Abstract
It is said that the image of ultraprecision improved from 0.1[mu]m to 0.01[mu]m within recent years. Ultraprecision machining is a production technology which forms what is called nanotechnology with ultraprecision measuring and ultraprecision control. Accuracy means average machined sizes close to a required value, namely the deflection errors are small; precision means the scattered errors of machined sizes agree very closely. The errors of machining are related to both of the above errors and ultraprecision means the combined errors are very small. In the present ultraprecision machining, the relative precision to the size of a machined object is said to be in the order of 10[sup -6]. The flatness of silicon wafers is usually less than 0.5[mu]m. It is the fact that the appearance of atomic scale machining is awaited as the limit of ultraprecision machining. The machining of removing and adding atomic units using scanning probe microscopes are expected to reach the limit actually. 2 refs.
Suga, T
[1]
- The Univ. of Tokyo, Tokyo (Japan). Research Center for Advanced Science and Technology
Citation Formats
Suga, T.
Ultraprecision machining. Cho seimitsu kako.
Japan: N. p.,
1992.
Web.
Suga, T.
Ultraprecision machining. Cho seimitsu kako.
Japan.
Suga, T.
1992.
"Ultraprecision machining. Cho seimitsu kako."
Japan.
@misc{etde_6950548,
title = {Ultraprecision machining. Cho seimitsu kako}
author = {Suga, T}
abstractNote = {It is said that the image of ultraprecision improved from 0.1[mu]m to 0.01[mu]m within recent years. Ultraprecision machining is a production technology which forms what is called nanotechnology with ultraprecision measuring and ultraprecision control. Accuracy means average machined sizes close to a required value, namely the deflection errors are small; precision means the scattered errors of machined sizes agree very closely. The errors of machining are related to both of the above errors and ultraprecision means the combined errors are very small. In the present ultraprecision machining, the relative precision to the size of a machined object is said to be in the order of 10[sup -6]. The flatness of silicon wafers is usually less than 0.5[mu]m. It is the fact that the appearance of atomic scale machining is awaited as the limit of ultraprecision machining. The machining of removing and adding atomic units using scanning probe microscopes are expected to reach the limit actually. 2 refs.}
journal = []
volume = {95:887}
journal type = {AC}
place = {Japan}
year = {1992}
month = {Oct}
}
title = {Ultraprecision machining. Cho seimitsu kako}
author = {Suga, T}
abstractNote = {It is said that the image of ultraprecision improved from 0.1[mu]m to 0.01[mu]m within recent years. Ultraprecision machining is a production technology which forms what is called nanotechnology with ultraprecision measuring and ultraprecision control. Accuracy means average machined sizes close to a required value, namely the deflection errors are small; precision means the scattered errors of machined sizes agree very closely. The errors of machining are related to both of the above errors and ultraprecision means the combined errors are very small. In the present ultraprecision machining, the relative precision to the size of a machined object is said to be in the order of 10[sup -6]. The flatness of silicon wafers is usually less than 0.5[mu]m. It is the fact that the appearance of atomic scale machining is awaited as the limit of ultraprecision machining. The machining of removing and adding atomic units using scanning probe microscopes are expected to reach the limit actually. 2 refs.}
journal = []
volume = {95:887}
journal type = {AC}
place = {Japan}
year = {1992}
month = {Oct}
}