Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors
Abstract
A standard thin film circuit containing Ta.sub.2 N (100 ohms/square) resirs is fabricated by depositing on a dielectric substrate successive layers of Ta.sub.2 N, Ti and Pd, with a gold layer to provide conductors. The addition of a few simple photoprocessing steps to the standeard TFN manufacturing process enables the formation of Ta.sub.2 N+Ti (10 ohms/square) and Ta.sub.2 N+Ti+Pd (1 ohm/square) resistors in the same otherwise standard thin film circuit structure.
- Inventors:
-
- Albuquerque, NM
- Issue Date:
- Research Org.:
- AT&T
- OSTI Identifier:
- 866838
- Patent Number(s):
- 4801469
- Assignee:
- United States of America as represented by Department of Energy (Washington, DC)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01C - RESISTORS
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC04-76DP00789
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- process; obtaining; multiple; sheet; resistances; film; hybrid; microcircuit; resistors; standard; circuit; containing; 100; ohms; square; resirs; fabricated; depositing; dielectric; substrate; successive; layers; pd; gold; layer; provide; conductors; addition; simple; photoprocessing; steps; standeard; tfn; manufacturing; enables; formation; 10; ohm; otherwise; structure; manufacturing process; processing steps; successive layers; process enables; successive layer; processing step; hybrid microcircuit; circuit structure; multiple sheet; film circuit; film hybrid; dielectric substrate; /427/29/338/
Citation Formats
Norwood, David P. Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors. United States: N. p., 1989.
Web.
Norwood, David P. Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors. United States.
Norwood, David P. Sun .
"Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors". United States. https://www.osti.gov/servlets/purl/866838.
@article{osti_866838,
title = {Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors},
author = {Norwood, David P},
abstractNote = {A standard thin film circuit containing Ta.sub.2 N (100 ohms/square) resirs is fabricated by depositing on a dielectric substrate successive layers of Ta.sub.2 N, Ti and Pd, with a gold layer to provide conductors. The addition of a few simple photoprocessing steps to the standeard TFN manufacturing process enables the formation of Ta.sub.2 N+Ti (10 ohms/square) and Ta.sub.2 N+Ti+Pd (1 ohm/square) resistors in the same otherwise standard thin film circuit structure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sun Jan 01 00:00:00 EST 1989},
month = {Sun Jan 01 00:00:00 EST 1989}
}
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