Title:
PLATING THICKNESS TESTER
Subject Terms:
EDDY CURRENT TESTINGREACTOR TECHNOLOGYTHICKNESS GAGES
Document Location:
DOE Public Reading Room - Hanford Battelle P.O. Box 999 MS H2-53 Richland WA 99352 (509)372-7443
Publication Date:
1957 Nov 15
Declassification Status:
Declassified
Accession Number:
RL-1-366505
Document Number(s):
HW-53632
Originating Research Org.:
GE - HAPO
OpenNet Entry Date:
2004 Feb 24
OpenNet Modified Date:
2015 Aug 24
Description/Abstract:
AN ELECTROMAGNETIC EDDY CURRENT INSTRUMENT IS DECRIBED THAT IS CAPABLE OF MEASURING CU AND NI PLATING 1 TO 8 MILS THICK PLATED ON BI MANDRELS OF VARIOUS SIZES AND SHAPES. PLATING THICKNESSES CAN BE MEASURED ACCURATELY TO WITHIN 0.5 MILS.