Method for improving performance of highly stressed electrical insulating structures
Abstract
Removing the electrical field from the internal volume of high-voltage structures; e.g., bushings, connectors, capacitors, and cables. The electrical field is removed from inherently weak regions of the interconnect, such as between the center conductor and the solid dielectric, and places it in the primary insulation. This is accomplished by providing a conductive surface on the inside surface of the principal solid dielectric insulator surrounding the center conductor and connects the center conductor to this conductive surface. The advantage of removing the electric fields from the weaker dielectric region to a stronger area improves reliability, increases component life and operating levels, reduces noise and losses, and allows for a smaller compact design. This electric field control approach is currently possible on many existing products at a modest cost. Several techniques are available to provide the level of electric field control needed. Choosing the optimum technique depends on material, size, and surface accessibility. The simplest deposition method uses a standard electroless plating technique, but other metalization techniques include vapor and energetic deposition, plasma spraying, conductive painting, and other controlled coating methods.
- Inventors:
-
- Modesto, CA
- Brentwood, CA
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- OSTI Identifier:
- 874206
- Patent Number(s):
- 6340497
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01B - CABLES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01R - ELECTRICALLY-CONDUCTIVE CONNECTIONS
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- method; improving; performance; highly; stressed; electrical; insulating; structures; removing; field; internal; volume; high-voltage; bushings; connectors; capacitors; cables; removed; inherently; weak; regions; interconnect; center; conductor; solid; dielectric; primary; insulation; accomplished; providing; conductive; surface; inside; principal; insulator; surrounding; connects; advantage; electric; fields; weaker; region; stronger; improves; reliability; increases; component; life; operating; levels; reduces; noise; losses; allows; compact; design; control; approach; currently; existing; products; modest; cost; techniques; available; provide; level; choosing; optimum; technique; depends; material; size; accessibility; simplest; deposition; standard; electroless; plating; metalization; vapor; energetic; plasma; spraying; painting; controlled; coating; methods; electric field; inside surface; plasma spray; internal volume; improving performance; /427/174/
Citation Formats
Wilson, Michael J, and Goerz, David A. Method for improving performance of highly stressed electrical insulating structures. United States: N. p., 2002.
Web.
Wilson, Michael J, & Goerz, David A. Method for improving performance of highly stressed electrical insulating structures. United States.
Wilson, Michael J, and Goerz, David A. Tue .
"Method for improving performance of highly stressed electrical insulating structures". United States. https://www.osti.gov/servlets/purl/874206.
@article{osti_874206,
title = {Method for improving performance of highly stressed electrical insulating structures},
author = {Wilson, Michael J and Goerz, David A},
abstractNote = {Removing the electrical field from the internal volume of high-voltage structures; e.g., bushings, connectors, capacitors, and cables. The electrical field is removed from inherently weak regions of the interconnect, such as between the center conductor and the solid dielectric, and places it in the primary insulation. This is accomplished by providing a conductive surface on the inside surface of the principal solid dielectric insulator surrounding the center conductor and connects the center conductor to this conductive surface. The advantage of removing the electric fields from the weaker dielectric region to a stronger area improves reliability, increases component life and operating levels, reduces noise and losses, and allows for a smaller compact design. This electric field control approach is currently possible on many existing products at a modest cost. Several techniques are available to provide the level of electric field control needed. Choosing the optimum technique depends on material, size, and surface accessibility. The simplest deposition method uses a standard electroless plating technique, but other metalization techniques include vapor and energetic deposition, plasma spraying, conductive painting, and other controlled coating methods.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 01 00:00:00 EST 2002},
month = {Tue Jan 01 00:00:00 EST 2002}
}