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Grain boundary creep in copper

Technical Report:

Abstract

Hard-drawn polycrystalline copper wires of 99.9% purity and grain size ranging from 90 to 125{mu}m produced by Kabelmetal (Ghana) Ltd. have been creep tested within the temperature range of 0.42 to 0.57 T{sub m} at atmospheric pressure under uniaxial stress of 7.08 to 21.24 MPa. The stress exponent, n, determined ranges from 2.0 to 2.4 and the activation energy, {Delta}H, ranges from 61.3 to 63.2 kJmol{sup -1}. It was observed that n decreased with temperature and {Delta}H decreased with stress. The deformation mechanism is attributed to grain boundary sliding and the self-diffusion of copper atoms within the grain boundary calculated on the Cobble model ranges from 2.2 x 10{sup -11} cm{sup 2} s{sup -1} to 2.2 x 10{sup -10} cm{sup 2} s{sup -1}. (author). 6 refs, 5 figs, 3 tabs.
Publication Date:
Oct 01, 1992
Product Type:
Technical Report
Report Number:
IC-92/327
Reference Number:
SCA: 360103; PA: AIX-24:005227; SN: 93000930428
Resource Relation:
Other Information: PBD: Oct 1992
Subject:
36 MATERIALS SCIENCE; COPPER; CREEP; GRAIN BOUNDARIES; STRAINS; TEMPERATURE DEPENDENCE; TEMPERATURE RANGE 0400-1000 K; THERMAL STRESSES; 360103; MECHANICAL PROPERTIES
OSTI ID:
10118694
Research Organizations:
International Centre for Theoretical Physics (ICTP), Trieste (Italy)
Country of Origin:
IAEA
Language:
English
Other Identifying Numbers:
Other: ON: DE93610974; TRN: XA9233106005227
Availability:
OSTI; NTIS (US Sales Only); INIS
Submitting Site:
INIS
Size:
[12] p.
Announcement Date:
Jun 30, 2005

Technical Report:

Citation Formats

Ayensu, A, Quainoo, G K, and Adjepong, S K. Grain boundary creep in copper. IAEA: N. p., 1992. Web.
Ayensu, A, Quainoo, G K, & Adjepong, S K. Grain boundary creep in copper. IAEA.
Ayensu, A, Quainoo, G K, and Adjepong, S K. 1992. "Grain boundary creep in copper." IAEA.
@misc{etde_10118694,
title = {Grain boundary creep in copper}
author = {Ayensu, A, Quainoo, G K, and Adjepong, S K}
abstractNote = {Hard-drawn polycrystalline copper wires of 99.9% purity and grain size ranging from 90 to 125{mu}m produced by Kabelmetal (Ghana) Ltd. have been creep tested within the temperature range of 0.42 to 0.57 T{sub m} at atmospheric pressure under uniaxial stress of 7.08 to 21.24 MPa. The stress exponent, n, determined ranges from 2.0 to 2.4 and the activation energy, {Delta}H, ranges from 61.3 to 63.2 kJmol{sup -1}. It was observed that n decreased with temperature and {Delta}H decreased with stress. The deformation mechanism is attributed to grain boundary sliding and the self-diffusion of copper atoms within the grain boundary calculated on the Cobble model ranges from 2.2 x 10{sup -11} cm{sup 2} s{sup -1} to 2.2 x 10{sup -10} cm{sup 2} s{sup -1}. (author). 6 refs, 5 figs, 3 tabs.}
place = {IAEA}
year = {1992}
month = {Oct}
}