Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material
Abstract
Electrophoretically active sol-gel processes to fill, seal, and/or density porous, flawed, and/or cracked coatings on electrically conductive substrates. Such coatings may be dielectrics, ceramics, or semiconductors and, by the present invention, may have deposited onto and into them sol-gel ceramic precursor compounds which are subsequently converted to sol-gel ceramics to yield composite materials with various tailored properties.
- Inventors:
-
- Sandia Park, NM
- Albuquerque, NM
- Issue Date:
- Research Org.:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- OSTI Identifier:
- 872392
- Patent Number(s):
- 5925228
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- electrophoretically; active; sol-gel; processes; backfill; seal; densify; porous; flawed; cracked; coatings; electrically; conductive; material; fill; density; substrates; dielectrics; ceramics; semiconductors; deposited; ceramic; precursor; compounds; subsequently; converted; yield; composite; materials; various; tailored; properties; sol-gel process; conductive substrate; composite materials; conductive material; electrically conductive; composite material; ceramic precursor; precursor compounds; subsequently converted; sol-gel processes; precursor compound; composite mat; electrophoretically active; cracked coatings; omposite materials; active sol-gel; /204/
Citation Formats
Panitz, Janda K, Reed, Scott T, Ashley, Carol S, Neiser, Richard A, and Moffatt, William C. Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material. United States: N. p., 1999.
Web.
Panitz, Janda K, Reed, Scott T, Ashley, Carol S, Neiser, Richard A, & Moffatt, William C. Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material. United States.
Panitz, Janda K, Reed, Scott T, Ashley, Carol S, Neiser, Richard A, and Moffatt, William C. Fri .
"Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material". United States. https://www.osti.gov/servlets/purl/872392.
@article{osti_872392,
title = {Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material},
author = {Panitz, Janda K and Reed, Scott T and Ashley, Carol S and Neiser, Richard A and Moffatt, William C},
abstractNote = {Electrophoretically active sol-gel processes to fill, seal, and/or density porous, flawed, and/or cracked coatings on electrically conductive substrates. Such coatings may be dielectrics, ceramics, or semiconductors and, by the present invention, may have deposited onto and into them sol-gel ceramic precursor compounds which are subsequently converted to sol-gel ceramics to yield composite materials with various tailored properties.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Fri Jan 01 00:00:00 EST 1999},
month = {Fri Jan 01 00:00:00 EST 1999}
}
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