Solder for oxide layer-building metals and alloys
Abstract
A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The comosition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than aproximatley 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300.degree. C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.
- Inventors:
-
- 108 Independent Blvd., Aiken, SC 29801
- Issue Date:
- Research Org.:
- Savannah River Site (SRS), Aiken, SC (United States)
- OSTI Identifier:
- 868464
- Patent Number(s):
- 5147471
- Assignee:
- Kronberg, James W. (108 Independent Blvd., Aiken, SC 29801)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
- DOE Contract Number:
- AC09-89SR18035
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- solder; oxide; layer-building; metals; alloys; temperature; method; soldering; metal; aluminum; titanium; tantalum; stainless; steel; comosition; comprises; zinc; germanium; wetting; agent; preferably; amounts; copper; antimony; grit; silicon; carbide; abrades; layer; formed; surface; penetrates; beneath; loosens; provide; metal-to-metal; contact; aproximatley; 10; weight; composition; provides; sufficient; action; result; melting; approximately; 300; degree; steps; rubbing; heating; begins; melt; brushing; aside; loosened; metal contact; provides sufficient; layer formed; metal surface; melting temperature; method comprises; stainless steel; silicon carbide; oxide layer; wetting agent; method comprise; metal-to-metal contact; oxide layer-building; temperature solder; /420/148/
Citation Formats
Kronberg, James W. Solder for oxide layer-building metals and alloys. United States: N. p., 1992.
Web.
Kronberg, James W. Solder for oxide layer-building metals and alloys. United States.
Kronberg, James W. Wed .
"Solder for oxide layer-building metals and alloys". United States. https://www.osti.gov/servlets/purl/868464.
@article{osti_868464,
title = {Solder for oxide layer-building metals and alloys},
author = {Kronberg, James W},
abstractNote = {A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The comosition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than aproximatley 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300.degree. C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Jan 01 00:00:00 EST 1992},
month = {Wed Jan 01 00:00:00 EST 1992}
}