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Application of phase change materials in thermal management of electronics

Abstract

Application of a novel PCM package for thermal management of portable electronic devices was investigated experimentally for effects of various parameters e.g. power input, orientation of package, and various melting/freezing times under cyclic steady conditions. Also, a two-dimensional numerical study was made and compared the experimental results. Results show that increased power inputs increase the melting rate, while orientation of the package to gravity has negligible effect on the thermal performance of the PCM package. The thermal resistance of the device and the power level applied to the PCM package are of critical importance for design of a passive thermal control system. Comparison with numerical results confirms that PCM-based design is an excellent candidate design for transient electronic cooling applications.
Authors:
Kandasamy, Ravi; [1]  Wang Xiangqi , E-mail: x.wang@nus.edu.sg; [1]  Mujumdar, Arun S [1] 
  1. Department of Mechanical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore 119260 (Singapore)
Publication Date:
Dec 15, 2007
Product Type:
Journal Article
Resource Relation:
Journal Name: Applied Thermal Engineering; Journal Volume: 27; Journal Issue: 17-18; Other Information: DOI: 10.1016/j.applthermaleng.2006.12.013; PII: S1359-4311(07)00006-3; Copyright (c) 2007 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved; Country of input: International Atomic Energy Agency (IAEA)
Subject:
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; COMPARATIVE EVALUATIONS; CONTROL SYSTEMS; COOLING; DESIGN; ELECTRONIC EQUIPMENT; FREEZING; MANAGEMENT; MELTING; NUMERICAL ANALYSIS; PERFORMANCE; PHASE CHANGE MATERIALS; POWER INPUT; STEADY-STATE CONDITIONS; TWO-DIMENSIONAL CALCULATIONS; USES
OSTI ID:
21026035
Country of Origin:
United Kingdom
Language:
English
Other Identifying Numbers:
Journal ID: ISSN 1359-4311; ATENFT; TRN: GB08R0516047937
Availability:
Available from http://dx.doi.org/10.1016/j.applthermaleng.2006.12.013;INIS
Submitting Site:
GBN
Size:
page(s) 2822-2832
Announcement Date:
Jun 02, 2008

Citation Formats

Kandasamy, Ravi, Wang Xiangqi , E-mail: x.wang@nus.edu.sg, and Mujumdar, Arun S. Application of phase change materials in thermal management of electronics. United Kingdom: N. p., 2007. Web. doi:10.1016/j.applthermaleng.2006.12.013.
Kandasamy, Ravi, Wang Xiangqi , E-mail: x.wang@nus.edu.sg, & Mujumdar, Arun S. Application of phase change materials in thermal management of electronics. United Kingdom. https://doi.org/10.1016/j.applthermaleng.2006.12.013
Kandasamy, Ravi, Wang Xiangqi , E-mail: x.wang@nus.edu.sg, and Mujumdar, Arun S. 2007. "Application of phase change materials in thermal management of electronics." United Kingdom. https://doi.org/10.1016/j.applthermaleng.2006.12.013.
@misc{etde_21026035,
title = {Application of phase change materials in thermal management of electronics}
author = {Kandasamy, Ravi, Wang Xiangqi , E-mail: x.wang@nus.edu.sg, and Mujumdar, Arun S}
abstractNote = {Application of a novel PCM package for thermal management of portable electronic devices was investigated experimentally for effects of various parameters e.g. power input, orientation of package, and various melting/freezing times under cyclic steady conditions. Also, a two-dimensional numerical study was made and compared the experimental results. Results show that increased power inputs increase the melting rate, while orientation of the package to gravity has negligible effect on the thermal performance of the PCM package. The thermal resistance of the device and the power level applied to the PCM package are of critical importance for design of a passive thermal control system. Comparison with numerical results confirms that PCM-based design is an excellent candidate design for transient electronic cooling applications.}
doi = {10.1016/j.applthermaleng.2006.12.013}
journal = []
issue = {17-18}
volume = {27}
place = {United Kingdom}
year = {2007}
month = {Dec}
}