In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples
Abstract
The Cu–Sn metallurgical soldering reaction in two-segmented Cu–Sn nanowires is visualized by in-situ transmission electron microscopy. By varying the relative lengths of Cu and Sn segments, we show that the metallurgical reaction starts at ~ 200 ° with the formation of a Cu–Sn solid solution for the Sn/Cu length ratio smaller than 1:5 while the formation of Cu–Sn intermetallic compounds (IMCs) for larger Sn/Cu length ratios. Upon heating the nanowires up to ~ 500 °C, two phase transformation pathways occur, η-Cu₆Sn₅ → ε-Cu₃Sn → δ-Cu₄₁Sn₁₁ for nanowires with a long Cu segment and η-Cu₆Sn₅ → ε-Cu₃Sn → γ-Cu₃Sn with a short Cu segment. The dynamic in situ TEM visualization of the evolution of Kirkendall voids demonstrates that Cu diffuses faster both in Sn and IMCs than that of Sn in Cu₃ and IMCs, which is the underlying cause of the dependence of the IMC formation and associated phase evolution on the relative lengths of the Cu and Sn segments.
- Authors:
-
- State Univ. of New York at Binghamton, Binghamton, NY (United States)
- Brookhaven National Lab. (BNL), Upton, NY (United States)
- Univ. of Massachusetts, Lowell, MA (United States)
- Publication Date:
- Research Org.:
- Brookhaven National Lab. (BNL), Upton, NY (United States)
- Sponsoring Org.:
- USDOE Office of Science (SC), Basic Energy Sciences (BES)
- OSTI Identifier:
- 1193240
- Report Number(s):
- BNL-108171-2015-JA
Journal ID: ISSN 2040-3364; NANOHL; KC040302
- Grant/Contract Number:
- SC00112704
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Nanoscale
- Additional Journal Information:
- Journal Volume: 7; Journal Issue: 11; Journal ID: ISSN 2040-3364
- Publisher:
- Royal Society of Chemistry
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Yin, Qiyue, Stach, Eric A., Gao, Fan, Zhou, Guangwen, and Gu, Zhiyong. In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples. United States: N. p., 2015.
Web. doi:10.1039/c4nr06757f.
Yin, Qiyue, Stach, Eric A., Gao, Fan, Zhou, Guangwen, & Gu, Zhiyong. In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples. United States. doi:10.1039/c4nr06757f.
Yin, Qiyue, Stach, Eric A., Gao, Fan, Zhou, Guangwen, and Gu, Zhiyong. Tue .
"In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples". United States. doi:10.1039/c4nr06757f. https://www.osti.gov/servlets/purl/1193240.
@article{osti_1193240,
title = {In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples},
author = {Yin, Qiyue and Stach, Eric A. and Gao, Fan and Zhou, Guangwen and Gu, Zhiyong},
abstractNote = {The Cu–Sn metallurgical soldering reaction in two-segmented Cu–Sn nanowires is visualized by in-situ transmission electron microscopy. By varying the relative lengths of Cu and Sn segments, we show that the metallurgical reaction starts at ~ 200 ° with the formation of a Cu–Sn solid solution for the Sn/Cu length ratio smaller than 1:5 while the formation of Cu–Sn intermetallic compounds (IMCs) for larger Sn/Cu length ratios. Upon heating the nanowires up to ~ 500 °C, two phase transformation pathways occur, η-Cu₆Sn₅ → ε-Cu₃Sn → δ-Cu₄₁Sn₁₁ for nanowires with a long Cu segment and η-Cu₆Sn₅ → ε-Cu₃Sn → γ-Cu₃Sn with a short Cu segment. The dynamic in situ TEM visualization of the evolution of Kirkendall voids demonstrates that Cu diffuses faster both in Sn and IMCs than that of Sn in Cu₃ and IMCs, which is the underlying cause of the dependence of the IMC formation and associated phase evolution on the relative lengths of the Cu and Sn segments.},
doi = {10.1039/c4nr06757f},
journal = {Nanoscale},
number = 11,
volume = 7,
place = {United States},
year = {2015},
month = {2}
}
Other availability
Search WorldCat to find libraries that may hold this journal
Cited by: 13 works
Citation information provided by
Web of Science
Web of Science
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
Joining and Interconnect Formation of Nanowires and Carbon Nanotubes for Nanoelectronics and Nanosystems
journal, June 2009
- Cui, Qingzhou; Gao, Fan; Mukherjee, Subhadeep
- Small, Vol. 5, Issue 11
Eliminate Kirkendall voids in solder reactions on nanotwinned copper
journal, March 2013
- Liu, Tao-Chi; Liu, Chien-Min; Huang, Yi-Sa
- Scripta Materialia, Vol. 68, Issue 5
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
journal, May 2012
- Hsiao, H. -Y.; Liu, C. -M.; Lin, H. -w.
- Science, Vol. 336, Issue 6084
Interdiffusion and reaction in bimetallic Cu-Sn thin films
journal, April 1973
- Tu, K. N.
- Acta Metallurgica, Vol. 21, Issue 4
Interstitial Diffusion of Copper in Tin
journal, July 1967
- Dyson, B. F.; Anthony, T. R.; Turnbull, D.
- Journal of Applied Physics, Vol. 38, Issue 8
Size-Dependent Melting Properties of Small Tin Particles: Nanocalorimetric Measurements
journal, July 1996
- Lai, S. L.; Guo, J. Y.; Petrova, V.
- Physical Review Letters, Vol. 77, Issue 1
The Cu–Sn phase diagram part II: New thermodynamic assessment
journal, March 2013
- Li, D.; Franke, P.; Fürtauer, S.
- Intermetallics, Vol. 34