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Assembling surface mounted components on ink-jet printed double sided paper circuit board

Abstract

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed  More>>
Authors:
Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Sidén, Johan; Nilsson, Hans-Erik; [1]  Hummelgård, Magnus; Olin, Håkan; [2]  Hummelgård, Christine [3] 
  1. Department of Electronics Design, Mid Sweden University, SE-851 70 Sundsvall (Sweden)
  2. Department of Natural Science, Mid Sweden University, SE-851 70 Sundsvall (Sweden)
  3. Acreo Swedish ICT AB, Håstaholmen 4, SE-824 42 Hudiksvall (Sweden)
Publication Date:
Mar 07, 2014
Product Type:
Journal Article
Resource Relation:
Journal Name: Nanotechnology; Journal Volume: 25; Journal Issue: 9; Other Information: Country of input: International Atomic Energy Agency (IAEA)
Subject:
77 NANOSCIENCE AND NANOTECHNOLOGY; INKS; INTEGRATED CIRCUITS; LAYERS; MANUFACTURING; SUBSTRATES; SURFACES
OSTI ID:
22476743
Country of Origin:
United Kingdom
Language:
English
Other Identifying Numbers:
Journal ID: ISSN 0957-4484; TRN: GB15I0436046637
Availability:
Available from http://dx.doi.org/10.1088/0957-4484/25/9/094002
Submitting Site:
INIS
Size:
[9 page(s)]
Announcement Date:
May 13, 2016

Citation Formats

Andersson, Henrik A, Manuilskiy, Anatoliy, Haller, Stefan, Sidén, Johan, Nilsson, Hans-Erik, Hummelgård, Magnus, Olin, Håkan, and Hummelgård, Christine. Assembling surface mounted components on ink-jet printed double sided paper circuit board. United Kingdom: N. p., 2014. Web. doi:10.1088/0957-4484/25/9/094002.
Andersson, Henrik A, Manuilskiy, Anatoliy, Haller, Stefan, Sidén, Johan, Nilsson, Hans-Erik, Hummelgård, Magnus, Olin, Håkan, & Hummelgård, Christine. Assembling surface mounted components on ink-jet printed double sided paper circuit board. United Kingdom. doi:10.1088/0957-4484/25/9/094002.
Andersson, Henrik A, Manuilskiy, Anatoliy, Haller, Stefan, Sidén, Johan, Nilsson, Hans-Erik, Hummelgård, Magnus, Olin, Håkan, and Hummelgård, Christine. 2014. "Assembling surface mounted components on ink-jet printed double sided paper circuit board." United Kingdom. doi:10.1088/0957-4484/25/9/094002. https://www.osti.gov/servlets/purl/10.1088/0957-4484/25/9/094002.
@misc{etde_22476743,
title = {Assembling surface mounted components on ink-jet printed double sided paper circuit board}
author = {Andersson, Henrik A, Manuilskiy, Anatoliy, Haller, Stefan, Sidén, Johan, Nilsson, Hans-Erik, Hummelgård, Magnus, Olin, Håkan, and Hummelgård, Christine}
abstractNote = {Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed. (paper)}
doi = {10.1088/0957-4484/25/9/094002}
journal = {Nanotechnology}
issue = {9}
volume = {25}
journal type = {AC}
place = {United Kingdom}
year = {2014}
month = {Mar}
}