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Title: Interaction of small mobile stacking fault tetrahedra with free surfaces, dislocations, and interfaces in Cu and Cu-Nb

Authors:
; ;
Publication Date:
Grant/Contract Number:
AC52-06NA25396
Type:
Publisher's Accepted Manuscript
Journal Name:
Physical Review B
Additional Journal Information:
Journal Name: Physical Review B Journal Volume: 93 Journal Issue: 5; Journal ID: ISSN 2469-9950
Publisher:
American Physical Society
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
OSTI Identifier:
1236975

Martínez, Enrique, Uberuaga, Blas P., and Beyerlein, Irene J.. Interaction of small mobile stacking fault tetrahedra with free surfaces, dislocations, and interfaces in Cu and Cu-Nb. United States: N. p., Web. doi:10.1103/PhysRevB.93.054105.
Martínez, Enrique, Uberuaga, Blas P., & Beyerlein, Irene J.. Interaction of small mobile stacking fault tetrahedra with free surfaces, dislocations, and interfaces in Cu and Cu-Nb. United States. doi:10.1103/PhysRevB.93.054105.
Martínez, Enrique, Uberuaga, Blas P., and Beyerlein, Irene J.. 2016. "Interaction of small mobile stacking fault tetrahedra with free surfaces, dislocations, and interfaces in Cu and Cu-Nb". United States. doi:10.1103/PhysRevB.93.054105.
@article{osti_1236975,
title = {Interaction of small mobile stacking fault tetrahedra with free surfaces, dislocations, and interfaces in Cu and Cu-Nb},
author = {Martínez, Enrique and Uberuaga, Blas P. and Beyerlein, Irene J.},
abstractNote = {},
doi = {10.1103/PhysRevB.93.054105},
journal = {Physical Review B},
number = 5,
volume = 93,
place = {United States},
year = {2016},
month = {2}
}