Additive manufacturing of hybrid circuits
Abstract
There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. As a result, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.
- Authors:
-
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Publication Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA)
- OSTI Identifier:
- 1247661
- Report Number(s):
- SAND-2016-0248J
Journal ID: ISSN 1531-7331; 618373
- Grant/Contract Number:
- AC04-94AL85000
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Annual Review of Materials Research
- Additional Journal Information:
- Journal Volume: 46; Journal Issue: 1; Journal ID: ISSN 1531-7331
- Publisher:
- Annual Reviews
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Bell, Nelson S., Sarobol, Pylin, Cook, Adam, Clem, Paul G., Keicher, David M., Hirschfeld, Deidre, and Hall, Aaron Christopher. Additive manufacturing of hybrid circuits. United States: N. p., 2016.
Web. doi:10.1146/annurev-matsci-070115-031632.
Bell, Nelson S., Sarobol, Pylin, Cook, Adam, Clem, Paul G., Keicher, David M., Hirschfeld, Deidre, & Hall, Aaron Christopher. Additive manufacturing of hybrid circuits. United States. https://doi.org/10.1146/annurev-matsci-070115-031632
Bell, Nelson S., Sarobol, Pylin, Cook, Adam, Clem, Paul G., Keicher, David M., Hirschfeld, Deidre, and Hall, Aaron Christopher. Sat .
"Additive manufacturing of hybrid circuits". United States. https://doi.org/10.1146/annurev-matsci-070115-031632. https://www.osti.gov/servlets/purl/1247661.
@article{osti_1247661,
title = {Additive manufacturing of hybrid circuits},
author = {Bell, Nelson S. and Sarobol, Pylin and Cook, Adam and Clem, Paul G. and Keicher, David M. and Hirschfeld, Deidre and Hall, Aaron Christopher},
abstractNote = {There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. As a result, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.},
doi = {10.1146/annurev-matsci-070115-031632},
journal = {Annual Review of Materials Research},
number = 1,
volume = 46,
place = {United States},
year = {Sat Mar 26 00:00:00 EDT 2016},
month = {Sat Mar 26 00:00:00 EDT 2016}
}
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Works referenced in this record:
Roll and roll-to-roll process scaling through development of a compact flexo unit for printing of back electrodes
journal, September 2015
- Dam, Henrik F.; Andersen, Thomas R.; Madsen, Morten V.
- Solar Energy Materials and Solar Cells, Vol. 140
Diamond micro engraving of gravure roller mould for roll-to-roll printing of fine line electronics
journal, November 2015
- Zhang, XinQuan; Liu, Kui; Sunappan, Vasudivan
- Journal of Materials Processing Technology, Vol. 225
Scaling and Optimization of Gravure-Printed Silver Nanoparticle Lines for Printed Electronics
journal, March 2010
- Sung, D.; de la Fuente Vornbrock, A.; Subramanian, V.
- IEEE Transactions on Components and Packaging Technologies, Vol. 33, Issue 1
High-Performance Printed Transistors Realized Using Femtoliter Gravure-Printed Sub-10 μm Metallic Nanoparticle Patterns and Highly Uniform Polymer Dielectric and Semiconductor Layers
journal, May 2012
- Kang, Hongki; Kitsomboonloha, Rungrot; Jang, Jaewon
- Advanced Materials, Vol. 24, Issue 22
Cell Filling in Gravure Printing for Printed Electronics
journal, November 2014
- Cen, Jialiang; Kitsomboonloha, Rungrot; Subramanian, Vivek
- Langmuir, Vol. 30, Issue 45
Printing mesoscale architectures
journal, November 2015
- Raney, Jordan R.; Lewis, Jennifer A.
- MRS Bulletin, Vol. 40, Issue 11
Development of sequential build-up multilayer printed wiring boards in Japan
journal, September 2003
- Takagi, K.; Honma, H.; Sasabe, T.
- IEEE Electrical Insulation Magazine, Vol. 19, Issue 5
3D Printing multifunctionality: structures with electronics
journal, March 2014
- Espalin, David; Muse, Danny W.; MacDonald, Eric
- The International Journal of Advanced Manufacturing Technology, Vol. 72, Issue 5-8
Electrohydrodynamic direct-writing
journal, January 2013
- Huang, YongAn; Bu, Ningbin; Duan, Yongqing
- Nanoscale, Vol. 5, Issue 24
Slurry-based additive manufacturing of ceramic parts by selective laser burn-out
journal, March 2015
- Tang, Hwa-Hsing; Yen, Hsiao-Chuan
- Journal of the European Ceramic Society, Vol. 35, Issue 3
From Printed Transistors to Printed Smart Systems
journal, April 2015
- Street, R. A.; Ng, T. N.; Schwartz, D. E.
- Proceedings of the IEEE, Vol. 103, Issue 4
Printed electronics for low-cost electronic systems: Technology status and application development
conference, September 2008
- Subramanian, Vivek; Chang, Josephine B.; de la Fuente Vornbrock, Alejandro
- ESSCIRC 2008 - 34th European Solid-State Circuits Conference
Additive Manufacturing of Ceramics: Issues, Potentialities, and Opportunities
journal, July 2015
- Zocca, Andrea; Colombo, Paolo; Gomes, Cynthia M.
- Journal of the American Ceramic Society, Vol. 98, Issue 7
Nanoinks in inkjet metallization — Evolution of simple additive-type metal patterning
journal, April 2014
- Gysling, Henry J.
- Current Opinion in Colloid & Interface Science, Vol. 19, Issue 2
Room-temperature sintering of conductive Ag films on paper
journal, May 2014
- Huang, Qijin; Shen, Wenfeng; Xu, Qingsong
- Materials Letters, Vol. 123
Current Collecting Grids for ITO-Free Solar Cells
journal, November 2011
- Galagan, Yulia; Zimmermann, Birger; Coenen, Erica W. C.
- Advanced Energy Materials, Vol. 2, Issue 1
Designing colloidal suspensions for directed materials assembly
journal, February 2011
- Conrad, Jacinta C.; Ferreira, Summer R.; Yoshikawa, Jun
- Current Opinion in Colloid & Interface Science, Vol. 16, Issue 1
Synthesis of monodisperse silver nanoparticles for ink-jet printed flexible electronics
journal, September 2011
- Zhang, Zhiliang; Zhang, Xingye; Xin, Zhiqing
- Nanotechnology, Vol. 22, Issue 42
Metal-based Inkjet Inks for Printed Electronics
journal, March 2011
- Kamyshny, Alexander
- The Open Applied Physics Journal, Vol. 4, Issue 1
Coalescence of Silver Nanoparticles at Room Temperature: Unusual Crystal Structure Transformation and Dendrite Formation Induced by Self-Assembly
journal, January 2009
- Grouchko, Michael; Popov, Inna; Uvarov, Vladimir
- Langmuir, Vol. 25, Issue 4
Size and mechanics effects in surface-induced melting of nanoparticles
journal, April 2011
- Levitas, Valery I.; Samani, Kamran
- Nature Communications, Vol. 2, Issue 1
Size-dependent melting of nanoparticles: Hundred years of thermodynamic model
journal, April 2009
- Nanda, K. K.
- Pramana, Vol. 72, Issue 4
Optical detection of melting point depression for silver nanoparticles via in situ real time spectroscopic ellipsometry
journal, January 2012
- Little, S. A.; Begou, T.; Collins, R. W.
- Applied Physics Letters, Vol. 100, Issue 5
Size-dependent melting: Numerical calculations of the phonon spectrum
journal, March 2009
- Kang, Kai; Qin, Shaojing; Wang, Chuilin
- Physica E: Low-dimensional Systems and Nanostructures, Vol. 41, Issue 5
Liquid-like pseudoelasticity of sub-10-nm crystalline silver particles
journal, October 2014
- Sun, Jun; He, Longbing; Lo, Yu-Chieh
- Nature Materials, Vol. 13, Issue 11
Liquidlike sintering behavior of nanometric Fe and Cu powders: Experimental approach
journal, December 1998
- Dominguez, O.; Champion, Y.; Bigot, J.
- Metallurgical and Materials Transactions A, Vol. 29, Issue 12
Tin Nanoparticle-Based Solder Paste for Low Temperature Processing
journal, October 2013
- Diaz, Alfredo J.; Ma, David; Zinn, Alfred
- Journal of Microelectronics and Electronic Packaging, Vol. 10, Issue 4
Substrate effect on the melting temperature of gold nanoparticles
journal, June 2012
- Luo, Wenhua; Su, Kalin; Li, Kemin
- The Journal of Chemical Physics, Vol. 136, Issue 23
Direct fabrication of electrically functional microstructures by fully voltage-controlled electrohydrodynamic jet printing of silver nano-ink
journal, May 2010
- Wang, Ke; Stark, John P. W.
- Applied Physics A, Vol. 99, Issue 4
Inkjet printing as a deposition and patterning tool for polymers and inorganic particles
journal, January 2008
- Tekin, Emine; Smith, Patrick J.; Schubert, Ulrich S.
- Soft Matter, Vol. 4, Issue 4
Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing
journal, January 2015
- Seifert, Tobias; Sowade, Enrico; Roscher, Frank
- Industrial & Engineering Chemistry Research, Vol. 54, Issue 2
Thermal decomposition as route for silver nanoparticles
journal, November 2006
- Navaladian, S.; Viswanathan, B.; Viswanath, R. P.
- Nanoscale Research Letters, Vol. 2, Issue 1
Thermal behavior of direct-printed lines of silver nanoparticles
journal, December 2006
- Park, Jin-Woo; Baek, Seong-Gu
- Scripta Materialia, Vol. 55, Issue 12
Inkjet printing of conductive Ag lines and their electrical and mechanical characterization
journal, September 2010
- Lee, Dong Jun; Oh, Je Hoon
- Thin Solid Films, Vol. 518, Issue 22
Low temperature sintering of Ag nanoparticles for flexible electronics packaging
journal, October 2010
- Hu, A.; Guo, J. Y.; Alarifi, H.
- Applied Physics Letters, Vol. 97, Issue 15
Direct writing of copper conductive patterns by ink-jet printing
journal, July 2007
- Park, Bong Kyun; Kim, Dongjo; Jeong, Sunho
- Thin Solid Films, Vol. 515, Issue 19
Inkjet printed electronics for multifunctional composite structure
journal, June 2009
- Kim, Hak Sung; Kang, Jin Sung; Park, Jong Se
- Composites Science and Technology, Vol. 69, Issue 7-8
Controlling the Thickness of the Surface Oxide Layer on Cu Nanoparticles for the Fabrication of Conductive Structures by Ink-Jet Printing
journal, March 2008
- Jeong, Sunho; Woo, Kyoohee; Kim, Dongjo
- Advanced Functional Materials, Vol. 18, Issue 5
Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability
journal, September 2010
- Magdassi, Shlomo; Grouchko, Michael; Kamyshny, Alexander
- Materials, Vol. 3, Issue 9
Effect of Carboxylic Acid on Sintering of Inkjet-Printed Copper Nanoparticulate Films
journal, June 2011
- Woo, Kyoohee; Kim, Youngwoo; Lee, Byungyoon
- ACS Applied Materials & Interfaces, Vol. 3, Issue 7
Copper Nanoparticles: Aqueous Phase Synthesis and Conductive Films Fabrication at Low Sintering Temperature
journal, March 2013
- Deng, Dunying; Jin, Yunxia; Cheng, Yuanrong
- ACS Applied Materials & Interfaces, Vol. 5, Issue 9
Electrical sintering of nanoparticle structures
journal, March 2008
- Allen, Mark L.; Aronniemi, Mikko; Mattila, Tomi
- Nanotechnology, Vol. 19, Issue 17
Ink-jet Printing and Microwave Sintering of Conductive Silver Tracks
journal, August 2006
- Perelaer, J.; de Gans, B. -J.; Schubert, U. S.
- Advanced Materials, Vol. 18, Issue 16
Experimental study of the impact of an ink-jet printed droplet on a solid substrate
journal, August 2004
- van Dam, Dirkjan B.; Le Clerc, Christophe
- Physics of Fluids, Vol. 16, Issue 9
Limits to feature size and resolution in ink jet printing
journal, March 2009
- Stringer, J.; Derby, B.
- Journal of the European Ceramic Society, Vol. 29, Issue 5
Ink-Jet Printing of Zirconia: Coffee Staining and Line Stability
journal, July 2011
- Dou, Rui; Wang, Tianming; Guo, Yunshan
- Journal of the American Ceramic Society, Vol. 94, Issue 11
Control of Colloidal Particle Deposit Patterns within Picoliter Droplets Ejected by Ink-Jet Printing
journal, April 2006
- Park, Jungho; Moon, Jooho
- Langmuir, Vol. 22, Issue 8
Direct writing of silver conductive patterns: Improvement of film morphology and conductance by controlling solvent compositions
journal, December 2006
- Kim, Dongjo; Jeong, Sunho; Park, Bong Kyun
- Applied Physics Letters, Vol. 89, Issue 26
Inkjet Printing of Well-Defined Polymer Dots and Arrays
journal, August 2004
- de Gans, Berend-Jan; Schubert, Ulrich S.
- Langmuir, Vol. 20, Issue 18
Preserving Precision of Inkjet-Printed Features with Solvents of Different Volatilities
journal, August 2013
- Lin, Jeng-Lung; Kao, Zhen-Kai; Liao, Ying-Chih
- Langmuir, Vol. 29, Issue 36
Controllable synthesis and sintering of silver nanoparticles for inkjet-printed flexible electronics
journal, November 2015
- Zhang, Zhiliang; Zhu, Weiyue
- Journal of Alloys and Compounds, Vol. 649
Advanced Package Prototyping Using Nano-Particle Silver Printed Interconnects
journal, April 2010
- Joo, Sungchul; Baldwin, Daniel F.
- IEEE Transactions on Electronics Packaging Manufacturing, Vol. 33, Issue 2
Sintering of Alkanethiol-Capped Gold and Platinum Nanoclusters
journal, December 2002
- Martin, James E.; Odinek, Judy; Wilcoxon, Jess P.
- The Journal of Physical Chemistry B, Vol. 107, Issue 2
Selective laser sintering of Ag nanoparticles ink for applications in flexible electronics
journal, May 2015
- Theodorakos, I.; Zacharatos, F.; Geremia, R.
- Applied Surface Science, Vol. 336
Excimer laser sintering of indium tin oxide nanoparticles for fabricating thin films of variable thickness on flexible substrates
journal, March 2015
- Park, Taesoon; Kim, Dongsik
- Thin Solid Films, Vol. 578
Photosintering and electrical performance of CuO nanoparticle inks
journal, August 2014
- Paquet, Chantal; James, Robert; Kell, Arnold J.
- Organic Electronics, Vol. 15, Issue 8
Flash light sintering of nickel nanoparticles for printed electronics
journal, January 2014
- Park, Sung-Hyeon; Kim, Hak-Sung
- Thin Solid Films, Vol. 550
Photonic curing of sol–gel derived HfO2 dielectrics for organic field-effect transistors
journal, December 2014
- Tetzner, Kornelius; Schroder, Kurt A.; Bock, Karlheinz
- Ceramics International, Vol. 40, Issue 10
Inkjet-printed copper electrodes using photonic sintering and their application to organic thin-film transistors
journal, October 2015
- Norita, Shohei; Kumaki, Daisuke; Kobayashi, Yu
- Organic Electronics, Vol. 25
Instant electrode fabrication on carbon-fiber-reinforced plastic structures using metal nano-ink via flash light sintering for smart sensing
journal, July 2015
- Takahashi, Kosuke; Namiki, Kensuke; Fujimura, Takahiro
- Composites Part B: Engineering, Vol. 76
Femtosecond laser three-dimensional micro- and nanofabrication
journal, December 2014
- Sugioka, Koji; Cheng, Ya
- Applied Physics Reviews, Vol. 1, Issue 4
Ink-jet printing and camera flash sintering of silver tracks on different substrates
journal, November 2010
- Yung, K. C.; Gu, X.; Lee, C. P.
- Journal of Materials Processing Technology, Vol. 210, Issue 15
Multi-pulsed white light sintering of printed Cu nanoinks
journal, September 2011
- Han, Won-Suk; Hong, Jae-Min; Kim, Hak-Sung
- Nanotechnology, Vol. 22, Issue 39
In situ monitoring of flash-light sintering of copper nanoparticle ink for printed electronics
journal, November 2012
- Hwang, Hyun-Jun; Chung, Wan-Ho; Kim, Hak-Sung
- Nanotechnology, Vol. 23, Issue 48
In situmonitoring of a flash light sintering process using silver nano-ink for producing flexible electronics
journal, December 2012
- Chung, Wan-Ho; Hwang, Hyun-Jun; Lee, Seung-Hyun
- Nanotechnology, Vol. 24, Issue 3
Polycrystalline silicon foils by flash lamp annealing of spray-coated silicon nanoparticle dispersions
journal, June 2015
- Büchter, B.; Seidel, F.; Fritzsche, R.
- Journal of Materials Science, Vol. 50, Issue 18
Thermal Spray Applications in Electronics and Sensors: Past, Present, and Future
journal, February 2010
- Sampath, Sanjay
- Journal of Thermal Spray Technology, Vol. 19, Issue 5
Sensors for Harsh Environments by Direct-Write Thermal Spray
journal, February 2004
- Longtin, J.; Sampath, S.; Tankiewicz, S.
- IEEE Sensors Journal, Vol. 4, Issue 1
Spinel humidity sensors prepared by thermal spray direct writing
journal, May 2005
- Ahn, Kipyung; Wessels, Bruce W.; Sampath, Sanjay
- Sensors and Actuators B: Chemical, Vol. 107, Issue 1
The magnetic properties of plasma-sprayed thick-film manganese zinc ferrite (MZF) and nickel iron alloy (Permalloy) composites
journal, April 2006
- Liang, S.; Gambino, R. J.; Sampath, S.
- Journal of Applied Physics, Vol. 99, Issue 8
Room Temperature Impact Consolidation (RTIC) of Fine Ceramic Powder by Aerosol Deposition Method and Applications to Microdevices
journal, March 2008
- Akedo, Jun
- Journal of Thermal Spray Technology, Vol. 17, Issue 2
Aerosol deposition for post-LTCC
journal, January 2007
- Imanaka, Yoshihiko; Hayashi, Nobuyuki; Takenouchi, Masatoshi
- Journal of the European Ceramic Society, Vol. 27, Issue 8-9
Magnetic properties and microwave characteristics of Ni–Zn–Cu ferrite film fabricated by aerosol deposition method
journal, April 2005
- Kagotani, T.; Kobayashi, R.; Sugimoto, S.
- Journal of Magnetism and Magnetic Materials, Vol. 290-291
Aerosol Deposition of Ceramic Thick Films at Room Temperature: Densification Mechanism of Ceramic Layers
journal, June 2006
- Akedo, Jun
- Journal of the American Ceramic Society, Vol. 89, Issue 6
Aerosol Deposition Method for Fabrication of Nano Crystal Ceramic Layer
journal, March 2004
- Akedo, Jun
- Materials Science Forum, Vol. 449-452
Powder preparation for 0.5 Pb(Ni1/3Nb2/3)O3–0.15 PbZrO3–0.35PbTiO3 thick films by the aerosol deposition method
journal, February 2005
- Kawakami, Y.; Yoshikawa, H.; Komagata, K.
- Journal of Crystal Growth, Vol. 275, Issue 1-2
Piezoelectric properties and poling effect of Pb(Zr, Ti)O3 thick films prepared for microactuators by aerosol deposition
journal, September 2000
- Akedo, J.; Lebedev, M.
- Applied Physics Letters, Vol. 77, Issue 11
Aerosol Codeposition of Ceramics: Mixtures of Bi 2 O 3 -TiO 2 and Bi 2 O 3 -V 2 O 5
journal, December 2014
- Exner, Jörg; Fuierer, Paul; Moos, Ralf
- Journal of the American Ceramic Society, Vol. 98, Issue 3
Effect of applied field during aerosol deposition on the anisotropy of Sm–Fe–N thick films
journal, April 2005
- Sugimoto, S.; Maki, T.; Kagotani, T.
- Journal of Magnetism and Magnetic Materials, Vol. 290-291
PLZT films prepared by aerosol deposition and their birefringence evaluation
journal, January 2007
- Yamaguchi, Takashi; Shin, Kwang-Ho; Lim, Pang-Boey
- IEEJ Transactions on Electrical and Electronic Engineering, Vol. 2, Issue 4
Characterization of as-deposited and sintered yttrium iron garnet thick films formed by aerosol deposition
journal, February 2014
- Johnson, Scooter D.; Glaser, Evan R.; Cheng, Shu-Fan
- Applied Physics Express, Vol. 7, Issue 3
Deposition mechanism of dry sprayed ceramic particles at room temperature using a nano-particle deposition system
journal, April 2011
- Chun, Doo-Man; Ahn, Sung-Hoon
- Acta Materialia, Vol. 59, Issue 7
Shock-induced plasticity and fragmentation phenomena during alumina deposition in the vacuum kinetic spraying process
journal, April 2015
- Park, Hyungkwon; Kwon, Juhyuk; Lee, Illjoo
- Scripta Materialia, Vol. 100
Nanoparticulated Dense and Stress-Free Ceramic Thick Film for Material Integration: Nanoparticulated Ceramic Film for Material Integration
journal, September 2013
- Imanaka, Yoshihiko; Amada, Hideyuki; Kumasaka, Fumiaki
- Advanced Engineering Materials, Vol. 15, Issue 11
Powder Preparation in Aerosol Deposition Method for Lead Zirconate Titanate Thick Films
journal, November 2002
- Akedo, Jun; Lebedev, Maxim
- Japanese Journal of Applied Physics, Vol. 41, Issue Part 1, No. 11B
Room Temperature Deformation Mechanisms of Alumina Particles Observed from In Situ Micro-compression and Atomistic Simulations
journal, September 2015
- Sarobol, Pylin; Chandross, Michael; Carroll, Jay D.
- Journal of Thermal Spray Technology, Vol. 25, Issue 1-2
Influence of Carrier Gas Composition on the Stress of Al2O3 Coatings Prepared by the Aerosol Deposition Method
journal, August 2014
- Schubert, Michael; Exner, Jörg; Moos, Ralf
- Materials, Vol. 7, Issue 8
Dielectric Properties of Nanograined BaTiO3 Ceramics Fabricated by Aerosol Deposition Method
journal, July 2011
- Furuta, Tsutomu; Hatta, Saki; Kigoshi, Yoichi
- Key Engineering Materials, Vol. 485
Direct Write Electronics – Thick Films on LTCC
journal, October 2014
- Eastman, Tim; Cook, Adam
- International Symposium on Microelectronics, Vol. 2014, Issue 1
Works referencing / citing this record:
Manufacturing Dense Thick Films of Lunar Regolith Simulant EAC-1 at Room Temperature
text, January 2019
- Nieke, Philipp; Kita, Jaroslaw; Häming, Marc
- University of Bayreuth
Additive Manufacturing of Metal Structures at the Micrometer Scale
journal, January 2017
- Hirt, Luca; Reiser, Alain; Spolenak, Ralph
- Advanced Materials, Vol. 29, Issue 17
Manufacturing Dense Thick Films of Lunar Regolith Simulant EAC-1 at Room Temperature
text, January 2019
- Nieke, Philipp; Kita, Jaroslaw; Häming, Marc
- University of Bayreuth
Guided ink and process design for aerosol jet printing based on annular drying effects
journal, September 2018
- Secor, Ethan B.
- Flexible and Printed Electronics, Vol. 3, Issue 3
Bipolar Electrochemistry Regulation for Dynamic Meniscus Confined Electrodeposition of Copper Micro-Structures by a Double-Anode System
journal, January 2019
- Zhang, Xianyun; Zhang, Yifan; Li, Yanying
- Journal of The Electrochemical Society, Vol. 166, Issue 13
Influence of high temperature annealing on the dielectric properties of alumina films prepared by the aerosol deposition method
journal, April 2018
- Leupold, Nico; Schubert, Michael; Kita, Jaroslaw
- Functional Materials Letters, Vol. 11, Issue 02
Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications
journal, January 2019
- Huang, Qijin; Zhu, Yong
- Advanced Materials Technologies, Vol. 4, Issue 5
Dynamics of contracting filaments
journal, September 2019
- Anthony, Christopher R.; Kamat, Pritish M.; Harris, Michael T.
- Physical Review Fluids, Vol. 4, Issue 9
Manufacturing Dense Thick Films of Lunar Regolith Simulant EAC-1 at Room Temperature
journal, February 2019
- Nieke, Philipp; Kita, Jaroslaw; Häming, Marc
- Materials, Vol. 12, Issue 3
Size and surface effects on chemically-induced joining of Ag conductive inks
journal, January 2018
- Wu, Yingsi; Wang, Zhaomin; Zhao, Xinyu
- CrystEngComm, Vol. 20, Issue 40
Principles of aerosol jet printing
journal, July 2018
- Secor, Ethan B.
- Flexible and Printed Electronics, Vol. 3, Issue 3