Abstract
We have developed the Microstrip Gas Chamber (MSGC) by using Multi-Chiptechnology which supports high-density assembly of bare LSI chips on a silicon wafer. Our MSGC was operated steadily with {approx} 10{sup 3} gain more than one week. An energy resolution of 15% for 5.9 keV X-ray of {sup 55}Fe source was obtained. With a very thin polyimide substrate of 16 {mu}m thickness, two interesting phenomena were observed; one was a strong dependence of gains on back plane potential, and the other was little time variation of gains. We also found that a guard mask of a thin polyimide layer on the cathode edge reduced incidental electrical discharges between anode and cathode strips. (author).
Citation Formats
Nagae, T, Tanimori, T, Kobayashi, T, and Miyagi, T.
Development of Microstrip Gas Chambers with Multi-Chip technology.
Japan: N. p.,
1992.
Web.
Nagae, T, Tanimori, T, Kobayashi, T, & Miyagi, T.
Development of Microstrip Gas Chambers with Multi-Chip technology.
Japan.
Nagae, T, Tanimori, T, Kobayashi, T, and Miyagi, T.
1992.
"Development of Microstrip Gas Chambers with Multi-Chip technology."
Japan.
@misc{etde_10111123,
title = {Development of Microstrip Gas Chambers with Multi-Chip technology}
author = {Nagae, T, Tanimori, T, Kobayashi, T, and Miyagi, T}
abstractNote = {We have developed the Microstrip Gas Chamber (MSGC) by using Multi-Chiptechnology which supports high-density assembly of bare LSI chips on a silicon wafer. Our MSGC was operated steadily with {approx} 10{sup 3} gain more than one week. An energy resolution of 15% for 5.9 keV X-ray of {sup 55}Fe source was obtained. With a very thin polyimide substrate of 16 {mu}m thickness, two interesting phenomena were observed; one was a strong dependence of gains on back plane potential, and the other was little time variation of gains. We also found that a guard mask of a thin polyimide layer on the cathode edge reduced incidental electrical discharges between anode and cathode strips. (author).}
place = {Japan}
year = {1992}
month = {Mar}
}
title = {Development of Microstrip Gas Chambers with Multi-Chip technology}
author = {Nagae, T, Tanimori, T, Kobayashi, T, and Miyagi, T}
abstractNote = {We have developed the Microstrip Gas Chamber (MSGC) by using Multi-Chiptechnology which supports high-density assembly of bare LSI chips on a silicon wafer. Our MSGC was operated steadily with {approx} 10{sup 3} gain more than one week. An energy resolution of 15% for 5.9 keV X-ray of {sup 55}Fe source was obtained. With a very thin polyimide substrate of 16 {mu}m thickness, two interesting phenomena were observed; one was a strong dependence of gains on back plane potential, and the other was little time variation of gains. We also found that a guard mask of a thin polyimide layer on the cathode edge reduced incidental electrical discharges between anode and cathode strips. (author).}
place = {Japan}
year = {1992}
month = {Mar}
}