You need JavaScript to view this

Microstructure, mechanical properties, and thermoelectric properties of hot-extruded p-type Te-doped Bi{sub 0.5}Sb{sub 1.5}Te{sub 3} compounds

Abstract

The p-type Bi{sub 0.5}Sb{sub 1.5}Te{sub 3} compounds with Te dopant (4.0 and 6.0 wt%) and without dopant were fabricated by hot extrusion in the temperature range of 300 to 510 C under an extrusion ratio of 20:1. The undoped and Te doped compounds were highly dense and showed high crystalline quality. The grains contained many dislocations and were fine equiaxed ({approximately}1.0 {micro}m) owing to the dynamic recrystallization during the extrusion. The hot extrusion gave rise to the preferred orientation of grains. The bending strength and the figure of merit of the undoped and Te doped compounds were increased with increasing the extrusion temperature. The Te dopant significantly increased the figure of merit. The values of the figure of merit of the undoped and 4.0 wt% Te-doped compounds hot extruded at 440 C were 2.11 x 10{sup {minus}3}/K and 2.94 x 10{sup {minus}3}/K, respectively.
Publication Date:
Jul 01, 1997
Product Type:
Conference
Reference Number:
EDB-00:007292
Resource Relation:
Conference: 1997 Materials Research Society Spring Meeting, San Francisco, CA (US), 03/31/1997--04/03/1997; Other Information: Single article reprints are available through University Microfilms Inc., 300 North Zeeb Road, Ann Arbor, Michigan 48106; PBD: 1997; Related Information: In: Thermoelectric materials -- New directions and approaches. Materials Research Society symposium proceedings, Volume 478, by Tritt, T.M.; Kanatzidis, M.G.; Lyon, H.B. Jr.; Mahan, G.D. [eds.], 359 pages.
Subject:
30 DIRECT ENERGY CONVERSION; 36 MATERIALS SCIENCE; THERMOELECTRIC MATERIALS; MICROSTRUCTURE; MECHANICAL PROPERTIES; THERMOELECTRIC PROPERTIES; SEMICONDUCTOR MATERIALS; DOPED MATERIALS; BISMUTH TELLURIDES; ANTIMONY TELLURIDES; EXPERIMENTAL DATA; TEMPERATURE DEPENDENCE
Sponsoring Organizations:
Korea Ministry of Information and Communication
OSTI ID:
20014251
Research Organizations:
Chung-ju National Univ., Chungbuk (KR)
Country of Origin:
United States
Language:
English
Other Identifying Numbers:
Other: ISBN 1-55899-382-7; TRN: IM200012%%179
Availability:
Materials Research Society, 506 Keystone Drive, Warrendale, PA 15086 (US); $71.00. Prices may become outdated.
Submitting Site:
DELTA
Size:
page(s) 139-144
Announcement Date:

Citation Formats

Park, K, Seo, J, and Lee, C. Microstructure, mechanical properties, and thermoelectric properties of hot-extruded p-type Te-doped Bi{sub 0.5}Sb{sub 1.5}Te{sub 3} compounds. United States: N. p., 1997. Web.
Park, K, Seo, J, & Lee, C. Microstructure, mechanical properties, and thermoelectric properties of hot-extruded p-type Te-doped Bi{sub 0.5}Sb{sub 1.5}Te{sub 3} compounds. United States.
Park, K, Seo, J, and Lee, C. 1997. "Microstructure, mechanical properties, and thermoelectric properties of hot-extruded p-type Te-doped Bi{sub 0.5}Sb{sub 1.5}Te{sub 3} compounds." United States.
@misc{etde_20014251,
title = {Microstructure, mechanical properties, and thermoelectric properties of hot-extruded p-type Te-doped Bi{sub 0.5}Sb{sub 1.5}Te{sub 3} compounds}
author = {Park, K, Seo, J, and Lee, C}
abstractNote = {The p-type Bi{sub 0.5}Sb{sub 1.5}Te{sub 3} compounds with Te dopant (4.0 and 6.0 wt%) and without dopant were fabricated by hot extrusion in the temperature range of 300 to 510 C under an extrusion ratio of 20:1. The undoped and Te doped compounds were highly dense and showed high crystalline quality. The grains contained many dislocations and were fine equiaxed ({approximately}1.0 {micro}m) owing to the dynamic recrystallization during the extrusion. The hot extrusion gave rise to the preferred orientation of grains. The bending strength and the figure of merit of the undoped and Te doped compounds were increased with increasing the extrusion temperature. The Te dopant significantly increased the figure of merit. The values of the figure of merit of the undoped and 4.0 wt% Te-doped compounds hot extruded at 440 C were 2.11 x 10{sup {minus}3}/K and 2.94 x 10{sup {minus}3}/K, respectively.}
place = {United States}
year = {1997}
month = {Jul}
}