Enhanced adhesion for LIGA microfabrication by using a buffer layer
Abstract
The present invention is an improvement on the LIGA microfabrication process wherein a buffer layer is applied to the upper or working surface of a substrate prior to the placement of a resist onto the surface of the substrate. The buffer layer is made from an inert low-Z material (low atomic weight), a material that absorbs secondary X-rays emissions from the substrate that are generated from the substrate upon exposure to a primary X-rays source. Suitable materials for the buffer layer include polyamides and polyimide. The preferred polyimide is synthesized form pyromellitic anhydride and oxydianiline (PMDA-ODA).
- Inventors:
-
- San Jose, CA
- Darien, IL
- Naperville, IL
- Issue Date:
- Research Org.:
- Argonne National Laboratory (ANL), Argonne, IL (United States)
- OSTI Identifier:
- 873943
- Patent Number(s):
- 6277539
- Assignee:
- United States of America as represented by United States Department (Washington, DC)
- Patent Classifications (CPCs):
-
G - PHYSICS G03 - PHOTOGRAPHY G03F - PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- DOE Contract Number:
- W-31109-ENG-38
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- enhanced; adhesion; liga; microfabrication; buffer; layer; improvement; process; applied; upper; surface; substrate; prior; placement; resist; inert; low-z; material; atomic; weight; absorbs; secondary; x-rays; emissions; generated; exposure; primary; source; suitable; materials; polyamides; polyimide; preferred; synthesized; form; pyromellitic; anhydride; oxydianiline; pmda-oda; atomic weight; primary x-rays; low-z material; suitable material; buffer layer; fabrication process; secondary x-rays; suitable materials; substrate prior; enhanced adhesion; liga microfabrication; /430/
Citation Formats
Bajikar, Sateesh S, De Carlo, Francesco, and Song, Joshua J. Enhanced adhesion for LIGA microfabrication by using a buffer layer. United States: N. p., 2001.
Web.
Bajikar, Sateesh S, De Carlo, Francesco, & Song, Joshua J. Enhanced adhesion for LIGA microfabrication by using a buffer layer. United States.
Bajikar, Sateesh S, De Carlo, Francesco, and Song, Joshua J. Mon .
"Enhanced adhesion for LIGA microfabrication by using a buffer layer". United States. https://www.osti.gov/servlets/purl/873943.
@article{osti_873943,
title = {Enhanced adhesion for LIGA microfabrication by using a buffer layer},
author = {Bajikar, Sateesh S and De Carlo, Francesco and Song, Joshua J},
abstractNote = {The present invention is an improvement on the LIGA microfabrication process wherein a buffer layer is applied to the upper or working surface of a substrate prior to the placement of a resist onto the surface of the substrate. The buffer layer is made from an inert low-Z material (low atomic weight), a material that absorbs secondary X-rays emissions from the substrate that are generated from the substrate upon exposure to a primary X-rays source. Suitable materials for the buffer layer include polyamides and polyimide. The preferred polyimide is synthesized form pyromellitic anhydride and oxydianiline (PMDA-ODA).},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Jan 01 00:00:00 EST 2001},
month = {Mon Jan 01 00:00:00 EST 2001}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
LIGA fabrication of mm-wave accelerating cavity structures at the Advanced Photon Source (APS)
conference, January 1998
- Song, J. J.; Bajikar, S.; Kang, Y. W.
- Proceedings of the 1997 Particle Accelerator Conference (Cat. No.97CH36167)
Adhesion problems in deep-etch x-ray lithography caused by fluorescence radiation from the plating base
journal, January 1994
- Pantenburg, F. J.; Chlebek, J.; El-Kholi, A.
- Microelectronic Engineering, Vol. 23, Issue 1-4