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Application of 'SPICE' to predict temperature distribution in heat pipes

Abstract

This article presents a new alternative approach to predict temperature distribution in heat pipes. In this method, temperature distribution in a heat pipe, modelled as an analogous electrical circuit, is predicted by applying SPICE, a general-purpose circuit simulation program. SPICE is used to simulate electrical circuit designs before the prototype is assembled. Useful predictions are obtained for heat pipes with and without adiabatic sections and for heat pipes with various evaporator and condenser lengths. Comparison of the predicted results with experiments demonstrates fairly good agreement. It is also shown how interdisciplinary developments could be used appropriately. (author).
Authors:
Li, H M; Liu, Y; Damodaran, M [1] 
  1. Nanyang Technological Univ., Singapore (SG). School of Mechanical and Production Engineering
Publication Date:
Nov 01, 1991
Product Type:
Journal Article
Reference Number:
GB-91-052703; EDB-92-028973
Resource Relation:
Journal Name: International Journal of Heat and Mass Transfer; (United Kingdom); Journal Volume: 34:11
Subject:
42 ENGINEERING; HEAT PIPES; S CODES; TEMPERATURE DISTRIBUTION; HEAT TRANSFER; MATHEMATICAL MODELS; COMPUTER CODES; ENERGY TRANSFER; 420400* - Engineering- Heat Transfer & Fluid Flow
OSTI ID:
5888433
Country of Origin:
United Kingdom
Language:
English
Other Identifying Numbers:
Journal ID: ISSN 0017-9310; CODEN: IJHMA
Submitting Site:
GB
Size:
Pages: 2925-2928
Announcement Date:
Mar 01, 1992

Citation Formats

Li, H M, Liu, Y, and Damodaran, M. Application of 'SPICE' to predict temperature distribution in heat pipes. United Kingdom: N. p., 1991. Web. doi:10.1016/0017-9310(91)90253-B.
Li, H M, Liu, Y, & Damodaran, M. Application of 'SPICE' to predict temperature distribution in heat pipes. United Kingdom. doi:10.1016/0017-9310(91)90253-B.
Li, H M, Liu, Y, and Damodaran, M. 1991. "Application of 'SPICE' to predict temperature distribution in heat pipes." United Kingdom. doi:10.1016/0017-9310(91)90253-B. https://www.osti.gov/servlets/purl/10.1016/0017-9310(91)90253-B.
@misc{etde_5888433,
title = {Application of 'SPICE' to predict temperature distribution in heat pipes}
author = {Li, H M, Liu, Y, and Damodaran, M}
abstractNote = {This article presents a new alternative approach to predict temperature distribution in heat pipes. In this method, temperature distribution in a heat pipe, modelled as an analogous electrical circuit, is predicted by applying SPICE, a general-purpose circuit simulation program. SPICE is used to simulate electrical circuit designs before the prototype is assembled. Useful predictions are obtained for heat pipes with and without adiabatic sections and for heat pipes with various evaporator and condenser lengths. Comparison of the predicted results with experiments demonstrates fairly good agreement. It is also shown how interdisciplinary developments could be used appropriately. (author).}
doi = {10.1016/0017-9310(91)90253-B}
journal = {International Journal of Heat and Mass Transfer; (United Kingdom)}
volume = {34:11}
journal type = {AC}
place = {United Kingdom}
year = {1991}
month = {Nov}
}