Abstract
We have developed a new method for preparing a paste containing a high concentration of Ag nanoparticles for pressureless bonding. A nanoscale layer of polyvinylpyrrolidone coated on the nanoparticles prevents the coalescence of Ag nanoparticles. After heating in air, sintering and bonding occur after the decomposition of polyvinylpyrrolidone. Joint strengths were increased significantly using this new Ag nanoparticle paste as bonding material. Robust joints with shear strength above 20 MPa were formed even without additional bonding pressure.
Yan, Jianfeng;
[1]
Zou, Guisheng;
Wu, Ai-ping;
Ren, Jialie;
[1]
Yan, Jiuchun;
[2]
Hu, Anming;
[3]
Zhou, Y.;
[1]
Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, Canada N2L 3G1 (Canada)]
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, People's Republic of China (China)
- State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, People's Republic of China (China)
- Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, Canada N2L 3G1 (Canada)
Citation Formats
Yan, Jianfeng, Zou, Guisheng, Wu, Ai-ping, Ren, Jialie, Yan, Jiuchun, Hu, Anming, Zhou, Y., and Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, Canada N2L 3G1 (Canada)].
Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging.
United Kingdom: N. p.,
2012.
Web.
doi:10.1016/J.SCRIPTAMAT.2012.01.007.
Yan, Jianfeng, Zou, Guisheng, Wu, Ai-ping, Ren, Jialie, Yan, Jiuchun, Hu, Anming, Zhou, Y., & Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, Canada N2L 3G1 (Canada)].
Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging.
United Kingdom.
https://doi.org/10.1016/J.SCRIPTAMAT.2012.01.007
Yan, Jianfeng, Zou, Guisheng, Wu, Ai-ping, Ren, Jialie, Yan, Jiuchun, Hu, Anming, Zhou, Y., and Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, Canada N2L 3G1 (Canada)].
2012.
"Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging."
United Kingdom.
https://doi.org/10.1016/J.SCRIPTAMAT.2012.01.007.
@misc{etde_22203942,
title = {Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging}
author = {Yan, Jianfeng, Zou, Guisheng, Wu, Ai-ping, Ren, Jialie, Yan, Jiuchun, Hu, Anming, Zhou, Y., and Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, Canada N2L 3G1 (Canada)]}
abstractNote = {We have developed a new method for preparing a paste containing a high concentration of Ag nanoparticles for pressureless bonding. A nanoscale layer of polyvinylpyrrolidone coated on the nanoparticles prevents the coalescence of Ag nanoparticles. After heating in air, sintering and bonding occur after the decomposition of polyvinylpyrrolidone. Joint strengths were increased significantly using this new Ag nanoparticle paste as bonding material. Robust joints with shear strength above 20 MPa were formed even without additional bonding pressure.}
doi = {10.1016/J.SCRIPTAMAT.2012.01.007}
journal = []
issue = {8}
volume = {66}
journal type = {AC}
place = {United Kingdom}
year = {2012}
month = {Apr}
}
title = {Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging}
author = {Yan, Jianfeng, Zou, Guisheng, Wu, Ai-ping, Ren, Jialie, Yan, Jiuchun, Hu, Anming, Zhou, Y., and Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, Canada N2L 3G1 (Canada)]}
abstractNote = {We have developed a new method for preparing a paste containing a high concentration of Ag nanoparticles for pressureless bonding. A nanoscale layer of polyvinylpyrrolidone coated on the nanoparticles prevents the coalescence of Ag nanoparticles. After heating in air, sintering and bonding occur after the decomposition of polyvinylpyrrolidone. Joint strengths were increased significantly using this new Ag nanoparticle paste as bonding material. Robust joints with shear strength above 20 MPa were formed even without additional bonding pressure.}
doi = {10.1016/J.SCRIPTAMAT.2012.01.007}
journal = []
issue = {8}
volume = {66}
journal type = {AC}
place = {United Kingdom}
year = {2012}
month = {Apr}
}