Abstract
A new vacuum deposition process, named reactive evaporation, is used to realize passive thin film circuits. Using aluminium, oxidized at various steps in its vapor phase, we obtain: - Al-Al{sub 2}O{sub 3} cermet resistors (R{sub {open_square}} = 10000 {omega}{sub {open_square}}, CTR <{+-} 150 ppm/deg. C) which show oscillations of the resistivity versus the thickness of the layer, in distinction to classical theory. - Al{sub 2}O{sub 3} capacitors (C{sub {open_square}} = 60000 pf/cm{sup 2}, tg {delta} < 0.5 per cent). These thin film components present good electrical behaviour and should find interesting applications in integrated circuits. (author) [French] Une nouvelle technique de depot sous vide, l'evaporation reactive est utilisee pour realiser des circuits passifs en couches minces. En oxydant, en phase vapeur, de l'aluminium a differents degres, on obtient: - des resistances en cermet Al-Al{sub 2}O{sub 3} (R{sub {open_square}} = 10000 {omega}{sub {open_square}}, CTR <{+-} 150 ppm) dont Ia resistivite oscille en fonction de l'epaisseur, contrairement aux previsions de la theorie classique. - Des capacites en Al{sub 2}O{sub 3} (C{sub {open_square}} = 60000 pf/cm{sup 2}, tg {delta} < 0.5 pour cent). Ces elements presentent de bonnes caracteristiques electriques et seraient avantageusement utilises en circuits integres. (auteur)
Pruniaux, B
[1]
- Commissariat a l'Energie Atomique, 38 - Grenoble (France). Centre d'Etudes Nucleaires
Citation Formats
Pruniaux, B.
Production and study of mixed Al-Al{sub 2}O{sub 3} thin films for passive electronic circuits; Realisation et etude des couches minces mixtes Al-Al{sub 2}O{sub 3} pour circuits electroniques passifs.
France: N. p.,
1967.
Web.
Pruniaux, B.
Production and study of mixed Al-Al{sub 2}O{sub 3} thin films for passive electronic circuits; Realisation et etude des couches minces mixtes Al-Al{sub 2}O{sub 3} pour circuits electroniques passifs.
France.
Pruniaux, B.
1967.
"Production and study of mixed Al-Al{sub 2}O{sub 3} thin films for passive electronic circuits; Realisation et etude des couches minces mixtes Al-Al{sub 2}O{sub 3} pour circuits electroniques passifs."
France.
@misc{etde_20626208,
title = {Production and study of mixed Al-Al{sub 2}O{sub 3} thin films for passive electronic circuits; Realisation et etude des couches minces mixtes Al-Al{sub 2}O{sub 3} pour circuits electroniques passifs}
author = {Pruniaux, B}
abstractNote = {A new vacuum deposition process, named reactive evaporation, is used to realize passive thin film circuits. Using aluminium, oxidized at various steps in its vapor phase, we obtain: - Al-Al{sub 2}O{sub 3} cermet resistors (R{sub {open_square}} = 10000 {omega}{sub {open_square}}, CTR <{+-} 150 ppm/deg. C) which show oscillations of the resistivity versus the thickness of the layer, in distinction to classical theory. - Al{sub 2}O{sub 3} capacitors (C{sub {open_square}} = 60000 pf/cm{sup 2}, tg {delta} < 0.5 per cent). These thin film components present good electrical behaviour and should find interesting applications in integrated circuits. (author) [French] Une nouvelle technique de depot sous vide, l'evaporation reactive est utilisee pour realiser des circuits passifs en couches minces. En oxydant, en phase vapeur, de l'aluminium a differents degres, on obtient: - des resistances en cermet Al-Al{sub 2}O{sub 3} (R{sub {open_square}} = 10000 {omega}{sub {open_square}}, CTR <{+-} 150 ppm) dont Ia resistivite oscille en fonction de l'epaisseur, contrairement aux previsions de la theorie classique. - Des capacites en Al{sub 2}O{sub 3} (C{sub {open_square}} = 60000 pf/cm{sup 2}, tg {delta} < 0.5 pour cent). Ces elements presentent de bonnes caracteristiques electriques et seraient avantageusement utilises en circuits integres. (auteur)}
place = {France}
year = {1967}
month = {Jul}
}
title = {Production and study of mixed Al-Al{sub 2}O{sub 3} thin films for passive electronic circuits; Realisation et etude des couches minces mixtes Al-Al{sub 2}O{sub 3} pour circuits electroniques passifs}
author = {Pruniaux, B}
abstractNote = {A new vacuum deposition process, named reactive evaporation, is used to realize passive thin film circuits. Using aluminium, oxidized at various steps in its vapor phase, we obtain: - Al-Al{sub 2}O{sub 3} cermet resistors (R{sub {open_square}} = 10000 {omega}{sub {open_square}}, CTR <{+-} 150 ppm/deg. C) which show oscillations of the resistivity versus the thickness of the layer, in distinction to classical theory. - Al{sub 2}O{sub 3} capacitors (C{sub {open_square}} = 60000 pf/cm{sup 2}, tg {delta} < 0.5 per cent). These thin film components present good electrical behaviour and should find interesting applications in integrated circuits. (author) [French] Une nouvelle technique de depot sous vide, l'evaporation reactive est utilisee pour realiser des circuits passifs en couches minces. En oxydant, en phase vapeur, de l'aluminium a differents degres, on obtient: - des resistances en cermet Al-Al{sub 2}O{sub 3} (R{sub {open_square}} = 10000 {omega}{sub {open_square}}, CTR <{+-} 150 ppm) dont Ia resistivite oscille en fonction de l'epaisseur, contrairement aux previsions de la theorie classique. - Des capacites en Al{sub 2}O{sub 3} (C{sub {open_square}} = 60000 pf/cm{sup 2}, tg {delta} < 0.5 pour cent). Ces elements presentent de bonnes caracteristiques electriques et seraient avantageusement utilises en circuits integres. (auteur)}
place = {France}
year = {1967}
month = {Jul}
}