12.003
https://doi.org/10.1016/j.eml.2014.12.003
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