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Title: A molecular dynamics study of tilt grain boundary resistance to slip and heat transfer in nanocrystalline silicon

Authors:
 [1];  [2];  [3];  [1]
  1. Department of Mechanical and Aerospace Engineering, University of Florida, Gainesville, Florida 32611, USA
  2. Department of Aerospace Engineering, Iowa State University, Ames, Iowa 50011, USA
  3. Department of Materials Science and Engineering, University of Florida, Gainesville, Florida 32611, USA
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1226650
Grant/Contract Number:  
DOE/DE-SC0006539
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Name: Journal of Applied Physics Journal Volume: 116 Journal Issue: 24; Journal ID: ISSN 0021-8979
Publisher:
American Institute of Physics
Country of Publication:
United States
Language:
English

Citation Formats

Chen, Xiang, Xiong, Liming, Chernatynskiy, Aleksandr, and Chen, Youping. A molecular dynamics study of tilt grain boundary resistance to slip and heat transfer in nanocrystalline silicon. United States: N. p., 2014. Web. doi:10.1063/1.4905248.
Chen, Xiang, Xiong, Liming, Chernatynskiy, Aleksandr, & Chen, Youping. A molecular dynamics study of tilt grain boundary resistance to slip and heat transfer in nanocrystalline silicon. United States. doi:10.1063/1.4905248.
Chen, Xiang, Xiong, Liming, Chernatynskiy, Aleksandr, and Chen, Youping. Tue . "A molecular dynamics study of tilt grain boundary resistance to slip and heat transfer in nanocrystalline silicon". United States. doi:10.1063/1.4905248.
@article{osti_1226650,
title = {A molecular dynamics study of tilt grain boundary resistance to slip and heat transfer in nanocrystalline silicon},
author = {Chen, Xiang and Xiong, Liming and Chernatynskiy, Aleksandr and Chen, Youping},
abstractNote = {},
doi = {10.1063/1.4905248},
journal = {Journal of Applied Physics},
number = 24,
volume = 116,
place = {United States},
year = {2014},
month = {12}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1063/1.4905248

Citation Metrics:
Cited by: 5 works
Citation information provided by
Web of Science

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Works referenced in this record:

Nanoscale thermal transport
journal, January 2003

  • Cahill, David G.; Ford, Wayne K.; Goodson, Kenneth E.
  • Journal of Applied Physics, Vol. 93, Issue 2, p. 793-818
  • DOI: 10.1063/1.1524305