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Title: Enhancing solid-liquid interface thermal transport using self-assembled monolayers

Authors:
 [1] ; ORCiD logo [2] ;  [3]
  1. Department of Mechanical Engineering, Virginia Tech, Blacksburg, Virginia 24061, USA
  2. Department of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47907, USA
  3. Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA
Publication Date:
Type:
Publisher's Accepted Manuscript
Journal Name:
Applied Physics Letters
Additional Journal Information:
Journal Name: Applied Physics Letters Journal Volume: 106 Journal Issue: 21; Journal ID: ISSN 0003-6951
Publisher:
American Institute of Physics
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
OSTI Identifier:
1226749

Tian, Zhiting, Marconnet, Amy, and Chen, Gang. Enhancing solid-liquid interface thermal transport using self-assembled monolayers. United States: N. p., Web. doi:10.1063/1.4921758.
Tian, Zhiting, Marconnet, Amy, & Chen, Gang. Enhancing solid-liquid interface thermal transport using self-assembled monolayers. United States. doi:10.1063/1.4921758.
Tian, Zhiting, Marconnet, Amy, and Chen, Gang. 2015. "Enhancing solid-liquid interface thermal transport using self-assembled monolayers". United States. doi:10.1063/1.4921758.
@article{osti_1226749,
title = {Enhancing solid-liquid interface thermal transport using self-assembled monolayers},
author = {Tian, Zhiting and Marconnet, Amy and Chen, Gang},
abstractNote = {},
doi = {10.1063/1.4921758},
journal = {Applied Physics Letters},
number = 21,
volume = 106,
place = {United States},
year = {2015},
month = {5}
}

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