Abstract
An in-plane X-ray diffraction technique was used to measure the residual stress of a CVD (chemical vapor deposition) TiN-coated WC-Co alloy. We could obtain the diffraction pattern from a thin film layer, eliminating that of the substrate. In the case of a conventional X-ray diffractometer, the X-ray penetration depth is about few {mu}m. However, for a grazing incidence beam it is only 0.2{mu}m. Depth profiles of residual stress in TiN film layer were evaluated by the present method and the conventional sin{sup 2}{psi} technique. We concluded that the in-plane diffraction technique enables us to determine the residual stress in a DVD-TiN film having an oriented texture. It was found that the residual tensile stress generated a mismatch of the coefficient of thermal expansion between the film and the substrate. (author)
Takago, Shigeki;
Yasui, Haruyuki;
Awazu, Kaoru;
[1]
Sasaki, Toshihiko;
Hirose, Yukio;
[2]
Sakurai, Kenji
[3]
- Industrial Research Inst. of Ishikawa, Kanazawa, Ishikawa (Japan)
- Kanazawa Univ., Dept. of Materials Science and Engineering, Kanazawa, Ishikawa (Japan)
- National Inst. for Materials Science, Tsukuba, Ibaraki (Japan)
Citation Formats
Takago, Shigeki, Yasui, Haruyuki, Awazu, Kaoru, Sasaki, Toshihiko, Hirose, Yukio, and Sakurai, Kenji.
Application of in-plane x-ray diffraction technique for residual stress measurement of TiN film/WC-Co alloy.
Japan: N. p.,
2006.
Web.
doi:10.2116/bunsekikagaku.55.405.
Takago, Shigeki, Yasui, Haruyuki, Awazu, Kaoru, Sasaki, Toshihiko, Hirose, Yukio, & Sakurai, Kenji.
Application of in-plane x-ray diffraction technique for residual stress measurement of TiN film/WC-Co alloy.
Japan.
https://doi.org/10.2116/bunsekikagaku.55.405
Takago, Shigeki, Yasui, Haruyuki, Awazu, Kaoru, Sasaki, Toshihiko, Hirose, Yukio, and Sakurai, Kenji.
2006.
"Application of in-plane x-ray diffraction technique for residual stress measurement of TiN film/WC-Co alloy."
Japan.
https://doi.org/10.2116/bunsekikagaku.55.405.
@misc{etde_20791737,
title = {Application of in-plane x-ray diffraction technique for residual stress measurement of TiN film/WC-Co alloy}
author = {Takago, Shigeki, Yasui, Haruyuki, Awazu, Kaoru, Sasaki, Toshihiko, Hirose, Yukio, and Sakurai, Kenji}
abstractNote = {An in-plane X-ray diffraction technique was used to measure the residual stress of a CVD (chemical vapor deposition) TiN-coated WC-Co alloy. We could obtain the diffraction pattern from a thin film layer, eliminating that of the substrate. In the case of a conventional X-ray diffractometer, the X-ray penetration depth is about few {mu}m. However, for a grazing incidence beam it is only 0.2{mu}m. Depth profiles of residual stress in TiN film layer were evaluated by the present method and the conventional sin{sup 2}{psi} technique. We concluded that the in-plane diffraction technique enables us to determine the residual stress in a DVD-TiN film having an oriented texture. It was found that the residual tensile stress generated a mismatch of the coefficient of thermal expansion between the film and the substrate. (author)}
doi = {10.2116/bunsekikagaku.55.405}
journal = []
issue = {6}
volume = {55}
place = {Japan}
year = {2006}
month = {Jun}
}
title = {Application of in-plane x-ray diffraction technique for residual stress measurement of TiN film/WC-Co alloy}
author = {Takago, Shigeki, Yasui, Haruyuki, Awazu, Kaoru, Sasaki, Toshihiko, Hirose, Yukio, and Sakurai, Kenji}
abstractNote = {An in-plane X-ray diffraction technique was used to measure the residual stress of a CVD (chemical vapor deposition) TiN-coated WC-Co alloy. We could obtain the diffraction pattern from a thin film layer, eliminating that of the substrate. In the case of a conventional X-ray diffractometer, the X-ray penetration depth is about few {mu}m. However, for a grazing incidence beam it is only 0.2{mu}m. Depth profiles of residual stress in TiN film layer were evaluated by the present method and the conventional sin{sup 2}{psi} technique. We concluded that the in-plane diffraction technique enables us to determine the residual stress in a DVD-TiN film having an oriented texture. It was found that the residual tensile stress generated a mismatch of the coefficient of thermal expansion between the film and the substrate. (author)}
doi = {10.2116/bunsekikagaku.55.405}
journal = []
issue = {6}
volume = {55}
place = {Japan}
year = {2006}
month = {Jun}
}