Abstract
Textured silicon nitride (Si{sub 3}N{sub 4}) has been intensively studied over the past 15 years because of its use for achieving its superthermal and mechanical properties. In this review we present the fundamental aspects of the processing and anisotropic properties of textured Si{sub 3}N{sub 4}, with emphasis on the anisotropic and abnormal grain growth of {beta}-Si{sub 3}N{sub 4}, texture structure and texture analysis, processing methods and anisotropic properties. On the basis of the texturing mechanisms, the processing methods described in this article have been classified into two types: hot-working (HW) and templated grain growth (TGG). The HW method includes the hot-pressing, hot-forging and sinter-forging techniques, and the TGG method includes the cold-pressing, extrusion, tape-casting and strong magnetic field alignment techniques for {beta}-Si{sub 3}N{sub 4} seed crystals. Each processing technique is thoroughly discussed in terms of theoretical models and experimental data, including the texturing mechanisms and the factors affecting texture development. Also, methods of synthesizing the rodlike {beta}-Si{sub 3}N{sub 4} single crystals are presented. Various anisotropic properties of textured Si{sub 3} N{sub 4} and their origins are thoroughly described and discussed, such as hardness, elastic modulus, bending strength, fracture toughness, fracture energy, creep behavior, tribological and wear behavior, erosion behavior, contact
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Xinwen, Zhu;
Sakka, Yoshio
[1]
- Nano Ceramics Center and World Premier International Research Center Initiative (WPI Initiative) for Materials Nanoarchitectonics (MANA), National Institute for Materials Science - NIMS, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047 (Japan)
Citation Formats
Xinwen, Zhu, and Sakka, Yoshio.
Textured silicon nitride: processing and anisotropic properties.
United Kingdom: N. p.,
2008.
Web.
doi:10.1088/1468-6996/9/3/033001; COUNTRY OF INPUT: INTERNATIONAL ATOMIC ENERGY AGENCY (IAEA).
Xinwen, Zhu, & Sakka, Yoshio.
Textured silicon nitride: processing and anisotropic properties.
United Kingdom.
https://doi.org/10.1088/1468-6996/9/3/033001; COUNTRY OF INPUT: INTERNATIONAL ATOMIC ENERGY AGENCY (IAEA)
Xinwen, Zhu, and Sakka, Yoshio.
2008.
"Textured silicon nitride: processing and anisotropic properties."
United Kingdom.
https://doi.org/10.1088/1468-6996/9/3/033001; COUNTRY OF INPUT: INTERNATIONAL ATOMIC ENERGY AGENCY (IAEA).
@misc{etde_21092329,
title = {Textured silicon nitride: processing and anisotropic properties}
author = {Xinwen, Zhu, and Sakka, Yoshio}
abstractNote = {Textured silicon nitride (Si{sub 3}N{sub 4}) has been intensively studied over the past 15 years because of its use for achieving its superthermal and mechanical properties. In this review we present the fundamental aspects of the processing and anisotropic properties of textured Si{sub 3}N{sub 4}, with emphasis on the anisotropic and abnormal grain growth of {beta}-Si{sub 3}N{sub 4}, texture structure and texture analysis, processing methods and anisotropic properties. On the basis of the texturing mechanisms, the processing methods described in this article have been classified into two types: hot-working (HW) and templated grain growth (TGG). The HW method includes the hot-pressing, hot-forging and sinter-forging techniques, and the TGG method includes the cold-pressing, extrusion, tape-casting and strong magnetic field alignment techniques for {beta}-Si{sub 3}N{sub 4} seed crystals. Each processing technique is thoroughly discussed in terms of theoretical models and experimental data, including the texturing mechanisms and the factors affecting texture development. Also, methods of synthesizing the rodlike {beta}-Si{sub 3}N{sub 4} single crystals are presented. Various anisotropic properties of textured Si{sub 3} N{sub 4} and their origins are thoroughly described and discussed, such as hardness, elastic modulus, bending strength, fracture toughness, fracture energy, creep behavior, tribological and wear behavior, erosion behavior, contact damage behavior and thermal conductivity. Models are analyzed to determine the thermal anisotropy by considering the intrinsic thermal anisotropy, degree of orientation and various microstructure factors. Textured porous Si{sub 3}N{sub 4} with a unique microstructure composed of oriented elongated {beta}-Si{sub 3}N{sub 4} and anisotropic pores is also described for the first time, with emphasis on its unique mechanical and thermal-mechanical properties. Moreover, as an important related material, textured {alpha}-Sialon is also reviewed, because the presence of elongated {alpha}-Sialon grains allows the production of textured {alpha}-Sialon using the same methods as those used for textured {beta}-Si{sub 3}N{sub 4} and {beta}-Sialon. (topical review)}
doi = {10.1088/1468-6996/9/3/033001; COUNTRY OF INPUT: INTERNATIONAL ATOMIC ENERGY AGENCY (IAEA)}
journal = []
issue = {3}
volume = {9}
place = {United Kingdom}
year = {2008}
month = {Jul}
}
title = {Textured silicon nitride: processing and anisotropic properties}
author = {Xinwen, Zhu, and Sakka, Yoshio}
abstractNote = {Textured silicon nitride (Si{sub 3}N{sub 4}) has been intensively studied over the past 15 years because of its use for achieving its superthermal and mechanical properties. In this review we present the fundamental aspects of the processing and anisotropic properties of textured Si{sub 3}N{sub 4}, with emphasis on the anisotropic and abnormal grain growth of {beta}-Si{sub 3}N{sub 4}, texture structure and texture analysis, processing methods and anisotropic properties. On the basis of the texturing mechanisms, the processing methods described in this article have been classified into two types: hot-working (HW) and templated grain growth (TGG). The HW method includes the hot-pressing, hot-forging and sinter-forging techniques, and the TGG method includes the cold-pressing, extrusion, tape-casting and strong magnetic field alignment techniques for {beta}-Si{sub 3}N{sub 4} seed crystals. Each processing technique is thoroughly discussed in terms of theoretical models and experimental data, including the texturing mechanisms and the factors affecting texture development. Also, methods of synthesizing the rodlike {beta}-Si{sub 3}N{sub 4} single crystals are presented. Various anisotropic properties of textured Si{sub 3} N{sub 4} and their origins are thoroughly described and discussed, such as hardness, elastic modulus, bending strength, fracture toughness, fracture energy, creep behavior, tribological and wear behavior, erosion behavior, contact damage behavior and thermal conductivity. Models are analyzed to determine the thermal anisotropy by considering the intrinsic thermal anisotropy, degree of orientation and various microstructure factors. Textured porous Si{sub 3}N{sub 4} with a unique microstructure composed of oriented elongated {beta}-Si{sub 3}N{sub 4} and anisotropic pores is also described for the first time, with emphasis on its unique mechanical and thermal-mechanical properties. Moreover, as an important related material, textured {alpha}-Sialon is also reviewed, because the presence of elongated {alpha}-Sialon grains allows the production of textured {alpha}-Sialon using the same methods as those used for textured {beta}-Si{sub 3}N{sub 4} and {beta}-Sialon. (topical review)}
doi = {10.1088/1468-6996/9/3/033001; COUNTRY OF INPUT: INTERNATIONAL ATOMIC ENERGY AGENCY (IAEA)}
journal = []
issue = {3}
volume = {9}
place = {United Kingdom}
year = {2008}
month = {Jul}
}