Plates for vacuum thermal fusion
Abstract
A process for effectively bonding arbitrary size or shape substrates. The process incorporates vacuum pull down techniques to ensure uniform surface contact during the bonding process. The essence of the process for bonding substrates, such as glass, plastic, or alloys, etc., which have a moderate melting point with a gradual softening point curve, involves the application of an active vacuum source to evacuate interstices between the substrates while at the same time providing a positive force to hold the parts to be bonded in contact. This enables increasing the temperature of the bonding process to ensure that the softening point has been reached and small void areas are filled and come in contact with the opposing substrate. The process is most effective where at least one of the two plates or substrates contain channels or grooves that can be used to apply vacuum between the plates or substrates during the thermal bonding cycle. Also, it is beneficial to provide a vacuum groove or channel near the perimeter of the plates or substrates to ensure bonding of the perimeter of the plates or substrates and reduce the unbonded regions inside the interior region of the plates or substrates.
- Inventors:
-
- Livermore, CA
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- OSTI Identifier:
- 874352
- Patent Number(s):
- 6372328
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C03 - GLASS C03B - MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- plates; vacuum; thermal; fusion; process; effectively; bonding; arbitrary; size; shape; substrates; incorporates; pull; techniques; ensure; uniform; surface; contact; essence; glass; plastic; alloys; etc; moderate; melting; gradual; softening; curve; involves; application; active; source; evacuate; interstices; time; providing; positive; force; hold; bonded; enables; increasing; temperature; reached; void; filled; opposing; substrate; effective; contain; channels; grooves; apply; cycle; beneficial; provide; groove; channel; near; perimeter; reduce; unbonded; regions; inside; interior; region; bonding process; surface contact; /428/
Citation Formats
Davidson, James C, and Balch, Joseph W. Plates for vacuum thermal fusion. United States: N. p., 2002.
Web.
Davidson, James C, & Balch, Joseph W. Plates for vacuum thermal fusion. United States.
Davidson, James C, and Balch, Joseph W. Tue .
"Plates for vacuum thermal fusion". United States. https://www.osti.gov/servlets/purl/874352.
@article{osti_874352,
title = {Plates for vacuum thermal fusion},
author = {Davidson, James C and Balch, Joseph W},
abstractNote = {A process for effectively bonding arbitrary size or shape substrates. The process incorporates vacuum pull down techniques to ensure uniform surface contact during the bonding process. The essence of the process for bonding substrates, such as glass, plastic, or alloys, etc., which have a moderate melting point with a gradual softening point curve, involves the application of an active vacuum source to evacuate interstices between the substrates while at the same time providing a positive force to hold the parts to be bonded in contact. This enables increasing the temperature of the bonding process to ensure that the softening point has been reached and small void areas are filled and come in contact with the opposing substrate. The process is most effective where at least one of the two plates or substrates contain channels or grooves that can be used to apply vacuum between the plates or substrates during the thermal bonding cycle. Also, it is beneficial to provide a vacuum groove or channel near the perimeter of the plates or substrates to ensure bonding of the perimeter of the plates or substrates and reduce the unbonded regions inside the interior region of the plates or substrates.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 01 00:00:00 EST 2002},
month = {Tue Jan 01 00:00:00 EST 2002}
}