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Title: International Round-Robin Study on Thermoelectric Transport Properties of n-type Half-Heusler from 300 K to 773 K

Abstract

International transport property measurement round-robins have been conducted by the Thermoelectric Annex under the International Energy Agency (IEA) Implementing Agreement on Advanced Materials for Transportation (AMT). The previous round-robins used commercially available bismuth telluride as the testing material, with the goals of understanding measurement issues and developing standard testing procedures. The current round-robin extended the measurement temperature range to 773 K. It was designed to meet the increasing demands for reliable transport data of thermoelectric materials for power generation applications. Eleven laboratories from six IEA-AMT member countries participated in this study. Half-Heusler (n-type) material prepared by GMZ Energy was selected for the round-robin. The measured transport properties showed narrower distribution on uncertainties compared to previous round-robin efforts. The study intentionally included multiple testing methods and instrument types. Over the full temperature range, the measurement discrepancies on the figure of merit, ZT, in this round-robin were ±1.5 to ±16.4% from the averages.

Authors:
 [1];  [2];  [2];  [3];  [4];  [5];  [6];  [7];  [8];  [7];  [1];  [9];  [10];  [11];  [12];  [11];  [13]
+ Show Author Affiliations
  1. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  2. Chinese Academy of Sciences (CAS), Shanghai (China)
  3. National Physics Laboratory (NPL), London, (United Kingdom)
  4. GMZ Energy, Waltham, MA (United States); Evident Thermoelectric, Troy, NY (United States)
  5. Univ. of Waterloo, ON (Canada)
  6. Fraunhofer-Inst. for PHysical Measurment Techniques, Freiburg (Germany)
  7. Korea Electrotechnology Research Inst., Anshan (Korea)
  8. National Inst. of Standards and Technology (NIST), Gaithersburg, MD (United States)
  9. Univ. of Houston, TX (United States)
  10. General Motors, Global Research and Development, Warren, MI (United States)
  11. Marlow Industries, Inc., Dallas, TX (United States)
  12. U.S. Army Research Lab., Aldephi, MD (United States)
  13. CANMET Materials, Hamiliton, ON (Canada)
Publication Date:
Research Org.:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
1215580
Grant/Contract Number:  
AC05-00OR22725
Resource Type:
Accepted Manuscript
Journal Name:
Journal of Electronic Materials
Additional Journal Information:
Journal Volume: 44; Journal Issue: 11; Journal ID: ISSN 0361-5235
Publisher:
Springer
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; thermoelctric; round-robin; figure of merit

Citation Formats

Wang, Hsin, Bai, Shengqiang, Chen, Lidong, Cuenat, Alexander, Joshi, Giri, Kleinke, Holger, Konig, Jan, Lee, Hee Woong, Martin, Joshua, Oh, Min-Wook, Porter, Wallace D., Ren, Zhifeng, Salvador, James R., Sharp, Jeff W., Taylor, Patrick, Thompson, Alan J., and Tseng, Yu -Chih. International Round-Robin Study on Thermoelectric Transport Properties of n-type Half-Heusler from 300 K to 773 K. United States: N. p., 2015. Web. doi:10.1007/s11664-015-4006-z.
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Wang, Hsin, Bai, Shengqiang, Chen, Lidong, Cuenat, Alexander, Joshi, Giri, Kleinke, Holger, Konig, Jan, Lee, Hee Woong, Martin, Joshua, Oh, Min-Wook, Porter, Wallace D., Ren, Zhifeng, Salvador, James R., Sharp, Jeff W., Taylor, Patrick, Thompson, Alan J., & Tseng, Yu -Chih. International Round-Robin Study on Thermoelectric Transport Properties of n-type Half-Heusler from 300 K to 773 K. United States. https://doi.org/10.1007/s11664-015-4006-z
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Wang, Hsin, Bai, Shengqiang, Chen, Lidong, Cuenat, Alexander, Joshi, Giri, Kleinke, Holger, Konig, Jan, Lee, Hee Woong, Martin, Joshua, Oh, Min-Wook, Porter, Wallace D., Ren, Zhifeng, Salvador, James R., Sharp, Jeff W., Taylor, Patrick, Thompson, Alan J., and Tseng, Yu -Chih. Thu . "International Round-Robin Study on Thermoelectric Transport Properties of n-type Half-Heusler from 300 K to 773 K". United States. https://doi.org/10.1007/s11664-015-4006-z. https://www.osti.gov/servlets/purl/1215580.
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@article{osti_1215580,
title = {International Round-Robin Study on Thermoelectric Transport Properties of n-type Half-Heusler from 300 K to 773 K},
author = {Wang, Hsin and Bai, Shengqiang and Chen, Lidong and Cuenat, Alexander and Joshi, Giri and Kleinke, Holger and Konig, Jan and Lee, Hee Woong and Martin, Joshua and Oh, Min-Wook and Porter, Wallace D. and Ren, Zhifeng and Salvador, James R. and Sharp, Jeff W. and Taylor, Patrick and Thompson, Alan J. and Tseng, Yu -Chih},
abstractNote = {International transport property measurement round-robins have been conducted by the Thermoelectric Annex under the International Energy Agency (IEA) Implementing Agreement on Advanced Materials for Transportation (AMT). The previous round-robins used commercially available bismuth telluride as the testing material, with the goals of understanding measurement issues and developing standard testing procedures. The current round-robin extended the measurement temperature range to 773 K. It was designed to meet the increasing demands for reliable transport data of thermoelectric materials for power generation applications. Eleven laboratories from six IEA-AMT member countries participated in this study. Half-Heusler (n-type) material prepared by GMZ Energy was selected for the round-robin. The measured transport properties showed narrower distribution on uncertainties compared to previous round-robin efforts. The study intentionally included multiple testing methods and instrument types. Over the full temperature range, the measurement discrepancies on the figure of merit, ZT, in this round-robin were ±1.5 to ±16.4% from the averages.},
doi = {10.1007/s11664-015-4006-z},
journal = {Journal of Electronic Materials},
number = 11,
volume = 44,
place = {United States},
year = {Thu Sep 03 00:00:00 EDT 2015},
month = {Thu Sep 03 00:00:00 EDT 2015}
}
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https://doi.org/10.1007/s11664-015-4006-z
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