Packaging of electro-microfluidic devices
Abstract
A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
- Inventors:
-
- Albuquerque, NM
- Tijeras, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 874697
- Patent Number(s):
- 6443179
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL B01L - CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
F - MECHANICAL ENGINEERING F15 - FLUID-PRESSURE ACTUATORS F15C - FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- packaging; electro-microfluidic; devices; architecture; surface; micromachined; relies; scales; bring; fluid; device; scale; picoliters; macro-scale; microliters; emulates; utilizes; electronics; technology; larger; package; consists; circuit; board; embedded; fluidic; channels; standard; connectors; printed; wiring; connect; dual-inline-package; emdip; takes; microfluidic; integrated; mic; connection; bosch-etched; holes; front; electrical; bond; pads; integrated circuit; electrical connection; microfluidic devices; /137/285/
Citation Formats
Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, and Watson, Robert D. Packaging of electro-microfluidic devices. United States: N. p., 2002.
Web.
Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, & Watson, Robert D. Packaging of electro-microfluidic devices. United States.
Benavides, Gilbert L, Galambos, Paul C, Emerson, John A, Peterson, Kenneth A, Giunta, Rachel K, and Watson, Robert D. Tue .
"Packaging of electro-microfluidic devices". United States. https://www.osti.gov/servlets/purl/874697.
@article{osti_874697,
title = {Packaging of electro-microfluidic devices},
author = {Benavides, Gilbert L and Galambos, Paul C and Emerson, John A and Peterson, Kenneth A and Giunta, Rachel K and Watson, Robert D},
abstractNote = {A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 01 00:00:00 EST 2002},
month = {Tue Jan 01 00:00:00 EST 2002}
}
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