Abstract
Hard-drawn polycrystalline copper wires of 99.9% purity and grain size ranging from 90 to 125{mu}m produced by Kabelmetal (Ghana) Ltd. have been creep tested within the temperature range of 0.42 to 0.57 T{sub m} at atmospheric pressure under uniaxial stress of 7.08 to 21.24 MPa. The stress exponent, n, determined ranges from 2.0 to 2.4 and the activation energy, {Delta}H, ranges from 61.3 to 63.2 kJmol{sup -1}. It was observed that n decreased with temperature and {Delta}H decreased with stress. The deformation mechanism is attributed to grain boundary sliding and the self-diffusion of copper atoms within the grain boundary calculated on the Cobble model ranges from 2.2 x 10{sup -11} cm{sup 2} s{sup -1} to 2.2 x 10{sup -10} cm{sup 2} s{sup -1}. (author). 6 refs, 5 figs, 3 tabs.
Citation Formats
Ayensu, A, Quainoo, G K, and Adjepong, S K.
Grain boundary creep in copper.
IAEA: N. p.,
1992.
Web.
Ayensu, A, Quainoo, G K, & Adjepong, S K.
Grain boundary creep in copper.
IAEA.
Ayensu, A, Quainoo, G K, and Adjepong, S K.
1992.
"Grain boundary creep in copper."
IAEA.
@misc{etde_10118694,
title = {Grain boundary creep in copper}
author = {Ayensu, A, Quainoo, G K, and Adjepong, S K}
abstractNote = {Hard-drawn polycrystalline copper wires of 99.9% purity and grain size ranging from 90 to 125{mu}m produced by Kabelmetal (Ghana) Ltd. have been creep tested within the temperature range of 0.42 to 0.57 T{sub m} at atmospheric pressure under uniaxial stress of 7.08 to 21.24 MPa. The stress exponent, n, determined ranges from 2.0 to 2.4 and the activation energy, {Delta}H, ranges from 61.3 to 63.2 kJmol{sup -1}. It was observed that n decreased with temperature and {Delta}H decreased with stress. The deformation mechanism is attributed to grain boundary sliding and the self-diffusion of copper atoms within the grain boundary calculated on the Cobble model ranges from 2.2 x 10{sup -11} cm{sup 2} s{sup -1} to 2.2 x 10{sup -10} cm{sup 2} s{sup -1}. (author). 6 refs, 5 figs, 3 tabs.}
place = {IAEA}
year = {1992}
month = {Oct}
}
title = {Grain boundary creep in copper}
author = {Ayensu, A, Quainoo, G K, and Adjepong, S K}
abstractNote = {Hard-drawn polycrystalline copper wires of 99.9% purity and grain size ranging from 90 to 125{mu}m produced by Kabelmetal (Ghana) Ltd. have been creep tested within the temperature range of 0.42 to 0.57 T{sub m} at atmospheric pressure under uniaxial stress of 7.08 to 21.24 MPa. The stress exponent, n, determined ranges from 2.0 to 2.4 and the activation energy, {Delta}H, ranges from 61.3 to 63.2 kJmol{sup -1}. It was observed that n decreased with temperature and {Delta}H decreased with stress. The deformation mechanism is attributed to grain boundary sliding and the self-diffusion of copper atoms within the grain boundary calculated on the Cobble model ranges from 2.2 x 10{sup -11} cm{sup 2} s{sup -1} to 2.2 x 10{sup -10} cm{sup 2} s{sup -1}. (author). 6 refs, 5 figs, 3 tabs.}
place = {IAEA}
year = {1992}
month = {Oct}
}