Electronic circuits having NiAl and Ni.sub.3 Al substrates
Abstract
An electronic circuit component having improved mechanical properties and thermal conductivity comprises NiAl and/or Ni.sub.3 Al, upon which an alumina layer is formed prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.
- Inventors:
-
- Midlothian, VA
- Oak Ridge, TN
- Issue Date:
- Research Org.:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- OSTI Identifier:
- 872577
- Patent Number(s):
- 5965274
- Assignee:
- Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- AC05-84OR21400
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- electronic; circuits; nial; substrates; circuit; component; improved; mechanical; properties; thermal; conductivity; comprises; alumina; layer; formed; prior; applying; conductive; elements; additional; layers; copper-aluminum; alloy; copper; improve; strength; circuit component; additional layers; electronic circuit; improved mechanical; thermal conductivity; mechanical properties; mechanical strength; aluminum alloy; alumina layer; electronic circuits; conductive elements; improve mechanical; formed prior; additional layer; conductivity comprises; /428/
Citation Formats
Deevi, Seetharama C, and Sikka, Vinod K. Electronic circuits having NiAl and Ni.sub.3 Al substrates. United States: N. p., 1999.
Web.
Deevi, Seetharama C, & Sikka, Vinod K. Electronic circuits having NiAl and Ni.sub.3 Al substrates. United States.
Deevi, Seetharama C, and Sikka, Vinod K. Fri .
"Electronic circuits having NiAl and Ni.sub.3 Al substrates". United States. https://www.osti.gov/servlets/purl/872577.
@article{osti_872577,
title = {Electronic circuits having NiAl and Ni.sub.3 Al substrates},
author = {Deevi, Seetharama C and Sikka, Vinod K},
abstractNote = {An electronic circuit component having improved mechanical properties and thermal conductivity comprises NiAl and/or Ni.sub.3 Al, upon which an alumina layer is formed prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Fri Jan 01 00:00:00 EST 1999},
month = {Fri Jan 01 00:00:00 EST 1999}
}
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