Abstract
The vapor cloud produced by a magnetron sputtering gun in the vacuum chamber is not uniform. In order to coat substrates within a desired tolerance of thickness uniformity, a `flattening` of the vapor flux distribution is required. This is achieved by means of mechanical masks which intercept the vapor cloud, by a carefully designed motion of the substrate through the vapor cloud, or by a combination of both. The present work describes a design method for masks, to be used with planar substrates, and its application in the case of a Varian S-GUN magnetron sputtering gun. By using the mask the coating thickness uniformity on large ring shaped flat substrates, 200 mm wide, has been improved from {+-}35% to {+-}9% around the mean value of the thickness. (author).
Citation Formats
Admon, U, Berko, A, Yahav, B, and Lavi, S.
Design of masks to obtain coating uniformity on planar substrates by magnetron sputtering.
Israel: N. p.,
1991.
Web.
Admon, U, Berko, A, Yahav, B, & Lavi, S.
Design of masks to obtain coating uniformity on planar substrates by magnetron sputtering.
Israel.
Admon, U, Berko, A, Yahav, B, and Lavi, S.
1991.
"Design of masks to obtain coating uniformity on planar substrates by magnetron sputtering."
Israel.
@misc{etde_10157200,
title = {Design of masks to obtain coating uniformity on planar substrates by magnetron sputtering}
author = {Admon, U, Berko, A, Yahav, B, and Lavi, S}
abstractNote = {The vapor cloud produced by a magnetron sputtering gun in the vacuum chamber is not uniform. In order to coat substrates within a desired tolerance of thickness uniformity, a `flattening` of the vapor flux distribution is required. This is achieved by means of mechanical masks which intercept the vapor cloud, by a carefully designed motion of the substrate through the vapor cloud, or by a combination of both. The present work describes a design method for masks, to be used with planar substrates, and its application in the case of a Varian S-GUN magnetron sputtering gun. By using the mask the coating thickness uniformity on large ring shaped flat substrates, 200 mm wide, has been improved from {+-}35% to {+-}9% around the mean value of the thickness. (author).}
place = {Israel}
year = {1991}
month = {Jan}
}
title = {Design of masks to obtain coating uniformity on planar substrates by magnetron sputtering}
author = {Admon, U, Berko, A, Yahav, B, and Lavi, S}
abstractNote = {The vapor cloud produced by a magnetron sputtering gun in the vacuum chamber is not uniform. In order to coat substrates within a desired tolerance of thickness uniformity, a `flattening` of the vapor flux distribution is required. This is achieved by means of mechanical masks which intercept the vapor cloud, by a carefully designed motion of the substrate through the vapor cloud, or by a combination of both. The present work describes a design method for masks, to be used with planar substrates, and its application in the case of a Varian S-GUN magnetron sputtering gun. By using the mask the coating thickness uniformity on large ring shaped flat substrates, 200 mm wide, has been improved from {+-}35% to {+-}9% around the mean value of the thickness. (author).}
place = {Israel}
year = {1991}
month = {Jan}
}