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Development of micro capacitive accelerometer for subsurface microseismic measurement. Second Report; Micromachining ni yoru chika danseiha kenshutsu no tame no silicone yoryogata kasokudo sensor no seisaku. 2

Abstract

Micromachining-aided manufacture is under way of a silicon capacitive accelerator sensor, high in sensitivity and broad in bandwidth, for detecting subsurface microseismic waves. The sensor detects acceleration by use of changes in capacities of the top and bottom capacitors generated when a spring-supported weight experiences displacement upon application of acceleration to the said weight. A diode bridge circuit is employed as the circuit for detecting acceleration. As for sensitivity of the sensor, when the virtual noise inputted into the electronic circuit is presumed at 1{mu}V and the circuit driving voltage at 5V, the sensor minimum detectability will be 2.5mgal in the presence of a 3{mu}m gap between the weight and an electrode plate. The natural vibration frequency is set at 1kHz. Such specifications may be realized using the current micromachining technology, and possibilities are that the bandwidth will be further expanded when the sensor is used in a servo-type configuration. The effort is still at the stage of acceleration sensor manufacturing, with a stopper just formed for the silicon weight. 9 refs., 6 figs., 1 tab.
Authors:
Nishizawa, M; Lim, G; Niitsuma, H; Esashi, M [1] 
  1. Tohoku University, Sendai (Japan)
Publication Date:
Oct 22, 1997
Product Type:
Conference
Report Number:
ETDE/JP-98751022; CONF-9710214-
Reference Number:
SCA: 440700; 426000; PA: JP-97:0G4549; EDB-98:075709; SN: 98001944485
Resource Relation:
Conference: 97. SEGJ conference, Butsuri tansa gakkai dai 97 kai (1997 nendo shuki) gakujutsu koenkai, Sapporo (Japan), 22-24 Oct 1997; Other Information: PBD: 22 Oct 1997; Related Information: Is Part Of Proceeding of the 97th (Fall, Fiscal 1997) SEGJ Conference; PB: 371 p.; Butsuri tansa gakkai dai 97 kai (1997 nendo shuki) gakujutsu koenkai koen ronbunshu
Subject:
44 INSTRUMENTATION, INCLUDING NUCLEAR AND PARTICLE DETECTORS; 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; PROBES; ACCELEROMETERS; SEISMIC WAVES; MACHINING; WEIGHT; SPRINGS; EIGENFREQUENCY; CAPACITORS; ELECTRIC BRIDGES; SERVOMECHANISMS
OSTI ID:
622717
Research Organizations:
Society of Exploration Geophysicists of Japan, Tokyo (Japan)
Country of Origin:
Japan
Language:
Japanese
Other Identifying Numbers:
Other: ON: DE98751022; TRN: JN97G4549
Availability:
Available from Society of Exploration Geophysicists of Japan, 2-18, Nakamagome 2-chome, Ota-ku, Tokyo, (Japan); OSTI as DE98751022
Submitting Site:
NEDO
Size:
pp. 169-172
Announcement Date:
Jul 24, 1998

Citation Formats

Nishizawa, M, Lim, G, Niitsuma, H, and Esashi, M. Development of micro capacitive accelerometer for subsurface microseismic measurement. Second Report; Micromachining ni yoru chika danseiha kenshutsu no tame no silicone yoryogata kasokudo sensor no seisaku. 2. Japan: N. p., 1997. Web.
Nishizawa, M, Lim, G, Niitsuma, H, & Esashi, M. Development of micro capacitive accelerometer for subsurface microseismic measurement. Second Report; Micromachining ni yoru chika danseiha kenshutsu no tame no silicone yoryogata kasokudo sensor no seisaku. 2. Japan.
Nishizawa, M, Lim, G, Niitsuma, H, and Esashi, M. 1997. "Development of micro capacitive accelerometer for subsurface microseismic measurement. Second Report; Micromachining ni yoru chika danseiha kenshutsu no tame no silicone yoryogata kasokudo sensor no seisaku. 2." Japan.
@misc{etde_622717,
title = {Development of micro capacitive accelerometer for subsurface microseismic measurement. Second Report; Micromachining ni yoru chika danseiha kenshutsu no tame no silicone yoryogata kasokudo sensor no seisaku. 2}
author = {Nishizawa, M, Lim, G, Niitsuma, H, and Esashi, M}
abstractNote = {Micromachining-aided manufacture is under way of a silicon capacitive accelerator sensor, high in sensitivity and broad in bandwidth, for detecting subsurface microseismic waves. The sensor detects acceleration by use of changes in capacities of the top and bottom capacitors generated when a spring-supported weight experiences displacement upon application of acceleration to the said weight. A diode bridge circuit is employed as the circuit for detecting acceleration. As for sensitivity of the sensor, when the virtual noise inputted into the electronic circuit is presumed at 1{mu}V and the circuit driving voltage at 5V, the sensor minimum detectability will be 2.5mgal in the presence of a 3{mu}m gap between the weight and an electrode plate. The natural vibration frequency is set at 1kHz. Such specifications may be realized using the current micromachining technology, and possibilities are that the bandwidth will be further expanded when the sensor is used in a servo-type configuration. The effort is still at the stage of acceleration sensor manufacturing, with a stopper just formed for the silicon weight. 9 refs., 6 figs., 1 tab.}
place = {Japan}
year = {1997}
month = {Oct}
}