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Liquidus projection and thermodynamic modeling of Sn-Zn-Cu ternary system

Abstract

The ternary Sn-Zn-Cu system is of interest for the electronic solder applications. Its liquidus projection was experimentally determined and the system was thermodynamically modeled in this study. Sn-Zn-Cu alloys of various compositions were prepared. Differential thermal analysis was employed to determine the reaction temperatures and solidification sequences. The solidified samples were metallographically examined and the primary solidification phases were determined. There is no ternary compound. The primary solidification phases are the terminal solid solutions and binary intermetallic compounds, and they are Sn, {eta}-Cu{sub 6}Sn{sub 5}, {epsilon}-Cu{sub 3}Sn, {gamma}-(Cu-Sn), {beta}, Cu, {gamma}-Cu{sub 5}Zn{sub 8}, {delta}-CuZn{sub 3}, {epsilon}-CuZn{sub 5} and Zn. Thermodynamic modeling was developed from the models of the constituent binary systems and the experimental results from this study and those in the literature. The calculated isothermal sections and liquidus projection are in agreement with the experimental determinations. Six class II and one class III invariant reactions are found in the Sn-Zn-Cu system.
Authors:
Yuchih, Huang; [1]  Chen Sinnwen , E-mail: swchen@mx.nthu.edu.tw; [1]  Chinyi, Chou; [2]  Gierlotka, Wojciech; [1]  Non-Ferrous Metals Department, AGH University of Science and Technology, Krakow (Poland)]
  1. Department of Chemical Engineering, National Tsing Hua University, 101, Sec. 2, Kuang-fu Road, Hsin-Chu 300, Taiwan (China)
  2. Department of Materials Science and Engineering, National Tsing Hua University, Hsin-Chu, Taiwan (China)
Publication Date:
May 27, 2009
Product Type:
Journal Article
Resource Relation:
Journal Name: Journal of Alloys and Compounds; Journal Volume: 477; Journal Issue: 1-2; Other Information: DOI: 10.1016/j.jallcom.2008.10.156; PII: S0925-8388(08)01981-6; Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved; Country of input: International Atomic Energy Agency (IAEA)
Subject:
36 MATERIALS SCIENCE; COPPER ALLOYS; DIFFERENTIAL THERMAL ANALYSIS; INTERMETALLIC COMPOUNDS; QUENCHING; SIMULATION; SOLID SOLUTIONS; SOLIDIFICATION; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; ZINC ALLOYS
OSTI ID:
21295951
Country of Origin:
Netherlands
Language:
English
Other Identifying Numbers:
Journal ID: ISSN 0925-8388; JALCEU; TRN: NL09R8934042223
Availability:
Available from http://dx.doi.org/10.1016/j.jallcom.2008.10.156;INIS
Submitting Site:
NLN
Size:
page(s) 283-290
Announcement Date:
Jun 03, 2010

Citation Formats

Yuchih, Huang, Chen Sinnwen , E-mail: swchen@mx.nthu.edu.tw, Chinyi, Chou, Gierlotka, Wojciech, and Non-Ferrous Metals Department, AGH University of Science and Technology, Krakow (Poland)]. Liquidus projection and thermodynamic modeling of Sn-Zn-Cu ternary system. Netherlands: N. p., 2009. Web. doi:10.1016/j.jallcom.2008.10.156.
Yuchih, Huang, Chen Sinnwen , E-mail: swchen@mx.nthu.edu.tw, Chinyi, Chou, Gierlotka, Wojciech, & Non-Ferrous Metals Department, AGH University of Science and Technology, Krakow (Poland)]. Liquidus projection and thermodynamic modeling of Sn-Zn-Cu ternary system. Netherlands. https://doi.org/10.1016/j.jallcom.2008.10.156
Yuchih, Huang, Chen Sinnwen , E-mail: swchen@mx.nthu.edu.tw, Chinyi, Chou, Gierlotka, Wojciech, and Non-Ferrous Metals Department, AGH University of Science and Technology, Krakow (Poland)]. 2009. "Liquidus projection and thermodynamic modeling of Sn-Zn-Cu ternary system." Netherlands. https://doi.org/10.1016/j.jallcom.2008.10.156.
@misc{etde_21295951,
title = {Liquidus projection and thermodynamic modeling of Sn-Zn-Cu ternary system}
author = {Yuchih, Huang, Chen Sinnwen , E-mail: swchen@mx.nthu.edu.tw, Chinyi, Chou, Gierlotka, Wojciech, and Non-Ferrous Metals Department, AGH University of Science and Technology, Krakow (Poland)]}
abstractNote = {The ternary Sn-Zn-Cu system is of interest for the electronic solder applications. Its liquidus projection was experimentally determined and the system was thermodynamically modeled in this study. Sn-Zn-Cu alloys of various compositions were prepared. Differential thermal analysis was employed to determine the reaction temperatures and solidification sequences. The solidified samples were metallographically examined and the primary solidification phases were determined. There is no ternary compound. The primary solidification phases are the terminal solid solutions and binary intermetallic compounds, and they are Sn, {eta}-Cu{sub 6}Sn{sub 5}, {epsilon}-Cu{sub 3}Sn, {gamma}-(Cu-Sn), {beta}, Cu, {gamma}-Cu{sub 5}Zn{sub 8}, {delta}-CuZn{sub 3}, {epsilon}-CuZn{sub 5} and Zn. Thermodynamic modeling was developed from the models of the constituent binary systems and the experimental results from this study and those in the literature. The calculated isothermal sections and liquidus projection are in agreement with the experimental determinations. Six class II and one class III invariant reactions are found in the Sn-Zn-Cu system.}
doi = {10.1016/j.jallcom.2008.10.156}
journal = []
issue = {1-2}
volume = {477}
place = {Netherlands}
year = {2009}
month = {May}
}