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	       <dc:title>Microstructure and magnetic properties of micro NiFe alloy arrays for MEMS application</dc:title>
	       <dc:creator>Li, Zhongliang; Sun, Xuming; Zheng, Yang; Zhang, Haixia [National Key Laboratory of Science and Technology on Micro/Nano fabrication, Institute of Microelectronics, Peking University, Beijing 100871 (China)]</dc:creator>
	       <dc:subject>75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; COERCIVE FORCE; COMPARATIVE EVALUATIONS; ELECTRODEPOSITION; FCC LATTICES; FILMS; GEOMETRY; IRON ALLOYS; MAGNETIC PROPERTIES; MAGNETIZATION; MEMS; MICROSTRUCTURE; NICKEL ALLOYS; PERMEABILITY; SATURATION; SHAPE</dc:subject>
	       <dc:subjectRelated></dc:subjectRelated>
	       <dc:description>NiFe alloy arrays with various geometry sizes and shapes were designed, fabricated and investigated. Electrodeposition was introduced as a highly effective integrated method to fabricate the alloy film. The influence of dimensional size and geometry shape of the array unit was discussed. With decreasing size, the soft magnetic properties of the samples are improved with a 78.6% decrease of coercivity and an 65.0% decrease of squareness ratio. Compared with square and rectangular arrays, circular arrays exhibit smaller coercivity, higher permeability and smaller squareness ratio. Additionally, different compositional arrays were also tested for their crystal structures. It is found that the alloy with a content of Ni{sub 80}Fe{sub 20} can achieve a face-centered cubic structure and realize the best soft magnetic properties. A coercivity of 0.383 Oe, a squareness ratio of 4.21 × 10{sup −4} and a saturation magnetization of 4.2 T have been successfully achieved in circular arrays within an area of 2000 × 2000 µm{sup 2}. (paper)</dc:description>
	       <dcq:publisher></dcq:publisher>
	       <dcq:publisherResearch></dcq:publisherResearch>
	       <dcq:publisherAvailability>Available from http://dx.doi.org/10.1088/0960-1317/23/8/085013</dcq:publisherAvailability>
	       <dcq:publisherSponsor></dcq:publisherSponsor>
	       <dcq:publisherCountry>United Kingdom</dcq:publisherCountry>
		   <dc:contributingOrganizations></dc:contributingOrganizations>
	       <dc:date>2013-08-01</dc:date>
	       <dc:language>English</dc:language>
	       <dc:type>Journal Article</dc:type>
	       <dcq:typeQualifier></dcq:typeQualifier>
	       <dc:relation>Journal Name: Journal of Micromechanics and Microengineering. Structures, Devices and Systems; Journal Volume: 23; Journal Issue: 8; Other Information: Country of input: International Atomic Energy Agency (IAEA)</dc:relation>
	       <dc:coverage></dc:coverage>
	       <dc:format>Medium: X; Size: [8 page(s)]</dc:format>
	       <dc:doi>https://doi.org/10.1088/0960-1317/23/8/085013</dc:doi>
	       <dc:identifier></dc:identifier>
		   <dc:journalName>[]</dc:journalName>
		   <dc:journalIssue>8</dc:journalIssue>
		   <dc:journalVolume>23</dc:journalVolume>
	       <dc:identifierReport></dc:identifierReport>
	       <dcq:identifierDOEcontract></dcq:identifierDOEcontract>
	       <dc:identifierOther>Journal ID: ISSN 0960-1317; CODEN: JMMIEZ; TRN: GB13I5325057750</dc:identifierOther>
	       <dc:source>INIS</dc:source>
	       <dc:rights></dc:rights>
	       <dc:dateEntry>2016-05-30</dc:dateEntry>
	       <dc:dateAdded></dc:dateAdded>
	       <dc:ostiId>22487766</dc:ostiId>
	       <dcq:identifier-purl></dcq:identifier-purl>
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