This article presents a new alternative approach to predict temperature distribution in heat pipes. In this method, temperature distribution in a heat pipe, modelled as an analogous electrical circuit, is predicted by applying SPICE, a general-purpose circuit simulation program. SPICE is used to simulate electrical circuit designs before the prototype is assembled. Useful predictions are obtained for heat pipes with and without adiabatic sections and for heat pipes with various evaporator and condenser lengths. Comparison of the predicted results with experiments demonstrates fairly good agreement. It is also shown how interdisciplinary developments could be used appropriately. (author).