You need JavaScript to view this

High density microelectronics package using low temperature cofirable ceramics

Abstract

Low Temperature Cofired Ceramics (LTCC) is a relative new thick film process and has many engineering and manufacturing advantages over both the sequential thick film process and high temperature cofired ceramic modules. Because of low firing temperature, low sheet resistance metal conductors, commercial thick film resistors, and thick film capacitors can be buried in or printed on the substrates. A 3-D multilayer ceramic substrate can be prepared via laminating and co-firing process. The packing density of the LTCC substrates can be increased by this 3-D packing technology. At Kaohsiung Polytechnic Institute (KPI), a LTCC substrate system has been developed for high density packaging applications, which had buried surface capacitors and resistors. The developed cordierite-glass ceramic substrate, which has similar thermal expansion as silicon chip, is a promising material for microelectronic packaging. When the substrates were sintered at temperatures between 850-900 degree centigrade, a relative density higher than 96 % can be obtained. The substrate had a dielectric constant between 5.5 and 6.5. Ruthenium-based resistor pastes were used for resistors purposes. The resistors fabricated in/on the LTCC substrates were strongly depended on the microstructures developed in the resistor films. Surface resistors were laser trimmed in order to obtain specific values for  More>>
Authors:
Fu, S -L; Hsi, C -S; Chen, L -S; Lin, W K [1] 
  1. Kaoshiung Polytechnic Institute Ta-Hsu, Kaoshiung (China)
Publication Date:
Dec 31, 1997
Product Type:
Conference
Report Number:
INIS-AT-0007; CONF-9706311-
Reference Number:
SCA: 360200; 360204; 360201; PA: AIX-30:027293; EDB-99:060104; SN: 99002102449
Resource Relation:
Conference: 3. workshop on metal ceramic materials for functional applications, Vienna (Austria), 4-6 Jun 1997; Other Information: PBD: 1997; Related Information: Is Part Of 3rd Workshop on metal ceramic materials for functional applications; Korb, G. [Oesterreichisches Forschungszentrum Seibersdorf, 2444 Seibersdorf (Austria)]; PB: 389 p.
Subject:
36 MATERIALS SCIENCE; CALCINATION; CERAMICS; DIELECTRIC PROPERTIES; ELECTRIC CONDUCTIVITY; LEAD COMPOUNDS; METALS; MICROELECTRONICS; MICROSTRUCTURE; SINTERING
Sponsoring Organizations:
Bundesministerium fuer Wissenschaft, Forschung und Verkehr (Austria); Oesterreichische Wirtschaftskammer-Aussenwirtschaft (Austria)
OSTI ID:
348290
Research Organizations:
Oesterreichisches Forschungszentrum Seibersdorf, 2444 Seibersdorf (Austria)
Country of Origin:
Austria
Language:
English
Other Identifying Numbers:
Other: ON: DE99624568; TRN: AT9900065027293
Availability:
INIS; OSTI as DE99624568
Submitting Site:
INIS
Size:
pp. 193-210
Announcement Date:

Citation Formats

Fu, S -L, Hsi, C -S, Chen, L -S, and Lin, W K. High density microelectronics package using low temperature cofirable ceramics. Austria: N. p., 1997. Web.
Fu, S -L, Hsi, C -S, Chen, L -S, & Lin, W K. High density microelectronics package using low temperature cofirable ceramics. Austria.
Fu, S -L, Hsi, C -S, Chen, L -S, and Lin, W K. 1997. "High density microelectronics package using low temperature cofirable ceramics." Austria.
@misc{etde_348290,
title = {High density microelectronics package using low temperature cofirable ceramics}
author = {Fu, S -L, Hsi, C -S, Chen, L -S, and Lin, W K}
abstractNote = {Low Temperature Cofired Ceramics (LTCC) is a relative new thick film process and has many engineering and manufacturing advantages over both the sequential thick film process and high temperature cofired ceramic modules. Because of low firing temperature, low sheet resistance metal conductors, commercial thick film resistors, and thick film capacitors can be buried in or printed on the substrates. A 3-D multilayer ceramic substrate can be prepared via laminating and co-firing process. The packing density of the LTCC substrates can be increased by this 3-D packing technology. At Kaohsiung Polytechnic Institute (KPI), a LTCC substrate system has been developed for high density packaging applications, which had buried surface capacitors and resistors. The developed cordierite-glass ceramic substrate, which has similar thermal expansion as silicon chip, is a promising material for microelectronic packaging. When the substrates were sintered at temperatures between 850-900 degree centigrade, a relative density higher than 96 % can be obtained. The substrate had a dielectric constant between 5.5 and 6.5. Ruthenium-based resistor pastes were used for resistors purposes. The resistors fabricated in/on the LTCC substrates were strongly depended on the microstructures developed in the resistor films. Surface resistors were laser trimmed in order to obtain specific values for the resistors. Material with composition Pb(Fe{sub 2/3}W{sub 1/3}){sub x}(Fe{sub l/2}Nb{sub l/2}){sub y}Ti{sub 2}O{sub 3} was used as dielectric material of the capacitor in the substrate. The material can be sintered at temperatures between 850-930 degree centigrade, and has dielectric constant as high as 26000. After cofiring, good adhesion between dielectric and substrate layers was obtained. Combing the buried resistors and capacitors together with the lamination of LTCC layer, a 3-dimensional multilayered ceramic package was fabricated. (author)}
place = {Austria}
year = {1997}
month = {Dec}
}