Electronic-carrier-controlled photochemical etching process in semiconductor device fabrication
Abstract
An electronic-carrier-controlled photochemical etching process for carrying out patterning and selective removing of material in semiconductor device fabrication includes the steps of selective ion implanting, photochemical dry etching, and thermal annealing, in that order. In the selective ion implanting step, regions of the semiconductor material in a desired pattern are damaged and the remainder of the regions of the material not implanted are left undamaged. The rate of recombination of electrons and holes is increased in the damaged regions of the pattern compared to undamaged regions. In the photochemical dry etching step which follows ion implanting step, the material in the undamaged regions of the semiconductor are removed substantially faster than in the damaged regions representing the pattern, leaving the ion-implanted, damaged regions as raised surface structures on the semiconductor material. After completion of photochemical dry etching step, the thermal annealing step is used to restore the electrical conductivity of the damaged regions of the semiconductor material.
- Inventors:
-
- Edgewood, NM
- Albuquerque, NM
- Issue Date:
- Research Org.:
- AT&T
- OSTI Identifier:
- 867171
- Patent Number(s):
- 4880493
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- DOE Contract Number:
- AC04-76DP00789
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- electronic-carrier-controlled; photochemical; etching; process; semiconductor; device; fabrication; carrying; patterning; selective; removing; material; steps; implanting; dry; thermal; annealing; step; regions; desired; pattern; damaged; remainder; implanted; left; undamaged; rate; recombination; electrons; holes; increased; compared; follows; removed; substantially; faster; representing; leaving; ion-implanted; raised; surface; structures; completion; restore; electrical; conductivity; device fabrication; thermal annealing; dry etching; etching process; chemical etching; semiconductor material; semiconductor device; electrical conductivity; annealing step; desired pattern; photochemical etching; electronic-carrier-controlled photochemical; surface structure; controlled ph; /438/
Citation Formats
Ashby, Carol I. H., Myers, David R, and Vook, Frederick L. Electronic-carrier-controlled photochemical etching process in semiconductor device fabrication. United States: N. p., 1989.
Web.
Ashby, Carol I. H., Myers, David R, & Vook, Frederick L. Electronic-carrier-controlled photochemical etching process in semiconductor device fabrication. United States.
Ashby, Carol I. H., Myers, David R, and Vook, Frederick L. Sun .
"Electronic-carrier-controlled photochemical etching process in semiconductor device fabrication". United States. https://www.osti.gov/servlets/purl/867171.
@article{osti_867171,
title = {Electronic-carrier-controlled photochemical etching process in semiconductor device fabrication},
author = {Ashby, Carol I. H. and Myers, David R and Vook, Frederick L},
abstractNote = {An electronic-carrier-controlled photochemical etching process for carrying out patterning and selective removing of material in semiconductor device fabrication includes the steps of selective ion implanting, photochemical dry etching, and thermal annealing, in that order. In the selective ion implanting step, regions of the semiconductor material in a desired pattern are damaged and the remainder of the regions of the material not implanted are left undamaged. The rate of recombination of electrons and holes is increased in the damaged regions of the pattern compared to undamaged regions. In the photochemical dry etching step which follows ion implanting step, the material in the undamaged regions of the semiconductor are removed substantially faster than in the damaged regions representing the pattern, leaving the ion-implanted, damaged regions as raised surface structures on the semiconductor material. After completion of photochemical dry etching step, the thermal annealing step is used to restore the electrical conductivity of the damaged regions of the semiconductor material.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sun Jan 01 00:00:00 EST 1989},
month = {Sun Jan 01 00:00:00 EST 1989}
}