Electrically disbondable compositions and related methods
Abstract
Compositions capable of rapidly curing to a strong substrate bond are removable from a surface to which the composition is bonded without damage to the underlying substrates. The compositions of the present invention may be used in both temporary and permanent bonding and coating applications.
- Inventors:
-
- Brookline, NH
- Issue Date:
- Research Org.:
- EIC Laboratories, Inc. (Norwood, MA)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 985712
- Patent Number(s):
- 7465492
- Application Number:
- 11/435,622
- Assignee:
- EIC Laboratories, Inc. (Norwood, MA)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
C - CHEMISTRY C09 - DYES C09J - ADHESIVES
- DOE Contract Number:
- FG02-05ER84227
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
Citation Formats
Gilbert, Michael D. Electrically disbondable compositions and related methods. United States: N. p., 2008.
Web.
Gilbert, Michael D. Electrically disbondable compositions and related methods. United States.
Gilbert, Michael D. Tue .
"Electrically disbondable compositions and related methods". United States. https://www.osti.gov/servlets/purl/985712.
@article{osti_985712,
title = {Electrically disbondable compositions and related methods},
author = {Gilbert, Michael D},
abstractNote = {Compositions capable of rapidly curing to a strong substrate bond are removable from a surface to which the composition is bonded without damage to the underlying substrates. The compositions of the present invention may be used in both temporary and permanent bonding and coating applications.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 16 00:00:00 EST 2008},
month = {Tue Dec 16 00:00:00 EST 2008}
}
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Reworkable Epoxies: Thermosets with Thermally Cleavable Groups for Controlled Network Breakdown
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- Yang, Shu; Chen, Jir-Shyr; Körner, Hilmar
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