Capacitance pressure sensor
Abstract
A microelectromechanical (MEM) capacitance pressure sensor integrated with electronic circuitry on a common substrate and a method for forming such a device are disclosed. The MEM capacitance pressure sensor includes a capacitance pressure sensor formed at least partially in a cavity etched below the surface of a silicon substrate and adjacent circuitry (CMOS, BiCMOS, or bipolar circuitry) formed on the substrate. By forming the capacitance pressure sensor in the cavity, the substrate can be planarized (e.g. by chemical-mechanical polishing) so that a standard set of integrated circuit processing steps can be used to form the electronic circuitry (e.g. using an aluminum or aluminum-alloy interconnect metallization).
- Inventors:
-
- Tijeras, NM
- Albuquerque, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 872803
- Patent Number(s):
- 6012336
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- capacitance; pressure; sensor; microelectromechanical; integrated; electronic; circuitry; common; substrate; method; forming; device; disclosed; formed; partially; cavity; etched; below; surface; silicon; adjacent; cmos; bicmos; bipolar; planarized; chemical-mechanical; polishing; standard; set; circuit; processing; steps; form; aluminum; aluminum-alloy; interconnect; metallization; chemical-mechanical polishing; common substrate; capacitance pressure; electronic circuit; silicon substrate; integrated circuit; electronic circuitry; pressure sensor; processing steps; processing step; cavity etched; mechanical polishing; /73/
Citation Formats
Eaton, William P, Staple, Bevan D, and Smith, James H. Capacitance pressure sensor. United States: N. p., 2000.
Web.
Eaton, William P, Staple, Bevan D, & Smith, James H. Capacitance pressure sensor. United States.
Eaton, William P, Staple, Bevan D, and Smith, James H. Sat .
"Capacitance pressure sensor". United States. https://www.osti.gov/servlets/purl/872803.
@article{osti_872803,
title = {Capacitance pressure sensor},
author = {Eaton, William P and Staple, Bevan D and Smith, James H},
abstractNote = {A microelectromechanical (MEM) capacitance pressure sensor integrated with electronic circuitry on a common substrate and a method for forming such a device are disclosed. The MEM capacitance pressure sensor includes a capacitance pressure sensor formed at least partially in a cavity etched below the surface of a silicon substrate and adjacent circuitry (CMOS, BiCMOS, or bipolar circuitry) formed on the substrate. By forming the capacitance pressure sensor in the cavity, the substrate can be planarized (e.g. by chemical-mechanical polishing) so that a standard set of integrated circuit processing steps can be used to form the electronic circuitry (e.g. using an aluminum or aluminum-alloy interconnect metallization).},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Jan 01 00:00:00 EST 2000},
month = {Sat Jan 01 00:00:00 EST 2000}
}
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Works referenced in this record:
Characterization of a surface micromachined pressure sensor array
conference, September 1995
- Eaton, William P.; Smith, James H.
- Micromachining and Microfabrication, SPIE Proceedings
CMOS-compatible surface-micromachined pressure sensor for aqueous ultrasonic application
conference, May 1995
- Eaton, William P.; Smith, James H.
- Smart Structures & Materials '95, SPIE Proceedings
A surface micromachined silicon accelerometer with on-chip detection circuitry
journal, October 1994
- Kuehnel, Wolfgang; Sherman, Steven
- Sensors and Actuators A: Physical, Vol. 45, Issue 1, p. 7-16
Planar surface-micromachined pressure sensor with a sub-surface, embedded reference pressure cavity
report, September 1996
- Eaton, W. P.; Smith, J. H.
- SAND--96-1985C