Field testing of thermoplastic encapsulants in high‐temperature installations
Abstract
Abstract Recently there has been increased interest in using thermoplastic encapsulant materials in photovoltaic modules, but concerns have been raised about whether these would be mechanically stable at high temperatures in the field. Recently, this has become a significant topic of discussion in the development of IEC 61730 and IEC 61215. We constructed eight pairs of crystalline‐silicon modules and eight pairs of glass/encapsulation/glass thin‐film mock modules using different encapsulant materials, of which only two were formulated to chemically crosslink. One module set was exposed outdoors with thermal insulation on the back side in Mesa, Arizona, in the summer (hot‐dry), and an identical module set was exposed in environmental chambers. High‐precision creep measurements (±20 μ m) and electrical performance measurements indicate that despite many of these polymeric materials operating in the melt or rubbery state during outdoor deployment, no significant creep was seen because of their high viscosity, lower operating temperature at the edges, and/or the formation of chemical crosslinks in many of the encapsulants with age despite the absence of a crosslinking agent. Only an ethylene‐vinyl acetate ( EVA ) encapsulant formulated without a peroxide crosslinking agent crept significantly. In the case of the crystalline‐silicon modules, the physical restraint ofmore »
- Authors:
-
- National Renewable Energy Laboratory 15013 Denver West Parkway Golden Colorado 80401
- Arizona State University Photovoltaic Reliability Laboratory 7349 East Unity Avenue Mesa Arizona
- National Renewable Energy Laboratory 15013 Denver West Parkway Golden Colorado 80401, National Institute of Advanced Industrial Science and Technology 1‐1‐1 Umezono Tsukuba Ibaraki 305‐8568 Japan
- National Institute of Advanced Industrial Science and Technology 807‐1, Shuku‐Machi Tosu Saga 841‐0052 Japan
- DuPont Company 200 Powder Mill Road Wilmington Delaware 19803
- Underwriters Laboratories 455 East Trimble Road San Jose California
- Publication Date:
- Research Org.:
- National Renewable Energy Laboratory (NREL), Golden, CO (United States)
- Sponsoring Org.:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE), Renewable Power Office. Solar Energy Technologies Office
- OSTI Identifier:
- 1233866
- Alternate Identifier(s):
- OSTI ID: 1233684; OSTI ID: 1233867
- Report Number(s):
- NREL/JA-5J00-62417
Journal ID: ISSN 2050-0505
- Grant/Contract Number:
- DE‐AC36‐08‐GO28308; AC36-08GO28308
- Resource Type:
- Published Article
- Journal Name:
- Energy Science & Engineering
- Additional Journal Information:
- Journal Name: Energy Science & Engineering Journal Volume: 3 Journal Issue: 6; Journal ID: ISSN 2050-0505
- Publisher:
- Wiley Blackwell (John Wiley & Sons)
- Country of Publication:
- United Kingdom
- Language:
- English
- Subject:
- 14 SOLAR ENERGY; 36 MATERIALS SCIENCE; Encapsulant; Adhesives; Creep; Thermoplastic; Qualification Standards; Polymer
Citation Formats
Kempe, Michael D., Miller, David C., Wohlgemuth, John H., Kurtz, Sarah R., Moseley, John M., Shah, Qurat A., Tamizhmani, Govindasamy, Sakurai, Keiichiro, Inoue, Masanao, Doi, Takuya, Masuda, Atsushi, Samuels, Sam L., and Vanderpan, Crystal E. Field testing of thermoplastic encapsulants in high‐temperature installations. United Kingdom: N. p., 2015.
Web. doi:10.1002/ese3.104.
Kempe, Michael D., Miller, David C., Wohlgemuth, John H., Kurtz, Sarah R., Moseley, John M., Shah, Qurat A., Tamizhmani, Govindasamy, Sakurai, Keiichiro, Inoue, Masanao, Doi, Takuya, Masuda, Atsushi, Samuels, Sam L., & Vanderpan, Crystal E. Field testing of thermoplastic encapsulants in high‐temperature installations. United Kingdom. https://doi.org/10.1002/ese3.104
Kempe, Michael D., Miller, David C., Wohlgemuth, John H., Kurtz, Sarah R., Moseley, John M., Shah, Qurat A., Tamizhmani, Govindasamy, Sakurai, Keiichiro, Inoue, Masanao, Doi, Takuya, Masuda, Atsushi, Samuels, Sam L., and Vanderpan, Crystal E. Wed .
"Field testing of thermoplastic encapsulants in high‐temperature installations". United Kingdom. https://doi.org/10.1002/ese3.104.
@article{osti_1233866,
title = {Field testing of thermoplastic encapsulants in high‐temperature installations},
author = {Kempe, Michael D. and Miller, David C. and Wohlgemuth, John H. and Kurtz, Sarah R. and Moseley, John M. and Shah, Qurat A. and Tamizhmani, Govindasamy and Sakurai, Keiichiro and Inoue, Masanao and Doi, Takuya and Masuda, Atsushi and Samuels, Sam L. and Vanderpan, Crystal E.},
abstractNote = {Abstract Recently there has been increased interest in using thermoplastic encapsulant materials in photovoltaic modules, but concerns have been raised about whether these would be mechanically stable at high temperatures in the field. Recently, this has become a significant topic of discussion in the development of IEC 61730 and IEC 61215. We constructed eight pairs of crystalline‐silicon modules and eight pairs of glass/encapsulation/glass thin‐film mock modules using different encapsulant materials, of which only two were formulated to chemically crosslink. One module set was exposed outdoors with thermal insulation on the back side in Mesa, Arizona, in the summer (hot‐dry), and an identical module set was exposed in environmental chambers. High‐precision creep measurements (±20 μ m) and electrical performance measurements indicate that despite many of these polymeric materials operating in the melt or rubbery state during outdoor deployment, no significant creep was seen because of their high viscosity, lower operating temperature at the edges, and/or the formation of chemical crosslinks in many of the encapsulants with age despite the absence of a crosslinking agent. Only an ethylene‐vinyl acetate ( EVA ) encapsulant formulated without a peroxide crosslinking agent crept significantly. In the case of the crystalline‐silicon modules, the physical restraint of the backsheet reduced creep further and was not detectable even for the EVA without peroxide. Because of the propensity of some polymeric materials to crosslink as they age, typical thermoplastic encapsulants would be unlikely to result in creep in the vast majority of installations.},
doi = {10.1002/ese3.104},
journal = {Energy Science & Engineering},
number = 6,
volume = 3,
place = {United Kingdom},
year = {Wed Nov 25 00:00:00 EST 2015},
month = {Wed Nov 25 00:00:00 EST 2015}
}
https://doi.org/10.1002/ese3.104
Web of Science
Works referenced in this record:
Characterization of ethylene vinyl acetate (EVA) encapsulant: Effects of thermal processing and weathering degradation on its discoloration
journal, January 1992
- Pern, F.; Czanderna, A.
- Solar Energy Materials and Solar Cells, Vol. 25, Issue 1-2
Evaluation of high-temperature exposure of rack-mounted photovoltaic modules
conference, June 2009
- Kurtz, Sarah; Whitfield, Kent; Miller, David
- 2009 34th IEEE Photovoltaic Specialists Conference (PVSC)
Compressive-shear adhesion characterization of polyvinyl-butyral and ethylene-vinyl acetate at different curing times before and after exposure to damp-heat conditions: Compressive-shear adhesion characterization of PVB and EVA
journal, September 2012
- Chapuis, Valentin; Pélisset, Ségolène; Raeis-Barnéoud, Marylène
- Progress in Photovoltaics: Research and Applications, Vol. 22, Issue 4
Temperature of rooftop photovoltaic modules: air gap effects
conference, August 2009
- Shrestha, Bijay L.; Palomino, Ernie G.; TamizhMani, G.
- SPIE Solar Energy + Technology, SPIE Proceedings
Investigation of the degradation and stabilization of EVA-based encapsulant in field-aged solar energy modules
journal, March 1997
- Klemchuk, Peter; Ezrin, Myer; Lavigne, Gary
- Polymer Degradation and Stability, Vol. 55, Issue 3
Developing standards for PV packaging materials
conference, September 2011
- Wohlgemuth, John; Kempe, Michael; Miller, David
- SPIE Solar Energy + Technology, SPIE Proceedings
Creep in photovoltaic modules: Examining the stability of polymeric materials and components
conference, June 2010
- Miller, David C.; Kempe, Michael D.; Glick, Stephen. H.
- 2010 35th IEEE Photovoltaic Specialists Conference (PVSC)
Antisoiling technology: theories of surface soiling and performance of antisoiling surface coatings
report, November 1984
- Cuddihy, E.; Willis, P.
Applications of ethylene vinyl acetate as an encapsulation material for terrestrial photovoltaic modules
report, April 1983
- Cuddihy, E.; Coulbert, C.; Liang, R.
A field evaluation of the potential for creep in thermoplastic encapsulant materials
conference, June 2012
- Kempe, M. D.; Miller, D. C.; Wohlgemuth, J. H.
- 2012 IEEE 38th Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE Photovoltaic Specialists Conference
BAPV array: Thermal modeling and cooling effect of exhaust fan
conference, June 2011
- Hrica, Jonathan; Chatterjee, Saurabh; TamizhMani, GovindaSamy
- 2011 37th IEEE Photovoltaic Specialists Conference (PVSC)
BAPV arrays: Side-by-side comparison with and without fan cooling
conference, June 2012
- Chatterjee, Saurabh; TamizhMani, GovindaSamy
- 2012 IEEE 38th Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE Photovoltaic Specialists Conference
Use of Melt Flow Rate Test in Reliability Study of Thermoplastic Encapsulation Materials in Photovoltaic Modules
report, December 2011
- Moseley, John; Miller, David; Shah, Qurat-Ul-Aain