Modular package for cooling a laser diode array
Abstract
A laser diode array is disclosed that includes a plurality of planar packages and active cooling. The laser diode array may be operated in a long duty cycle, or in continuous operation. A laser diode bar and a microchannel heat sink are thermally coupled in a compact, thin planar package having the laser diode bar located proximate to one edge. In an array, a number of such thin planar packages are secured together in a stacked configuration, in close proximity so that the laser diodes are spaced closely. The cooling means includes a microchannel heat sink that is attached proximate to the laser bar so that it absorbs heat generated by laser operation. To provide the coolant to the microchannels, each thin planar package comprises a thin inlet manifold and a thin outlet manifold connected to an inlet corridor and an outlet corridor. The inlet corridor comprises a hole extending through each of the packages in the array, and the outlet corridor comprises a hole extending through each of the packages in the array. The inlet and outlet corridors are connected to a conventional coolant circulation system. The laser diode array with active cooling has application as an optical pumpmore »
- Inventors:
-
- Stockton, CA
- Livermore, CA
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- OSTI Identifier:
- 868245
- Patent Number(s):
- 5105429
- Assignee:
- United States of America as represented by Department of Energy (Washington, DC)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01S - DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- modular; package; cooling; laser; diode; array; disclosed; plurality; planar; packages; active; operated; duty; cycle; continuous; operation; bar; microchannel; heat; sink; thermally; coupled; compact; located; proximate; edge; secured; stacked; configuration; close; proximity; diodes; spaced; closely; means; attached; absorbs; generated; provide; coolant; microchannels; comprises; inlet; manifold; outlet; connected; corridor; extending; corridors; conventional; circulation; application; optical; pump; power; solid; lasers; incorporated; equipment; communications; devices; sensors; military; space; applications; useful; constraints; energy; limitations; stacked configuration; space applications; active cooling; outlet manifold; absorbs heat; power solid; diode bar; optical pump; laser bar; laser operation; inlet manifold; laser diodes; cooling means; continuous operation; close proximity; heat sink; laser diode; diode array; duty cycle; heat generated; thermally coupled; microchannel heat; space constraints; planar package; package comprises; spaced close; spaced closely; active sensors; located proximate; channel heat; coolant circulation; /372/257/
Citation Formats
Mundinger, David C, Benett, William J, and Beach, Raymond J. Modular package for cooling a laser diode array. United States: N. p., 1992.
Web.
Mundinger, David C, Benett, William J, & Beach, Raymond J. Modular package for cooling a laser diode array. United States.
Mundinger, David C, Benett, William J, and Beach, Raymond J. Wed .
"Modular package for cooling a laser diode array". United States. https://www.osti.gov/servlets/purl/868245.
@article{osti_868245,
title = {Modular package for cooling a laser diode array},
author = {Mundinger, David C and Benett, William J and Beach, Raymond J},
abstractNote = {A laser diode array is disclosed that includes a plurality of planar packages and active cooling. The laser diode array may be operated in a long duty cycle, or in continuous operation. A laser diode bar and a microchannel heat sink are thermally coupled in a compact, thin planar package having the laser diode bar located proximate to one edge. In an array, a number of such thin planar packages are secured together in a stacked configuration, in close proximity so that the laser diodes are spaced closely. The cooling means includes a microchannel heat sink that is attached proximate to the laser bar so that it absorbs heat generated by laser operation. To provide the coolant to the microchannels, each thin planar package comprises a thin inlet manifold and a thin outlet manifold connected to an inlet corridor and an outlet corridor. The inlet corridor comprises a hole extending through each of the packages in the array, and the outlet corridor comprises a hole extending through each of the packages in the array. The inlet and outlet corridors are connected to a conventional coolant circulation system. The laser diode array with active cooling has application as an optical pump for high power solid state lasers. Further, it can be incorporated in equipment such as communications devices and active sensors, and in military and space applications, and it can be useful in applications having space constraints and energy limitations.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Jan 01 00:00:00 EST 1992},
month = {Wed Jan 01 00:00:00 EST 1992}
}
Works referenced in this record:
Laser Diode Cooling For High Average Power Applications
conference, June 1989
- Mundinger, D.; Beach, R.; Benett, W.
- OE/LASE '89, 15-20 Jan., Los Angeles. CA, SPIE Proceedings
High-performance heat sinking for VLSI
journal, May 1981
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- IEEE Electron Device Letters, Vol. 2, Issue 5
A Compact High Intensity Cooler (CHIC)
conference, July 1983
- Bland, T. J.; Niggemann, R. E.; Parekh, M. B.
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Hybrid approach to two‐dimensional surface‐emitting diode laser arrays
journal, September 1988
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- Applied Physics Letters, Vol. 53, Issue 11
High‐reliability silicon microchannel submount for high average power laser diode arrays
journal, May 1990
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- Applied Physics Letters, Vol. 56, Issue 21