You need JavaScript to view this

Research and development of basic technologies for the next generation industries, 'three-dimensional circuit elements'. Evaluation on the research and development; Jisedai sangyo kiban gijutsu kenkyu kaihatsu 'sanjigen kairo soshi'. Kenkyu kaihatsu hyoka

Abstract

Research, development and evaluation were performed with an objective of establishing the basic technology related to three-dimensional circuit elements that integrate functions at ultra-high density. For the basic technology of lamination, the SOI technology suitable for the three-dimensional circuit elements was developed, and it has become possible to manufacture high-quality multi-layered crystalline structure by means of annealing that uses laser and electron beam. In addition, a lateral epitaxial technology for solid phase was developed, and the base to be applied to the three-dimensional circuit elements was established. Furthermore, the technology to put thin film circuits together would be useful for high-density integration in the future. The three-dimensional circuit makes parallel processing in each segment possible, whereas a possibility was shown that the processing can be performed at much higher speed than before. Actually a prototype three-dimensional circuit equipped with functions for parallel processing and judgment processing was fabricated. The image pre-processing which has been impossible on the real time basis in the conventional two-dimensional integrated circuit was realized in a speed as fast as milli-second order. These achievements lead to a belief that the targets for the present research and development have been achieved. (NEDO)
Authors:
"NONE"
Publication Date:
Apr 01, 1991
Product Type:
Technical Report
Report Number:
JP-NEDO-010018135
Resource Relation:
Other Information: PBD: Apr 1991
Subject:
42 ENGINEERING; INTEGRATED CIRCUITS; LASERS; ELECTRON BEAMS; ANNEALING; CRYSTAL STRUCTURE; EPITAXY; THIN FILMS; IMAGE PROCESSING
OSTI ID:
20091737
Research Organizations:
New Energy and Industrial Technology Development Organization, Tokyo (Japan)
Country of Origin:
Japan
Language:
Japanese
Other Identifying Numbers:
TRN: JN0040143
Availability:
Available to ETDE participating countries only(see www.etde.org); commercial reproduction prohibited; OSTI as DE20091737
Submitting Site:
NEDO
Size:
286 pages
Announcement Date:

Citation Formats

Research and development of basic technologies for the next generation industries, 'three-dimensional circuit elements'. Evaluation on the research and development; Jisedai sangyo kiban gijutsu kenkyu kaihatsu 'sanjigen kairo soshi'. Kenkyu kaihatsu hyoka. Japan: N. p., 1991. Web.
Research and development of basic technologies for the next generation industries, 'three-dimensional circuit elements'. Evaluation on the research and development; Jisedai sangyo kiban gijutsu kenkyu kaihatsu 'sanjigen kairo soshi'. Kenkyu kaihatsu hyoka. Japan.
1991. "Research and development of basic technologies for the next generation industries, 'three-dimensional circuit elements'. Evaluation on the research and development; Jisedai sangyo kiban gijutsu kenkyu kaihatsu 'sanjigen kairo soshi'. Kenkyu kaihatsu hyoka." Japan.
@misc{etde_20091737,
title = {Research and development of basic technologies for the next generation industries, 'three-dimensional circuit elements'. Evaluation on the research and development; Jisedai sangyo kiban gijutsu kenkyu kaihatsu 'sanjigen kairo soshi'. Kenkyu kaihatsu hyoka}
abstractNote = {Research, development and evaluation were performed with an objective of establishing the basic technology related to three-dimensional circuit elements that integrate functions at ultra-high density. For the basic technology of lamination, the SOI technology suitable for the three-dimensional circuit elements was developed, and it has become possible to manufacture high-quality multi-layered crystalline structure by means of annealing that uses laser and electron beam. In addition, a lateral epitaxial technology for solid phase was developed, and the base to be applied to the three-dimensional circuit elements was established. Furthermore, the technology to put thin film circuits together would be useful for high-density integration in the future. The three-dimensional circuit makes parallel processing in each segment possible, whereas a possibility was shown that the processing can be performed at much higher speed than before. Actually a prototype three-dimensional circuit equipped with functions for parallel processing and judgment processing was fabricated. The image pre-processing which has been impossible on the real time basis in the conventional two-dimensional integrated circuit was realized in a speed as fast as milli-second order. These achievements lead to a belief that the targets for the present research and development have been achieved. (NEDO)}
place = {Japan}
year = {1991}
month = {Apr}
}