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Title: Interaction of small mobile stacking fault tetrahedra with free surfaces, dislocations, and interfaces in Cu and Cu-Nb

Authors:
; ;
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1236975
Grant/Contract Number:  
AC52-06NA25396
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Physical Review B
Additional Journal Information:
Journal Name: Physical Review B Journal Volume: 93 Journal Issue: 5; Journal ID: ISSN 2469-9950
Publisher:
American Physical Society
Country of Publication:
United States
Language:
English

Citation Formats

Martínez, Enrique, Uberuaga, Blas P., and Beyerlein, Irene J. Interaction of small mobile stacking fault tetrahedra with free surfaces, dislocations, and interfaces in Cu and Cu-Nb. United States: N. p., 2016. Web. doi:10.1103/PhysRevB.93.054105.
Martínez, Enrique, Uberuaga, Blas P., & Beyerlein, Irene J. Interaction of small mobile stacking fault tetrahedra with free surfaces, dislocations, and interfaces in Cu and Cu-Nb. United States. doi:10.1103/PhysRevB.93.054105.
Martínez, Enrique, Uberuaga, Blas P., and Beyerlein, Irene J. Thu . "Interaction of small mobile stacking fault tetrahedra with free surfaces, dislocations, and interfaces in Cu and Cu-Nb". United States. doi:10.1103/PhysRevB.93.054105.
@article{osti_1236975,
title = {Interaction of small mobile stacking fault tetrahedra with free surfaces, dislocations, and interfaces in Cu and Cu-Nb},
author = {Martínez, Enrique and Uberuaga, Blas P. and Beyerlein, Irene J.},
abstractNote = {},
doi = {10.1103/PhysRevB.93.054105},
journal = {Physical Review B},
number = 5,
volume = 93,
place = {United States},
year = {2016},
month = {2}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1103/PhysRevB.93.054105

Citation Metrics:
Cited by: 5 works
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Works referenced in this record:

Story of stacking fault tetrahedra
journal, September 1997


Irradiation hardening in copper and nickel
journal, October 1960


Mechanism for recombination of radiation-induced point defects at interphase boundaries
journal, January 2012


On the formation of stacking fault tetrahedra in irradiated austenitic stainless steels – A literature review
journal, November 2013


Liquid-phase thermodynamics and structures in the Cu–Nb binary system
journal, January 2013

  • Zhang, Liang; Martinez, Enrique; Caro, Alfredo
  • Modelling and Simulation in Materials Science and Engineering, Vol. 21, Issue 2
  • DOI: 10.1088/0965-0393/21/2/025005

Efficient Annealing of Radiation Damage Near Grain Boundaries via Interstitial Emission
journal, March 2010


A dislocation dynamics study of the strength of stacking fault tetrahedra. Part II: interactions with mixed and edge dislocations
journal, February 2008


Structure of a 2 (010) Cu twist boundary interface and the segregation of vacancies and He atoms
journal, February 2012


MMonCa: An Object Kinetic Monte Carlo simulator for damage irradiation evolution and defect diffusion
journal, December 2013

  • Martin-Bragado, Ignacio; Rivera, Antonio; Valles, Gonzalo
  • Computer Physics Communications, Vol. 184, Issue 12
  • DOI: 10.1016/j.cpc.2013.07.011

Irradiation-induced stacking fault tetrahedra in fcc metals
journal, February 2005


Dynamic observation of dislocation-free deformation process in Al, Cu, and Ni thin foils
journal, June 2003


A dislocation dynamics study of the strength of stacking fault tetrahedra. Part I: interactions with screw dislocations
journal, February 2008


Fast Parallel Algorithms for Short-Range Molecular Dynamics
journal, March 1995


Removal of stacking-fault tetrahedra by twin boundaries in nanotwinned metals
journal, January 2013

  • Yu, K. Y.; Bufford, D.; Sun, C.
  • Nature Communications, Vol. 4, Issue 1
  • DOI: 10.1038/ncomms2382

Radiation induced effects on mechanical properties of nanoporous gold foams
journal, June 2014

  • Caro, M.; Mook, W. M.; Fu, E. G.
  • Applied Physics Letters, Vol. 104, Issue 23
  • DOI: 10.1063/1.4882275

Dislocation-Stacking Fault Tetrahedron Interactions in Cu
journal, June 2002

  • Wirth, B. D.; Bulatov, V. V.; de la Rubia, T. Diaz
  • Journal of Engineering Materials and Technology, Vol. 124, Issue 3
  • DOI: 10.1115/1.1479692

Comparative study of radiation damage accumulation in Cu and Fe
journal, January 2000


Structural stability and lattice defects in copper: Ab initio , tight-binding, and embedded-atom calculations
journal, May 2001


Migration energy calculations for small vacancy clusters in copper
journal, August 1988


Role of atomic structure on grain boundary-defect interactions in Cu
journal, June 2012


Direct Transformation of Vacancy Voids to Stacking Fault Tetrahedra
journal, September 2007


Micro/meso-scale computational study of dislocation-stacking-fault tetrahedron interactions in copper
journal, December 2009

  • Marian, Jaime; Martínez, Enrique; Lee, Hyon-Jee
  • Journal of Materials Research, Vol. 24, Issue 12
  • DOI: 10.1557/jmr.2009.0424

Atomic-scale details of dislocation–stacking fault tetrahedra interaction
journal, July 2005


Atomistic modeling of defect-induced plasticity in CuNb nanocomposites
journal, August 2014


Direct observations of defects in quenched gold
journal, January 1959


Mobility and coalescence of stacking fault tetrahedra in Cu
journal, March 2015

  • Martínez, Enrique; Uberuaga, Blas P.
  • Scientific Reports, Vol. 5, Issue 1
  • DOI: 10.1038/srep09084

Effect of grain boundary character on sink efficiency
journal, October 2012


Design of Radiation Tolerant Materials Via Interface Engineering
journal, September 2013

  • Han, Weizhong; Demkowicz, Michael J.; Mara, Nathan A.
  • Advanced Materials, Vol. 25, Issue 48
  • DOI: 10.1002/adma.201303400

Atomic-scale study of nucleation of dislocations from fcc–bcc interfaces
journal, April 2012


Review: effect of bimetal interface structure on the mechanical behavior of Cu–Nb fcc–bcc nanolayered composites
journal, July 2014


The formation of stacking fault tetrahedra in Al and CuIII. Growth by expanding ledges
journal, January 2011


The relationship between grain boundary structure, defect mobility and grain boundary sink efficiency
journal, March 2015

  • Uberuaga, Blas Pedro; Vernon, Louis J.; Martinez, Enrique
  • Scientific Reports, Vol. 5, Issue 1
  • DOI: 10.1038/srep09095

The formation of stacking fault tetrahedra in Al and CuI. Dipole annihilation and the nucleation stage
journal, January 2011


Structure identification methods for atomistic simulations of crystalline materials
journal, May 2012


Mechanisms of stacking fault tetrahedra destruction by gliding dislocations in quenched gold
journal, February 2008


Visualization and analysis of atomistic simulation data with OVITO–the Open Visualization Tool
journal, December 2009


Atomistic modeling of long-term evolution of twist boundaries under vacancy supersaturation
journal, December 2012


Interface-dependent nucleation in nanostructured layered composites
journal, September 2013

  • Beyerlein, Irene J.; Wang, Jian; Zhang, Ruifeng
  • APL Materials, Vol. 1, Issue 3
  • DOI: 10.1063/1.4820424

Dislocation mechanism of interface point defect migration
journal, November 2010


I. Energy calculations for pure metals
journal, January 1987


The Growth Mechanism of Stacking‐Fault Tetrahedra in Quenched gold
journal, July 1963

  • Kimura, H.; Kuhlmann‐Wilsdorf, D.; Maddin, R.
  • Applied Physics Letters, Vol. 3, Issue 1
  • DOI: 10.1063/1.1723560

Deformation mechanisms of irradiated metallic nanofoams
journal, July 2013

  • Zepeda-Ruiz, L. A.; Martinez, E.; Caro, M.
  • Applied Physics Letters, Vol. 103, Issue 3
  • DOI: 10.1063/1.4813863