You need JavaScript to view this

Plasma-enhanced chemical vapor deposition for YBCO film fabrication of superconducting fault-current limiter

Abstract

Since the high-temperature superconductor of oxide type was founded, many researches and efforts have been performed for finding its application field. The YBCO superconducting film fabricated on economic metal substrate with uniform critical current density is considered as superconducting fault-current limiter (SFCL). There are physical and chemical processes to fabricate superconductor film, and it is understood that the chemical methods are more economic to deposit large area. Among them, chemical vapor deposition (CVD) is a promising deposition method in obtaining film uniformity. To solve the problems due to the high deposition temperature of thermal CVD, plasma-enhanced chemical vapor deposition (PECVD) is suggested. This report describes the principle and fabrication trend of SFCL, example of YBCO film deposition by PECVD method, and principle of plasma deposition.
Publication Date:
May 15, 2006
Product Type:
Technical Report
Report Number:
KAERI/AR-752/2006
Resource Relation:
Other Information: 9 refs, 16 figs, 7 tabs
Subject:
36 MATERIALS SCIENCE; CHEMICAL VAPOR DEPOSITION; CURRENT DENSITY; CURRENT LIMITERS; FABRICATION; FILMS; PLASMA; SUBSTRATES
OSTI ID:
20823223
Research Organizations:
Korea Atomic Energy Research Institute, Taejon (Korea, Republic of)
Country of Origin:
Korea, Republic of
Language:
Korean
Other Identifying Numbers:
TRN: KR0602905122260
Availability:
Available from INIS in electronic form; Also available from Korea Atomic Energy Research Institute, Taejon (Korea, Republic of)
Submitting Site:
KRN
Size:
31 pages
Announcement Date:
Dec 30, 2006

Citation Formats

Jun, Byung Hyuk, and Kim, Chan Joong. Plasma-enhanced chemical vapor deposition for YBCO film fabrication of superconducting fault-current limiter. Korea, Republic of: N. p., 2006. Web.
Jun, Byung Hyuk, & Kim, Chan Joong. Plasma-enhanced chemical vapor deposition for YBCO film fabrication of superconducting fault-current limiter. Korea, Republic of.
Jun, Byung Hyuk, and Kim, Chan Joong. 2006. "Plasma-enhanced chemical vapor deposition for YBCO film fabrication of superconducting fault-current limiter." Korea, Republic of.
@misc{etde_20823223,
title = {Plasma-enhanced chemical vapor deposition for YBCO film fabrication of superconducting fault-current limiter}
author = {Jun, Byung Hyuk, and Kim, Chan Joong}
abstractNote = {Since the high-temperature superconductor of oxide type was founded, many researches and efforts have been performed for finding its application field. The YBCO superconducting film fabricated on economic metal substrate with uniform critical current density is considered as superconducting fault-current limiter (SFCL). There are physical and chemical processes to fabricate superconductor film, and it is understood that the chemical methods are more economic to deposit large area. Among them, chemical vapor deposition (CVD) is a promising deposition method in obtaining film uniformity. To solve the problems due to the high deposition temperature of thermal CVD, plasma-enhanced chemical vapor deposition (PECVD) is suggested. This report describes the principle and fabrication trend of SFCL, example of YBCO film deposition by PECVD method, and principle of plasma deposition.}
place = {Korea, Republic of}
year = {2006}
month = {May}
}