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Ultraprecision machining. Cho seimitsu kako

Journal Article:

Abstract

It is said that the image of ultraprecision improved from 0.1[mu]m to 0.01[mu]m within recent years. Ultraprecision machining is a production technology which forms what is called nanotechnology with ultraprecision measuring and ultraprecision control. Accuracy means average machined sizes close to a required value, namely the deflection errors are small; precision means the scattered errors of machined sizes agree very closely. The errors of machining are related to both of the above errors and ultraprecision means the combined errors are very small. In the present ultraprecision machining, the relative precision to the size of a machined object is said to be in the order of 10[sup -6]. The flatness of silicon wafers is usually less than 0.5[mu]m. It is the fact that the appearance of atomic scale machining is awaited as the limit of ultraprecision machining. The machining of removing and adding atomic units using scanning probe microscopes are expected to reach the limit actually. 2 refs.
Authors:
Suga, T [1] 
  1. The Univ. of Tokyo, Tokyo (Japan). Research Center for Advanced Science and Technology
Publication Date:
Oct 05, 1992
Product Type:
Journal Article
Reference Number:
NEDO-92-913854; EDB-93-054541
Resource Relation:
Journal Name: Nippon Kikai Gakkai-Shi (Journal of the Japan Society of Mechanical Engineers); (Japan); Journal Volume: 95:887
Subject:
42 ENGINEERING; ERRORS; MINIMIZATION; SIZE; MACHINING; ACCURACY; ATOMS; CONTROL SYSTEMS; CRYSTAL LATTICES; FABRICATION; MEASURING METHODS; SCALE DIMENSION; CRYSTAL STRUCTURE; 420200* - Engineering- Facilities, Equipment, & Techniques
OSTI ID:
6950548
Country of Origin:
Japan
Language:
Japanese
Other Identifying Numbers:
Journal ID: ISSN 0021-4728; CODEN: NKGKA3
Submitting Site:
NEDO
Size:
Pages: 2-3
Announcement Date:
May 01, 1993

Journal Article:

Citation Formats

Suga, T. Ultraprecision machining. Cho seimitsu kako. Japan: N. p., 1992. Web.
Suga, T. Ultraprecision machining. Cho seimitsu kako. Japan.
Suga, T. 1992. "Ultraprecision machining. Cho seimitsu kako." Japan.
@misc{etde_6950548,
title = {Ultraprecision machining. Cho seimitsu kako}
author = {Suga, T}
abstractNote = {It is said that the image of ultraprecision improved from 0.1[mu]m to 0.01[mu]m within recent years. Ultraprecision machining is a production technology which forms what is called nanotechnology with ultraprecision measuring and ultraprecision control. Accuracy means average machined sizes close to a required value, namely the deflection errors are small; precision means the scattered errors of machined sizes agree very closely. The errors of machining are related to both of the above errors and ultraprecision means the combined errors are very small. In the present ultraprecision machining, the relative precision to the size of a machined object is said to be in the order of 10[sup -6]. The flatness of silicon wafers is usually less than 0.5[mu]m. It is the fact that the appearance of atomic scale machining is awaited as the limit of ultraprecision machining. The machining of removing and adding atomic units using scanning probe microscopes are expected to reach the limit actually. 2 refs.}
journal = {Nippon Kikai Gakkai-Shi (Journal of the Japan Society of Mechanical Engineers); (Japan)}
volume = {95:887}
journal type = {AC}
place = {Japan}
year = {1992}
month = {Oct}
}