TY - JOUR TI - Application of 'SPICE' to predict temperature distribution in heat pipes AB - This article presents a new alternative approach to predict temperature distribution in heat pipes. In this method, temperature distribution in a heat pipe, modelled as an analogous electrical circuit, is predicted by applying SPICE, a general-purpose circuit simulation program. SPICE is used to simulate electrical circuit designs before the prototype is assembled. Useful predictions are obtained for heat pipes with and without adiabatic sections and for heat pipes with various evaporator and condenser lengths. Comparison of the predicted results with experiments demonstrates fairly good agreement. It is also shown how interdisciplinary developments could be used appropriately. (author). AU - "Li, H M" AU - "Liu, Y" AU - "Damodaran, M [Nanyang Technological Univ., Singapore (SG). School of Mechanical and Production Engineering]" KW - "42 ENGINEERING" KW - "HEAT PIPES" KW - "S CODES" KW - "TEMPERATURE DISTRIBUTION" KW - "HEAT TRANSFER" KW - "MATHEMATICAL MODELS" KW - "COMPUTER CODES" KW - "ENERGY TRANSFER" KW - "420400* - Engineering- Heat Transfer & Fluid Flow" DO - https://doi.org/10.1016/0017-9310(91)90253-B UR - PB - CY - United Kingdom PY - 1991 DA - 1991-11-01 LA - English J2 - [] VL - 34:11 C1 - C2 - C3 - C4 - C5 - L3 - Journal Name: International Journal of Heat and Mass Transfer; (United Kingdom); Journal Volume: 34:11 ER -