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Title: Origin of the Bismuth-Induced Decohesion of Nickel and Copper Grain Boundaries

Authors:
; ;
Publication Date:
Type:
Publisher's Accepted Manuscript
Journal Name:
Physical Review Letters
Additional Journal Information:
Journal Volume: 111; Journal Issue: 5; Journal ID: ISSN 0031-9007
Publisher:
American Physical Society
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
OSTI Identifier:
1104335

Kang, Joongoo, Glatzmaier, Greg C., and Wei, Su-Huai. Origin of the Bismuth-Induced Decohesion of Nickel and Copper Grain Boundaries. United States: N. p., Web. doi:10.1103/PhysRevLett.111.055502.
Kang, Joongoo, Glatzmaier, Greg C., & Wei, Su-Huai. Origin of the Bismuth-Induced Decohesion of Nickel and Copper Grain Boundaries. United States. doi:10.1103/PhysRevLett.111.055502.
Kang, Joongoo, Glatzmaier, Greg C., and Wei, Su-Huai. 2013. "Origin of the Bismuth-Induced Decohesion of Nickel and Copper Grain Boundaries". United States. doi:10.1103/PhysRevLett.111.055502.
@article{osti_1104335,
title = {Origin of the Bismuth-Induced Decohesion of Nickel and Copper Grain Boundaries},
author = {Kang, Joongoo and Glatzmaier, Greg C. and Wei, Su-Huai},
abstractNote = {},
doi = {10.1103/PhysRevLett.111.055502},
journal = {Physical Review Letters},
number = 5,
volume = 111,
place = {United States},
year = {2013},
month = {7}
}