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Properties of chipboard

Abstract

Density, permeability, porosity, water absorption and swelling characteristics have been assessed for chipboard made out of saw dust and an adhesive. Results indicated that permeability increases as porosity increases and both decrease with increase in board density. Permeability, 1/{alpha} and porosity, p were found to relate to the density, {rho} as follows: 1/{alpha} = Ae{sup a{rho}} and p = Be{sup b{rho}} while porosity and permeability were found to follow the relation: p = C(1/{alpha}){sup d}. It was also found that the lower the board density, the higher its water absorption and swelling. Thermal conductivity, specific heat and calorific value were also assessed. Results revealed that thermal conductivity increases nonlinearly with increasing density, while it decreases linearly with increasing porosity. Specific heat also increases linearly with increasing density and temperature. However, calorific value was found to be independent of density. Mechanical properties increase as the density increases except for the penetration depth. It was found that the tensile strength, modulus of rupture, shear strength, hardness, resistance to cutting and impact strength vary linearly with the density, while the degree of elasticity has a nonlinear relation with the density. The board is generally stronger in bending than in compression and tension in  More>>
Authors:
Publication Date:
Mar 01, 1993
Product Type:
Technical Report
Report Number:
IC-92/433
Reference Number:
SCA: 360606; PA: AIX-24:044572; SN: 93000988693
Resource Relation:
Other Information: PBD: Mar 1993
Subject:
36 MATERIALS SCIENCE; BUILDING MATERIALS; MECHANICAL PROPERTIES; PHYSICAL PROPERTIES; ADHESIVES; CALORIFIC VALUE; DENSITY; HARDNESS; IMPACT STRENGTH; PERMEABILITY; POROSITY; SHEAR PROPERTIES; SPECIFIC HEAT; SWELLING; TENSILE PROPERTIES; THERMAL CONDUCTIVITY; 360606
OSTI ID:
10151827
Research Organizations:
International Centre for Theoretical Physics (ICTP), Trieste (Italy)
Country of Origin:
IAEA
Language:
English
Other Identifying Numbers:
Other: ON: DE93624496; TRN: XA9334116044572
Availability:
OSTI; NTIS (US Sales Only); INIS
Submitting Site:
INIS
Size:
[50] p.
Announcement Date:
Jul 05, 2005

Citation Formats

Baryeh, E A. Properties of chipboard. IAEA: N. p., 1993. Web.
Baryeh, E A. Properties of chipboard. IAEA.
Baryeh, E A. 1993. "Properties of chipboard." IAEA.
@misc{etde_10151827,
title = {Properties of chipboard}
author = {Baryeh, E A}
abstractNote = {Density, permeability, porosity, water absorption and swelling characteristics have been assessed for chipboard made out of saw dust and an adhesive. Results indicated that permeability increases as porosity increases and both decrease with increase in board density. Permeability, 1/{alpha} and porosity, p were found to relate to the density, {rho} as follows: 1/{alpha} = Ae{sup a{rho}} and p = Be{sup b{rho}} while porosity and permeability were found to follow the relation: p = C(1/{alpha}){sup d}. It was also found that the lower the board density, the higher its water absorption and swelling. Thermal conductivity, specific heat and calorific value were also assessed. Results revealed that thermal conductivity increases nonlinearly with increasing density, while it decreases linearly with increasing porosity. Specific heat also increases linearly with increasing density and temperature. However, calorific value was found to be independent of density. Mechanical properties increase as the density increases except for the penetration depth. It was found that the tensile strength, modulus of rupture, shear strength, hardness, resistance to cutting and impact strength vary linearly with the density, while the degree of elasticity has a nonlinear relation with the density. The board is generally stronger in bending than in compression and tension in descending order of strength. (author). 18 refs, figs.}
place = {IAEA}
year = {1993}
month = {Mar}
}