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Title: Thermodynamic Upper Bound on Broadband Light Coupling with Photonic Structures

Authors:
; ;
Publication Date:
Sponsoring Org.:
USDOE
OSTI Identifier:
1101662
Resource Type:
Publisher's Accepted Manuscript
Journal Name:
Physical Review Letters
Additional Journal Information:
Journal Volume: 109; Journal Issue: 17; Journal ID: ISSN 0031-9007
Publisher:
American Physical Society
Country of Publication:
United States
Language:
English

Citation Formats

Yu, Zongfu, Raman, Aaswath, and Fan, Shanhui. Thermodynamic Upper Bound on Broadband Light Coupling with Photonic Structures. United States: N. p., 2012. Web. doi:10.1103/PhysRevLett.109.173901.
Yu, Zongfu, Raman, Aaswath, & Fan, Shanhui. Thermodynamic Upper Bound on Broadband Light Coupling with Photonic Structures. United States. doi:10.1103/PhysRevLett.109.173901.
Yu, Zongfu, Raman, Aaswath, and Fan, Shanhui. Tue . "Thermodynamic Upper Bound on Broadband Light Coupling with Photonic Structures". United States. doi:10.1103/PhysRevLett.109.173901.
@article{osti_1101662,
title = {Thermodynamic Upper Bound on Broadband Light Coupling with Photonic Structures},
author = {Yu, Zongfu and Raman, Aaswath and Fan, Shanhui},
abstractNote = {},
doi = {10.1103/PhysRevLett.109.173901},
journal = {Physical Review Letters},
number = 17,
volume = 109,
place = {United States},
year = {2012},
month = {10}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
DOI: 10.1103/PhysRevLett.109.173901

Citation Metrics:
Cited by: 37 works
Citation information provided by
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