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Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei

Abstract

Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.
Authors:
Kita, T; Mukaibo, N; Ando, K; Moriyama, M [1] 
  1. Honda R and D Co. Ltd., Tokyo (Japan)
Publication Date:
Oct 01, 1997
Product Type:
Conference
Report Number:
ETDE/JP-98753831; CONF-9710216-
Reference Number:
SCA: 330600; 360101; 360103; PA: JP-98:0G1336; EDB-98:074068; SN: 98001949001
Resource Relation:
Conference: 1997 Fall Japan Society of Automotive Engineers (JSAE) meeting science lecture, JSAE 1997 nen shuki taikai gakujutsu koenkai, Hiroshima (Japan), 21-23 Oct 1997; Other Information: PBD: 1 Oct 1997; Related Information: Is Part Of Preprint of the Fall 1997 JSAE (Japan Society of Automotive Engineers) Meeting Science Lecture. No. 976; PB: 362 p.; Jidosha gijutsukai 1997 nen shuki taikai gakujutsu koenkai maezurishu. 976
Subject:
33 ADVANCED PROPULSION SYSTEMS; 36 MATERIALS SCIENCE; AUTOMOBILES; ELECTRONIC EQUIPMENT; SOLDERED JOINTS; RELIABILITY; INTERMETALLIC COMPOUNDS; MECHANICAL TESTS; CREEP; MECHANICAL VIBRATIONS; FRACTURING; GRAIN GROWTH
OSTI ID:
625276
Research Organizations:
Society of Automotive Engineers of Japan, Tokyo (Japan)
Country of Origin:
Japan
Language:
Japanese
Other Identifying Numbers:
Other: ON: DE98753831; TRN: JN98G1336
Availability:
Available from Society of Automotive Engineers of Japan Inc., Gobancho 10-2, Chiyoda-ku, Tokyo, Japan (Japan); OSTI as DE98753831
Submitting Site:
NEDO
Size:
pp. 263-266
Announcement Date:
Jul 30, 1998

Citation Formats

Kita, T, Mukaibo, N, Ando, K, and Moriyama, M. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei. Japan: N. p., 1997. Web.
Kita, T, Mukaibo, N, Ando, K, & Moriyama, M. Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei. Japan.
Kita, T, Mukaibo, N, Ando, K, and Moriyama, M. 1997. "Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei." Japan.
@misc{etde_625276,
title = {Reliability of soldered joints for automotive electronic devices; Denso buhin ni okeru handa setsugo no shinraisei}
author = {Kita, T, Mukaibo, N, Ando, K, and Moriyama, M}
abstractNote = {Concerning the tin and lead eutectic solder, we have evaluated the reliability of three factors of intermetallic compound layer, creep and vibration which cause solder degradation. First, the stress factor was extracted from investigating the mechanism of degradation, and the best acceleration test method was fixed. Next, the acceleration test was executed to find the stress dependency and the tendency of solder degradation was modeled numerically. While the environmental stress frequency was obtained and they were put together by using a minor method, which enabled us to predict the life span of solder on the market with precision. 5 refs., 13 figs.}
place = {Japan}
year = {1997}
month = {Oct}
}